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NOISE in PRINTED CIRCUIT BOARDS
 

However beautiful the strategy, you should occasionally look at the results”

 (Sir Winston Churchill)

  1. Li Xuelian, Du Zhengwei, Li Maokun: Efficient Reciprocity-Based Hybrid Approach for Analyzing Radiated Susceptibility Responses of Multilayer PCBs. IEEE Trans on EMC, Vol. 59, no. 3, 2017, pp. 952 – 961. DOI 10.1109/TEMC.2016.2631566

  2. Kim Sang Kyu, Min Junki, Peterson A.F.: Improving Power Integrity by Using Magnetodielectric Absorbers Along the Perimeters of Printed Circuit Boards. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 6, no. 11, 2016, pp. 1630 – 1637. DOI 10.1109/TCPMT.2016.2615862

  3. Shringarpure Ketan, Pan Siming, Kim Jingook, et al.: Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board. IEEE Trans on EMC, Vol. 58, no. 3, 2016, pp. 849 – 858. DOI 10.1109/TEMC.2016.2535459

  4. Iida Michihira, Maeno Tsuyoshi, Wang Jianqing, et al.: Evaluation of the Effect of Geometrical Configuration on FM-Band Crosstalk Characteristics between Two Parallel Signal Traces Including Their Divided Ground Patterns on Printed Circuit Boards for Vehicles. Electrical Eng. in Japan, Vol. 195, no. 1, 2016, pp. 1 – 9. DOI 10.1002/eej.22814

  5. Xiao Pei, Du Ping-An, Ren Dan, et al.: A Hybrid Method for Calculating the Coupling to PCB Inside a Nested Shielding Enclosure Based on Electromagnetic Topology. IEEE Trans on EMC, Vol. 58, no. 6, 2016, pp. 1701 – 1709. DOI 10.1109/TEMC.2016.2588505

  6. Huang Shaowu, Tsang Leung: Fast Electromagnetic Analysis of Emissions From Printed Circuit Board Using Broadband Green's Function Method. IEEE Trans on EMC, Vol. 58, no. 5, 2016, pp. 1642 – 1652. DOI 10.1109/TEMC.2016.2565584

  7. Tao Tao, Zhao Zhihua, Ma Weiming, et al.: Design of PCB Rogowski Coil and Analysis of Anti-interference Property. IEEE Trans on EMC, Vol. 58, no. 2, 2016, pp. 344 – 355. DOI 10.1109/TEMC.2013.2252906

  8. Chou H.-H., Lee Y.-S.: Experimental investigation and analysis of EMI in stacked I/O connectors of PCB. J. of Electromagnetic Waves & Applications, Vol. 30, no. 2, 2016, pp. 195 – 206. DOI 10.1080/09205071.2015.1099477

  9. Zhu G. Kevin, Thiel W., Bracken J.E.: A Method to Assess the Radiated Susceptibility of Printed Circuit Boards. IEEE Conf. on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2016, pp. 115 – 117. DOI 10.1109/EPEPS.2016.7835431

  10. Kuznetsov Y., Baev A., Gorbunova A., et al.: Localization of the Equivalent Sources on the PCB Surface by Using Ultra-Wideband Time Domain Near-Field Measurements. Proc. of the Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2016, pp. 1 – 6. DOI 10.1109/EMCEurope.2016.7739184

  11. Sangwan Vivek, Kapoor Dipesh, Tan Cher Ming: Simulation of EMI at Design Level for Integrated Circuits. Asia-Pacific Int. Symp. on Electromagnetic Compatibility, 2016, pp. 385 – 387. DOI 10.1109/APEMC.2016.7522745

  12. McDowell A.J., Hubing T.H.: A Compact Implementation of Parasitic Inductance Cancellation for Shunt Capacitor Filters on Multilayer PCBs. IEEE Trans on EMC, Vol. 57, no. 2, 2015, pp. 257 – 263. DOI 10.1109/TEMC.2014.2364990

