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NOISE in PRINTED CIRCUIT BOARDS
 

However beautiful the strategy, you should occasionally look at the results”

 (Sir Winston Churchill)

  1. Funato H., Suga T., Suhara M.: Application of a Cavity Resonator Model for Characterization and Estimation of Radiation From a PCB-Chassis System. IEEE Trans on EMC, Vol. 56, no. 2, 2014, pp. 475 – 451. DOI 10.1109/TEMC.2013.2280657

  2. Preibisch J.B., Duan X., Schuster C.: An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method. IEEE Trans on EMC, Vol. 56, no. 4, 2014, pp. 980 – 989. DOI 10.1109/TEMC.2013.2292095

  3. Iida Michihira, Maeno Tsuyoshi, Fujiwara Osamu: Effect of Ground Pattern Size on FM-Band Crosstalk Between Two Parallel Signal Traces of Printed Circuit Boards for Vehicles. Electrical Eng. in Japan, Vol. 186, no. 1, 2014, pp. 11 – 17. DOI 10.1002/eej.22316

  4. Reusch D., Strydom J.: Understanding the effect of PCB layout on circuit performance in a high frequency gallium nitride based point of load converter. IEEE Trans. on Power Electronics, Vol. 29, no. 4, 2014, pp. 2008 – 2015. DOI 10.1109/TPEL.2013.2266103

  5. Bamiedakis N., Hashim A., Beals J., Penty R.V., White I.H.: Low-Cost PCB-Integrated 10-Gb/s Optical Transceiver Built With a Novel Integration Method. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 4, 2013, pp. 592 – 600. DOI 10.1109/TCPMT.2013.2242961

  6. Chenyan Liu, Weiwei Hu, Yufeng Sun: Sensitivity analysis of PCB's design parameters of the plated through hole. Int. Conf. on Quality, Reliability, Risk, Maintenance, and Safety Eng. (QR2MSE), 2013, pp. 489 – 492. DOI 10.1109/QR2MSE.2013.6625629

  7. Shi Ling-Feng, Wang Hai-Peng, Cheng Li-Ye, Meng Chen , Cai Cheng-Shan: Multilayer EBG Structure for Ultra-Wide Band SSN Mitigation Using Embedded Spiral-Shaped Planes. Int. J. of RF and Microwave Computer-Aided Engineering, Vol. 23, no. 2, 2013, pp. 217 – 224. DOI 10.1002/mmce.20667

  8. Jiwei Wen, Weiping Jing: Signal-power integrity co-simulations of high speed systems via chip-package-PCB co-analysis methodology. Int. Conf. on Electronic Packaging Technology (ICEPT), 2013, pp. 485 – 491. DOI 10.1109/ICEPT.2013.6756518

  9. Soonwan Chung, Gyun Heo, Jae Kwak, Seunghee Oh, Yongwon Lee, Changsun Kang, Tackmo Lee: Development of PCB design guide and PCB deformation simulation tool for slim PCB quality and reliability. IEEE Electronic Components and Technology Conf. (ECTC), 2013, pp. 2157 – 2162. DOI 10.1109/ECTC.2013.6575879

  10. Takbiri M., Masoumi N., Mehri M., Daie Koozehkanani Z.: Crosstalk reduction using open-loop resonators for printed circuit boards traces. Mediterranean Microwave Symp (MMS), 2013, pp. 1 – 4. DOI 10.1109/MMS.2013.6663093

  11. Shuai Jin, Ji Zhang, Jun Fan: Optimization of the transition from connector to PCB board. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2013, pp. 192 – 196. DOI 10.1109/ISEMC.2013.6670407

  12. Ruaro A., Thaysen J., Jakobsen K.B.: Mitigation of unwanted forward narrow-band radiation from PCBs with a metamaterial unit cell. European Microwave Conf. (EuMC), 2013, pp. 939 – 942. http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6686813&isnumber=6686544

  13. Chen, Hsiao-Chung, Bai, Ying-Wen: Improvement of high current density PCB design on a high end server system. IEEE Int. Symp. on Industrial Electronics (ISIE), 2013, pp.1 – 4. DOI 10.1109/ISIE.2013.6563820