  13. Koledintseva M.Y., Vincent T., Scogna A.C., Hinaga S.: Method of Effective Roughness Dielectric in a PCB: Measurement and Full-Wave Simulation Verification. IEEE Trans on EMC, Vol. 57, no. 4, 2015, pp. 807 – 814. DOI 10.1109/TEMC.2015.2412113

  14. Yongrong Shi, Wanchun Tang, Sheng Liu, Cheng Wang, Wei Zhuang: Mode Analysis of Miniaturized and Stopband-Enhanced Composite Electromagnetic Bandgap Structure for Power/Ground Noise Suppression. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 532 – 537. DOI 10.1109/TEMC.2014.2387949

  15. Jun Xu, Shuo Wang: Investigating a Guard Trace Ring to Suppress the Crosstalk due to a Clock Trace on a Power Electronics DSP Control Board. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 546 – 554. DOI 10.1109/TEMC.2015.2403289

  16. Xiang F., Li E., Wei X., Jin J.: A Particle Swarm Optimization-Based Approach for Predicting Maximum Radiated Emission from PCBs with Dominant Radiators. IEEE Trans on EMC, Vol. 57, no. 5, 2015, pp. 1197 – 1205. DOI 10.1109/TEMC.2015.2414174

  17. Muller S., Reuschel T., Rimolo-Donadio R., Kwark Y.H., Brun H., Schuster C.: Energy-Aware Signal Integrity Analysis for High-Speed PCB Links. IEEE Trans on EMC, Vol. 57, no. 5, 2015, pp. 1226 – 1234. DOI 10.1109/TEMC.2015.2427362

  18. Myunghoi Kim: A Compact EBG Structure With Wideband Power/Ground Noise Suppression Using Meander-Perforated Plane. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 595 – 598. DOI 10.1109/TEMC.2015.2405615

  19. Mehri M., Masoumi N., Rashed-Mohassel J.: Trace Orientation Function for Statistical Prediction of PCB Radiated Susceptibility and Emission. IEEE Trans on EMC, Vol. 57, no. 5, 2015, pp. 1168 – 1178. DOI 10.1109/TEMC.2015.2414353

  20. Jeong In Hwan, Lee Jae W., Cho Choon S., et al.: An averaged estimation of field strength into an enclosed large cavity with PCB board. Microwave & Optical Techn. Lett., Vol. 57, no. 9, 2015, pp. 2029 – 2031. DOI 10.1002/mop.29257

  21. Bae Bumhee, Kim Jonghoon J., Kim Sukjin, et al.: Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 329 – 338. DOI 10.1109/TEMC.2015.2402687

  22. Wu Chun-Te, Chu Po-Yi, Hsiao Sung-Ling, et al.: An Equation-Based Method for Calculating Electromagnetic Interference on Printed Circuit Board. Asia-Pacific Int. Symp. on Electromagnetic Compatibility, 2015, pp. 121 – 123. DOI 10.1109/APEMC.2015.7175284

  23. Berzoy A., Mohamed A.A.S., Mohammed O.A.: Optimum Positioning of Inductive Components on PCB Designs for EMI Reduction using a 3D Finite Elements and Genetic Algorithms. 31st Int. Review of Progress in Applied Computational Electromagnetics, 2015.

  24. Al Salameh, Mohammed S.H.: Edge Finite Elements - Neural Networks Modelling for Crosstalk in Electronic Printed Circuit Boards. World Congress on Information Technology and Computer Applications (WCITCA), 2015. DOI 10.1109/WCITCA.2015.7442653

  25. Eunkyeong Park, Hyungsoo Kim, Jongjoo Shim, Yong-Ju Kim, Yun-Saing Kim, Jingook Kim: Analytical Calculation of Jitter Probability Density at Multistage Output Buffers Due to Supply Voltage Fluctuations. IEEE Trans on EMC, Vol. 57, no. 4, 2015, pp. 796 – 806. DOI 10.1109/TEMC.2015.2403294

  26. Mu-Shui Zhang, Hong-Zhou Tan, Jun-Fa Mao: A Novel Layer Stack-Up With Free Cavity Resonance for High-Performance Power Noise Suppression. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 4, no. 12, 2014, pp. 1973 – 1980. DOI 10.1109/TCPMT.2014.2369482

  27. Mu-Shui Zhang, Hong-Zhou Tan, Jun-Fa Mao: Modeling, Analysis, and Design for Noise Suppression Using Embedded Planar Capacitors in Multilayered Printed Circuit Boards. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 4, no. 5, 2014, pp. 882 – 891. DOI 10.1109/TCPMT.2013.2296296

  28. Shall Hanen, Riah Zouheir, Kadi Moncef: A Novel Approach for Modeling Near-Field Coupling With PCB Traces. IEEE Trans on EMC, Vol. 56, no. 5, 2014, pp. 1194 – 1201. DOI 10.1109/TEMC.2014.2304306

  29. Kumar Vachan, Sharma Rohit, Uzunlar Erdal, et al.: Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 4, no. 8, 2014, pp. 1335 – 1346. DOI 10.1109/TCPMT.2014.2326798

  30. Ho Cheng-Yu, Chen Kai-Syuan, Horng Tzyy-Sheng, et al.: Method of Measuring Common-Mode Current Conversion Coefficient for Estimating Variation in Radiated Emission from Printed Circuit Board Components. Radioengineering, Vol. 23, no. 2, 2014, pp. 709 – 716. http://hdl.handle.net/11012/36470

  31. Tian Wen-Yan, Wu Ying-Chun, Li Ze-Min, et al.: EMI analysis of PCB excited by external incident wave using a hybrid S-matrix. Int. J. of Applied Electromagnetics and Mechanics, Vol. 46, no. 3, 2014, pp. 537 – 545. DOI 10.3233/JAE-141938

  32. Asmanis G., Stepins D., Asmanis A., et al.: Capacitors mutual inductance modeling and reduction. IEEE Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2014, pp. 1176 – 1181. DOI 10.1109/EMCEurope.2014.6931081

  33. Shim Yujeong, Oh Dan: Improved PCB Via Pattern to Reduce Crosstalk at Package BGA Region for High Speed Serial Interface. Electronic Components and Technology Conference (ECTC), 2014, pp. 1896 – 1901. DOI 10.1109/ECTC.2014.6897560

  34. Funato H., Suga T., Suhara M.: Application of a Cavity Resonator Model for Characterization and Estimation of Radiation From a PCB-Chassis System. IEEE Trans on EMC, Vol. 56, no. 2, 2014, pp. 475 – 451. DOI 10.1109/TEMC.2013.2280657

  35. Preibisch J.B., Duan X., Schuster C.: An Efficient Analysis of Power/Ground Planes With Inhomogeneous Substrates Using the Contour Integral Method. IEEE Trans on EMC, Vol. 56, no. 4, 2014, pp. 980 – 989. DOI 10.1109/TEMC.2013.2292095

  36. Iida Michihira, Maeno Tsuyoshi, Fujiwara Osamu: Effect of Ground Pattern Size on FM-Band Crosstalk Between Two Parallel Signal Traces of Printed Circuit Boards for Vehicles. Electrical Eng. in Japan, Vol. 186, no. 1, 2014, pp. 11 – 17. DOI 10.1002/eej.22316

  37. Reusch D., Strydom J.: Understanding the effect of PCB layout on circuit performance in a high frequency gallium nitride based point of load converter. IEEE Trans. on Power Electronics, Vol. 29, no. 4, 2014, pp. 2008 – 2015. DOI 10.1109/TPEL.2013.2266103

  38. Engin A.E., Bowman J.: Virtual Ground Fence for GHz Power Filtering on Printed Circuit Boards. IEEE Trans on EMC, Vol. 55, no. 6, 2013, pp. 1277 – 1283. DOI 10.1109/TEMC.2013.2265054

  39. Bamiedakis N., Hashim A., Beals J., Penty R.V., White I.H.: Low-Cost PCB-Integrated 10-Gb/s Optical Transceiver Built With a Novel Integration Method. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 4, 2013, pp. 592 – 600. DOI 10.1109/TCPMT.2013.2242961