  14. Marques Andre Canal Cabrera, Jose-Maria Malfatti, Celia de Fraga: Printed circuit boards: A review on the perspective of sustainability. J. of Environmental Management, Vol. 131, 2013, pp. 298 – 306. DOI 10.1016/j.jenvman.2013.10.003

  15. McCreary C. A., Lail B. A.: Determining Minimum Printed Circuit Board Trace Dimensions for Transient Suppression Circuits. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 11, 2013, pp. 1876 – 1888. DOI 10.1109/TCPMT.2013.2271704

  16. Hao-Ran Zhu, Jian-Jie Li, Jun-Fa Mao: Ultra-Wideband Suppression of SSN Using Localized Topology With CSRRs and Embedded Capacitance in High-Speed Circuits. IEEE Trans on MTT, Vol. 61, no. 2, 2013, pp 764 – 772. DOI 10.1109/TMTT.2012.2231695

  17. Myunghoi Kim, Kyoungchoul Koo, Yujeong Shim, Chulsoon Hwang, Jun So Pak, Seungyoung Ahn, Joungho Kim: Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs. IEEE Trans on EMC, Vol. 55, no. 2, 2013, pp 307 – 314. DOI 10.1109/TEMC.2012.2216883

  18. Devabhaktuni V., Bunting C.F., Green D., Kvale D., Mareddy L., Rajamani V.: A New ANN-Based Modeling Approach for Rapid EMI/EMC Analysis of PCB and Shielding Enclosures. IEEE Trans on EMC, Vol. 55, no. 2, 2013, pp. 385 – 394. DOI 10.1109/TEMC.2012.2214223

  19. Wu T.-L., Buesink F., Canavero F.: Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 624 – 638. DOI 10.1109/TEMC.2013.2257796

  20. Choi J.: Ultimate noise isolation in high-speed digital systems on packages and printed circuit boards. Electronics Lett., Vol. 49, no. 9, 2013, pp. 594 – 595. DOI 10.1049/el.2012.4303

  21. Yongrong Shi, Wanchun Tang, Sheng Liu, Xin Rao, Chow Y.L.: Ultra-Wideband Suppression of Power/Ground Noise in High-Speed Circuits Using a Novel Electromagnetic Bandgap Power Plane. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 4, 2013, pp. 653 – 660. DOI 10.1109/TCPMT.2012.2235529

  22. Kong Fan, Sheng Weixing, Wang Hao, Wu Jing, Ma Xiaofeng: Signal integrity analysis for high-speed circuit PCB interconnection with an efficient full wave method. Int. J. of RF and Microwave Computer-Aided Engineering, Vol. 23, no. 5, 2013, pp. 586 – 597. DOI: 10.1002/mmce.20693

  23. Zhu Hao-Ran, Mao Jun-Fa: Localized Planar EBG Structure of CSRR for Ultrawideband SSN Mitigation and Signal Integrity Improvement in Mixed-Signal Systems. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 12, 2013,  pp. 2092 – 2100.   DOI 10.1109/TCPMT.2013.2272788

  24. Wang Chuen-De, Chang Yu-Jen, Lu Yi-Chang, Peng-Shu Chen, Wei-Chung Lo, Yih-Peng Chiou, Tzong-Lin Wu : ABF-Based TSV Arrays With Improved Signal Integrity on 3-D IC/Interposers: Equivalent Models and Experiments. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3,  no. 10, 2013, pp. 1744 – 1753.  DOI 10.1109/TCPMT.2013.2254174

  25. Hashim A., Bamiedakis N., Beals J., Penty R.V., White I.H.: Cost-effective 10 Gb/s polymer-based chip-to-chip optical interconnect. IET Optoelectronics, Vol. 6, no. 3, 2012, pp 140 – 146. DOI 10.1049/iet-opt.2012.0003

  26. F de Paulis, M. H. Nisanci, A. Orlandi: Signal Integrity. IEEE Electromagnetic Compat. Magazine, Vol. 1 , no. 3, 2012, pp. 60 – 65. DOI 10.1109/MEMC.2012.6347053

  27. He X., Hubing T. H.: A Closed-Form Expression for Estimating the Maximum Radiated Emissions From a Heatsink on a Printed Circuit Board. IEEE Trans on Electromagnetic Compatibility, 2012, Vol. 54, no. 1, pp. 205 – 211. DOI 10.1109/TEMC.2011.2169248

  28. Su C., Hubing T. H.: Calculating Radiated Emissions Due to I/O Line Coupling on Printed Circuit Boards Using the Imbalance Difference Method. IEEE Trans on Electromagnetic Compatibility, Vol. 54, no. 1, 2012, pp. 212 – 217. DOI 10.1109/TEMC.2011.2168565

  29. Bait-Suwailam M. M., Ramahi O. M. : Ultrawideband Mitigation of Simultaneous Switching Noise and EMI Reduction in High-Speed PCBs Using Complementary Split-Ring Resonators. IEEE Trans on Electromagnetic Compatibility, Vol. 54, no 2, 2012, pp. 389 – 396. DOI 10.1109/TEMC.2011.2163940

  30. Mandic T., Gillon R., Nauwelaers B., Baric A.: Characterizing the TEM Cell Electric and Magnetic Field Coupling to PCB Transmission Lines. IEEE Trans on EMC, Vol. 54, no. 5, 2012, pp. 976 – 985. DOI 10.1109/TEMC.2012.2193888

  31. Lozano-Guerrero A.J., Monzo-Cabrera J., Clemente-Fernandez F.J., Fayo-Fernandez J., Pedreno-Molina J.L., Diaz-Morcillo A.: Electromagnetic Equivalent Models for Printed Circuit Boards Inside a Metallic Enclosure Using a Coaxial-to-Waveguide Transition Calibration. IEEE Trans on EMC, Vol. 54, no. 4, 2012, pp. 931 – 939. DOI 10.1109/TEMC.2012.2184120

  32. Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang, Yujeong Shim, Joungho Kim, Jonghoon Kim: A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs. IEEE Trans on EMC, Vol. 54, no. 3, 2012, pp. 689 – 695. DOI 10.1109/TEMC.2012.2187662

  33. Koul A., Koledintseva M.Y., Hinaga S., Drewniak J.L.: Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards. IEEE Trans on EMC, Vol. 54, no. 2, 2012, pp. 421 – 433. DOI 10.1109/TEMC.2010.2087341

  34. F. de Paulis, A. Orlandi : Accurate and Efficient Analysis of Planar Electromagnetic Band-Gap Structures for Power Bus Noise Mitigation in the GHz Band. Progress in Electromagnetics Research B, Vol. 37, 2012, pp 59 – 80. http://www.jpier.org/PIERB/pierb37/04.11100402.pdf

  35. Hui-Fen Huang, Wei Guo, Qing-Xin Chu: Vein Power Plane for Printed Circuit Board Based on Constructal Theory. IEEE Trans on EMC, Vol. 53, no. 4, 2011, pp. 987 – 995. DOI 10.1109/TEMC.2011.2142418

  36. Visacro S., Alipio R., Murta Vale M.H., Pereira C.: The Response of Grounding Electrodes to Lightning Currents: The Effect of Frequency-Dependent Soil Resistivity and Permittivity. IEEE Trans on EMC, Vol. 53, no. 2, 2011, pp. 401 – 406. DOI 10.1109/TEMC.2011.2106790

  37. Changyi Su, Hubing T.H.: Imbalance Difference Model for Common-Mode Radiation From Printed Circuit Boards. IEEE Trans on EMC, Vol. 53, no. 1, 2011, pp. 150 – 156. DOI 10.1109/TEMC.2010.2049853

  38. Ashish Kumar, Pushek Madaan: Top 10 EMC Design Considerations. Cypress Perform, 2011, pp. 1 – 4. http://www.cypress.com/?docID=28761