  40. Chenyan Liu, Weiwei Hu, Yufeng Sun: Sensitivity analysis of PCB's design parameters of the plated through hole. Int. Conf. on Quality, Reliability, Risk, Maintenance, and Safety Eng. (QR2MSE), 2013, pp. 489 – 492. DOI 10.1109/QR2MSE.2013.6625629

  41. Shi Ling-Feng, Wang Hai-Peng, Cheng Li-Ye, Meng Chen , Cai Cheng-Shan: Multilayer EBG Structure for Ultra-Wide Band SSN Mitigation Using Embedded Spiral-Shaped Planes. Int. J. of RF and Microwave Computer-Aided Engineering, Vol. 23, no. 2, 2013, pp. 217 – 224. DOI 10.1002/mmce.20667

  42. Jiwei Wen, Weiping Jing: Signal-power integrity co-simulations of high speed systems via chip-package-PCB co-analysis methodology. Int. Conf. on Electronic Packaging Technology (ICEPT), 2013, pp. 485 – 491. DOI 10.1109/ICEPT.2013.6756518

  43. Soonwan Chung, Gyun Heo, Jae Kwak, Seunghee Oh, Yongwon Lee, Changsun Kang, Tackmo Lee: Development of PCB design guide and PCB deformation simulation tool for slim PCB quality and reliability. IEEE Electronic Components and Technology Conf. (ECTC), 2013, pp. 2157 – 2162. DOI 10.1109/ECTC.2013.6575879

  44. Takbiri M., Masoumi N., Mehri M., Daie Koozehkanani Z.: Crosstalk reduction using open-loop resonators for printed circuit boards traces. Mediterranean Microwave Symp (MMS), 2013, pp. 1 – 4. DOI 10.1109/MMS.2013.6663093

  45. Shuai Jin, Ji Zhang, Jun Fan: Optimization of the transition from connector to PCB board. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2013, pp. 192 – 196. DOI 10.1109/ISEMC.2013.6670407

  46. Ruaro A., Thaysen J., Jakobsen K.B.: Mitigation of unwanted forward narrow-band radiation from PCBs with a metamaterial unit cell. European Microwave Conf. (EuMC), 2013, pp. 939 – 942. http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6686813&isnumber=6686544

  47. Chen, Hsiao-Chung, Bai, Ying-Wen: Improvement of high current density PCB design on a high end server system. IEEE Int. Symp. on Industrial Electronics (ISIE), 2013, pp.1 – 4. DOI 10.1109/ISIE.2013.6563820

  48. Marques Andre Canal Cabrera, Jose-Maria Malfatti, Celia de Fraga: Printed circuit boards: A review on the perspective of sustainability. J. of Environmental Management, Vol. 131, 2013, pp. 298 – 306. DOI 10.1016/j.jenvman.2013.10.003

  49. McCreary C. A., Lail B. A.: Determining Minimum Printed Circuit Board Trace Dimensions for Transient Suppression Circuits. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 11, 2013, pp. 1876 – 1888. DOI 10.1109/TCPMT.2013.2271704

  50. Hao-Ran Zhu, Jian-Jie Li, Jun-Fa Mao: Ultra-Wideband Suppression of SSN Using Localized Topology With CSRRs and Embedded Capacitance in High-Speed Circuits. IEEE Trans on MTT, Vol. 61, no. 2, 2013, pp 764 – 772. DOI 10.1109/TMTT.2012.2231695

  51. Myunghoi Kim, Kyoungchoul Koo, Yujeong Shim, Chulsoon Hwang, Jun So Pak, Seungyoung Ahn, Joungho Kim: Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs. IEEE Trans on EMC, Vol. 55, no. 2, 2013, pp 307 – 314. DOI 10.1109/TEMC.2012.2216883

  52. Devabhaktuni V., Bunting C.F., Green D., Kvale D., Mareddy L., Rajamani V.: A New ANN-Based Modeling Approach for Rapid EMI/EMC Analysis of PCB and Shielding Enclosures. IEEE Trans on EMC, Vol. 55, no. 2, 2013, pp. 385 – 394. DOI 10.1109/TEMC.2012.2214223