  39. Wu Boping, Mo Tingting : Printed circuit board electrical design for wafer-level packaging. 12th Int. Conf. on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011, pp. 1 – 4. DOI 10.1109/ICEPT.2011.6066808

  40. Huadong Li, Subramanyam G.: Closed-Form Expression for the Net Ground Plane Inductance of Coplanar Stripline PCBs. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 2, 2011, pp. 531 – 533. DOI 10.1109/TEMC.2011.2107577

  41. Su C., Hubing T. H.: Improvements to a Method for Estimating the Maximum Radiated Emissions From PCBs With Cables. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 4, 2011, pp.1087 – 1091. DOI 10.1109/TEMC.2011.2165217

  42. Xinbo He, Hubing T., Haixin Ke, Kobayashi N., Morishita K., Harada T.: Calculation of Optimal Ground Post Resistance for Reducing Emissions from Chassis-Mounted Printed Circuit Boards. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 2, 2011, pp. 475 – 481. DOI 10.1109/TEMC.2011.2104375

  43. Rao P.H., Swaminathan M. A.: Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low Radiation. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 4, 2011, pp. 996 – 1004. DOI 10.1109/TEMC.2011.2156408

  44. Moongilan D.: Method for direct interconnection of PCB power layer to chassis to minimize radiated emissions. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2011, pp. 173 – 178. DOI 10.1109/ISEMC.2011.6038305

  45. Sudo Toshio: Experiments and simulation of electromagnetic radiation due to power bus structure in a printed circuit board. Int. Conf. on Electromagnetics in Advanced Applications (ICEAA), 2011, pp. 977 – 980. DOI 10.1109/ICEAA.2011.6046474

  46. De Paulis F., Zhang Yao-Jiang, Fan Jun: Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 1008 – 1018. DOI 10.1109/TEMC.2010.2072784

  47. Vahrenholt V., Brüns H.-D., Singer H.: Fast EMC Analysis of Systems Consisting of PCBs and Metallic Antenna Structures by a Hybridization of PEEC and MoM. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 962 – 973. DOI 10.1109/TEMC.2010.2044577

  48. Taesik Yang, Bayram Y, Volakis J L: Hybrid Analysis of Electromagnetic Interference Effects on Microwave Active Circuits Within Cavity Enclosures. IEEE Trans on EMC, Vol. 52, no 3, 2010, pp 745 – 748. DOI 10.1109/TEMC.2009.2038993

  49. Boping Wu, Leung Tsang: Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics. IEEE Trans. on Advanced Packaging, Vol. 33, no. 2, 2010, pp 510 – 516. DOI 10.1109/TADVP.2009.2026482

  50. Guan-Zong Wu, Yi-Che Chen, Tzong-Lin Wu: Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression. IEEE Trans. on Advanced Packaging, Vol. 33, no. 1, 2010, pp. 206 – 211. DOI 10.1109/TADVP.2009.2034334

  51. H.-S. He, X.-Q. Lai, Q. Ye, Q. Wang, W.-D. Xu, J.-G. Jiang, M.-X. Zang : Wideband SSN Suppression in High-Speed PCB Using Novel Planar EBG. Progress In Electromagnetics Research Letters, Vol. 18, 2010 pp 29 – 39. http://www.jpier.org/PIERL/pierl18/04.10080102.pdf

  52. Chung-Huan Li, , J. Jekkonen, G. Tudosie, N. Chavannes, N. Kuster : Study of Mutual Coupling on Mobile Phone PCB with Shielding using FDTD. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2010, pp 419 – 424. DOI 10.1109/ISEMC.2010.5711311

  53. Gang Feng, Jun Fan: Analysis of Simultaneous Switching Noise Coupling in Multilayer Power/Ground Planes With Segmentation Method and Cavity Model. IEEE Trans on EMC, Vol. 52, no 3, 2010, pp 699 – 711. DOI 10.1109/TEMC.2010.2046665

  54. Xiaomin Duan, Rimolo-Donadio R., Brüns H.-D., Schuster C.: A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 487 – 495. DOI 10.1109/TEMC.2010.2041238

  55. Rogard E., Azanowsky B., Ney M.M: Comparison of Radiation Modeling Techniques Up to 10 GHz—Application on a Microstrip PCB Trace. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 479 – 486. DOI 10.1109/TEMC.2010.2046170

  56. Triverio P., Grivet-Talocia S., Bandinu M., Canavero F. G.: Geometrically Parameterized Circuit Models of Printed Circuit Board Traces Inclusive of Antenna Coupling. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 471 – 478. DOI 10.1109/TEMC.2010.2043256

  57. Xin Tong, Thomas D.W P., Nothofer A., Sewell P., Christopoulos C.: Modeling Electromagnetic Emissions From Printed Circuit Boards in Closed Environments Using Equivalent Dipoles. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 462 – 470. DOI 10.1109/TEMC.2010.2044181

  58. Archambeault B., Brench C., Connor S.: Review of Printed-Circuit-Board Level EMI/EMC Issues and Tools. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 455 – 461. DOI 10.1109/TEMC.2010.2044182

  59. Ndip I., Ohnimus F., Löbbicke K., Bierwirth M., Tschoban C., Guttowski S, Reichl H., Lang K.-D., Henke H.: Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and Boards. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 421 – 435. DOI 10.1109/TEMC.2010.2049069

  60. Hee-do Kang, Hyun Kim, Sang-Gyu Kim, Jong-Gwan Yook: A Localized Enhanced Power Plane Topology for Wideband Suppression of Simultaneous Switching Noise. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 373 – 380. DOI 10.1109/TEMC.2010.2044415

  61. Scogna Ciccomancini A., Orlandi A., Ricchiuti V.: Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap Structures. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 357 – 364. DOI 10.1109/TEMC.2009.2027125

  62. Tzong-Lin Wu, Hao-Hsiang Chuang, Ting-Kuang Wang: Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 346 – 356. DOI 10.1109/TEMC.2009.2039575

  63. Guo-Ping Zou, Er-Ping Li, Xing-Chang Wei, Guang-Xiao Luo, Xiang Cui: A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow Slots. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 340 – 345. DOI 10.1109/TEMC.2010.2042604

  64. Hyun Ho Park, Seung-Hyun Song, Sang-Tae Han, Tae-Sun Jang, Jin-Hwan Jung, Hark-Byeong Park: Estimation of Power Switching Current by Chip-Package-PCB Cosimulation. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 311 – 319. DOI 10.1109/TEMC.2010.2043255

  65. Er-Ping Li, Xing-Chang Wei, Cangellaris A.C., En-Xiao Liu, Yao-Jiang Zhang, D'Amore M., Joungho Kim, Sudo Toshio: Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 248 – 265. DOI 10.1109/TEMC.2010.2048755

  66. Pajovic M.M., Jinghan Yu, Potocnik Z., Bhobe A.: Gigahertz-Range Analysis of Impedance Profile and Cavity Resonances in Multilayered PCBs. IEEE Trans on EMC, Vol. 52, no 1, 2010, pp 179 – 188. DOI 10.1109/TEMC.2009.2033936

  67. Bait-Suwailam M.M., Ramahi O.M.: Simultaneous switching noise mitigation in high-speed circuits using complementary split-ring resonators. Electronics Lett., Vol. 46, no 8, 2010, pp 563 – 564. DOI 10.1049/el.2010.0583

  68. Wei X.-C., Li E.-P.: Integral-Equation Equivalent-Circuit Method for Modeling of Noise Coupling in Multilayered Power Distribution Networks. IEEE Trans on MTT, Vol. 58, no 3, 2010, pp 559 – 565. DOI 10.1109/TMTT.2010.2040405

  69. Baharak Mohajer-Iravani, O. M. Ramahi : Wideband Circuit Model for Planar EBG Structures. IEEE Trans. on Advanced Packaging, Vol. 33, No. 1, 2010, pp 169 – 179. DOI 10.1109/TADVP.2009.2021156

  70. Jinwoo Choi, Govind V., Swaminathan M., Bharath K.: Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN). IEEE Trans. on Advanced Packaging, Vol. 33, no. 1, 2010, pp. 2 – 12. DOI 10.1109/TADVP.2009.2033705

  71. Hee-do Kang, Hyun Kim, Hee-Jo Lee, Jong-Gwan Yook : An enhanced power plane topology using localized spiral resonator for wideband suppression of simultaneous switching noise. IEEE Antennas and Propagation Society Int. Symp. (APSURSI '09), 2009, pp 1 – 4. DOI 10.1109/APS.2009.5171508

  72. Haixin Ke, Morishita K., Hubing T., Kobayashi N., Harada T.: Modeling Radiated Emissions Due to Power Bus Noise From Circuit Boards With Attached Cables. IEEE Trans on EMC, Vol. 51, no 2, 2009, pp 412 – 416. DOI 10.1109/TEMC.2008.2010947

  73. Xu X., Zhao J., Feng Y.: Achieving both wideband mitigation of ground bounce noise and good signal integrity by novel period structure. Electronics Lett., Vol. 45, no 3, 2009, pp 158 – 159. DOI 10.1049/el:20092305

  74. Sharma R., Chakravarty T., Bhattacharyya A.B.: Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks. IEEE Trans on EMC, Vol. 51, no 1, 2009, pp 67 – 77. DOI 10.1109/TEMC.2008.2010054

  75. Barriere P.-A., Laurin J.-J., Goussard Y.: Mapping of Equivalent Currents on High-Speed Digital Printed Circuit Boards Based on Near-Field Measurements. IEEE Trans on EMC, Vol. 51, no 3, part 2, 2009, pp 649 – 658. DOI 10.1109/TEMC.2009.2020297

  76. R. Sharma, T. Chakravarty, A. B. Bhattacharyya: Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks. IEEE Trans on EMC, Vol. 51, no 1, February 2009, pp 67 – 77. DOI 10.1109/TEMC.2008.2010054

  77. Rao P.H.: Hybrid electromagnetic bandgap power plane for ultra-wideband noise suppression. Electronics Lett., Vol. 45, no 19, 2009, pp 981– 982. DOI 10.1049/el.2009.1554

  78. Kim B., Kim D.-W.: Spiral-shaped electromagnetic bandgap structure for simultaneous switching noise suppression. Electronics Lett., Vol. 45, no 5, 2009, pp 255 – 256. DOI 10.1049/el:20092497

  79. Z. Yu, X. Dong, Mix J., Slattery K.,J. Fan: Analysis of noise coupling from printed circuit board to shielding enclosure. Electrical Performance of Electronic Packaging, 2008, pp 159 – 162. DOI 10.1109/EPEP.2008.4675902

  80. Wu J.M., Lo C.W., Huang B.Y., Yang N.K., Li S.C.: PCB Ground-Parasitic Effects on a WiMAX Low-Noise Amplifier RFIC. 5th Int. Conf on Wireless Communications, Networking and Mobile Computing (WiCom '09), 2009, pp. 1 – 3. DOI 10.1109/WICOM.2009.5303276

  81. Q. Chen, S. Kato, K. Sawaya: Estimation of Current Distribution on Multilayer Printed Circuit Board by Near-Field Measurement. IEEE Trans on EMC, Vol. 50, no 2, May 2008, pp 399 – 405. DOI 10.1109/TEMC.2008.921028

  82. S. Deng, T. Hubing, D. Beetner: Estimating Maximum Radiated Emissions From Printed Circuit Boards With an Attached Cable. IEEE Trans on EMC, Vol. 50, no 1, February 2008, pp 215 – 218. DOI 10.1109/TEMC.2007.915288

  83. Gomez-Diaz J.S., Martinez-Mendoza M., Perez-Soler F.J., Quesada-Pereira F., Alvarez-Melcon A.: Practical Implementation of the Spatial Images Technique for the Analysis of Shielded Multilayered Printed Circuits. IEEE Trans on MTT, Vol. 56, no 1, 2008, pp 131 – 141. DOI 10.1109/TMTT.2007.912232

  84. Khan Z.A., Bayram Y., Volakis J.L.: EMI/EMC Measurements and Simulations for Cables and PCBs Enclosed Within Metallic Structures. IEEE Trans on EMC, Vol. 50, no 2, 2008, pp 441 – 445. DOI 10.1109/TEMC.2008.921030

  85. Pajovic M. M.: A Closed-Form Equation for Estimating Capacitance of Signal Vias in Arbitrarily Multilayered PCBs. IEEE Trans on EMC, Vol. 50, no 4, 2008, pp 966 – 973. DOI 10.1109/TEMC.2008.2004606

  86. Eakhwan Song, Jeonghyeon Cho, Woojin Lee, Minchul Shin, Joungho Kim: A Wide-Band Passive Equalizer Design on PCB Based on Near-End Crosstalk and Reflections for 12.5 Gbps Serial Data Transmission. IEEE Microwave and Wireless Components Letters, Vol. 18, no 12, 2008, pp 794 – 796. DOI 10.1109/LMWC.2008.2007702

  87. Zhang M.-S., L, Y.-S., Jia C., Li L.-P.: A Power Plane With Wideband SSN Suppression Using a Multi-Via Electromagnetic Bandgap Structure. IEEE Microwave and Wireless Components Letters, Vol. 17, no 4, 2007, pp 307 – 309. DOI 10.1109/LMWC.2007.892992

  88. Yan Fu, Hubing T.: Analysis of Radiated Emissions From a Printed Circuit Board Using Expert System Algorithms. IEEE Trans on EMC, Vol. 49, no 1, 2007, pp 68 – 75. DOI 10.1109/TEMC.2006.888182

  89. Engin A.E., Bharath K., Swaminathan M.: Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes. IEEE Trans on EMC, Vol. 49, no 2, 2007, pp 441 – 447. DOI 10.1109/TEMC.2007.893331

  90. M. Hampe, V. A. Palanisamy, S. Dickmann: Single Summation Expression for the Impedance of Rectangular PCB Power-Bus Structures Loaded With Multiple Lumped Elements. IEEE Trans on EMC, Vol. 49, no 1, February 2007, pp 58 – 67. DOI 10.1109/TEMC.2006.888188

  91. Zhang M.-S., Li Y.-S., Jia C., Li L.-P.: Signal Integrity Analysis of the Traces in Electromagnetic-Bandgap Structure in High-Speed Printed Circuit Boards and Packages. IEEE Trans on MTT, Vol. 55, no 5, 2007, pp 1054 – 1062. DOI 10.1109/TMTT.2007.895413

  92. Zhang M.-S., Li Y.-S., Jia C., Li L.-P.: Simultaneous Switching Noise Suppression in Printed Circuit Boards Using a Compact 3-D Cascaded Electromagnetic-Bandgap Structure. IEEE Trans on MTT, Vol. 55, no 10, 2007, pp 2200 – 2207. DOI 10.1109/TMTT.2007.906475

  93. Dienot J.M.: Characterisation and simulation of digital device electromagnetic noise under non-ambient temperature conditions. Electronics Lett., Vol. 43, no 20, 2007, pp 1073 – 1074. DOI 10.1049/el:20070495

  94. Chen C.H., Huang W.T., Chou C.T., Lu C.H.: Accurate design methodology to prevent crosstalk. Electronics Lett., Vol. 43, no 3, 2007, pp 149 – 150. http://dx.doi.org/10.1049/el:20072825

  95. Yoshitaka Toyota, Arif Ege Engin, Tae Hong Kim, Madhavan Swaminathan, Kazuhide Uriu : Stopband Prediction with Dispersion Diagram for Electromagnetic Bandgap Structures in Printed Circuit Boards. IEEE Int. Symp. on Electromagnetic Compatibility (EMC 2006), Vol. 3, 2006, pp 807 – 811. DOI 10.1109/ISEMC.2006.1706421

  96. J. Kim, M. D. Rotaru, S. Baek, J. Park, M. K. Iyer, J. Kim: Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards. IEEE Trans on EMC, Vol. 48, no 2, May 2006, pp 319 – 330. DOI 10.1109/TEMC.2006.873865

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