  53. Wu T.-L., Buesink F., Canavero F.: Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 624 – 638. DOI 10.1109/TEMC.2013.2257796

  54. Choi J.: Ultimate noise isolation in high-speed digital systems on packages and printed circuit boards. Electronics Lett., Vol. 49, no. 9, 2013, pp. 594 – 595. DOI 10.1049/el.2012.4303

  55. Yongrong Shi, Wanchun Tang, Sheng Liu, Xin Rao, Chow Y.L.: Ultra-Wideband Suppression of Power/Ground Noise in High-Speed Circuits Using a Novel Electromagnetic Bandgap Power Plane. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 4, 2013, pp. 653 – 660. DOI 10.1109/TCPMT.2012.2235529

  56. Kong Fan, Sheng Weixing, Wang Hao, Wu Jing, Ma Xiaofeng: Signal integrity analysis for high-speed circuit PCB interconnection with an efficient full wave method. Int. J. of RF and Microwave Computer-Aided Engineering, Vol. 23, no. 5, 2013, pp. 586 – 597. DOI: 10.1002/mmce.20693

  57. Zhu Hao-Ran, Mao Jun-Fa: Localized Planar EBG Structure of CSRR for Ultrawideband SSN Mitigation and Signal Integrity Improvement in Mixed-Signal Systems. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 12, 2013,  pp. 2092 – 2100.   DOI 10.1109/TCPMT.2013.2272788

  58. Wang Chuen-De, Chang Yu-Jen, Lu Yi-Chang, Peng-Shu Chen, Wei-Chung Lo, Yih-Peng Chiou, Tzong-Lin Wu : ABF-Based TSV Arrays With Improved Signal Integrity on 3-D IC/Interposers: Equivalent Models and Experiments. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3,  no. 10, 2013, pp. 1744 – 1753.  DOI 10.1109/TCPMT.2013.2254174

  59. Hashim A., Bamiedakis N., Beals J., Penty R.V., White I.H.: Cost-effective 10 Gb/s polymer-based chip-to-chip optical interconnect. IET Optoelectronics, Vol. 6, no. 3, 2012, pp 140 – 146. DOI 10.1049/iet-opt.2012.0003

  60. F de Paulis, M. H. Nisanci, A. Orlandi: Signal Integrity. IEEE Electromagnetic Compat. Magazine, Vol. 1 , no. 3, 2012, pp. 60 – 65. DOI 10.1109/MEMC.2012.6347053

  61. He X., Hubing T. H.: A Closed-Form Expression for Estimating the Maximum Radiated Emissions From a Heatsink on a Printed Circuit Board. IEEE Trans on Electromagnetic Compatibility, 2012, Vol. 54, no. 1, pp. 205 – 211. DOI 10.1109/TEMC.2011.2169248

  62. Su C., Hubing T. H.: Calculating Radiated Emissions Due to I/O Line Coupling on Printed Circuit Boards Using the Imbalance Difference Method. IEEE Trans on Electromagnetic Compatibility, Vol. 54, no. 1, 2012, pp. 212 – 217. DOI 10.1109/TEMC.2011.2168565

  63. Bait-Suwailam M. M., Ramahi O. M. : Ultrawideband Mitigation of Simultaneous Switching Noise and EMI Reduction in High-Speed PCBs Using Complementary Split-Ring Resonators. IEEE Trans on Electromagnetic Compatibility, Vol. 54, no 2, 2012, pp. 389 – 396. DOI 10.1109/TEMC.2011.2163940

  64. Mandic T., Gillon R., Nauwelaers B., Baric A.: Characterizing the TEM Cell Electric and Magnetic Field Coupling to PCB Transmission Lines. IEEE Trans on EMC, Vol. 54, no. 5, 2012, pp. 976 – 985. DOI 10.1109/TEMC.2012.2193888

  65. Lozano-Guerrero A.J., Monzo-Cabrera J., Clemente-Fernandez F.J., Fayo-Fernandez J., Pedreno-Molina J.L., Diaz-Morcillo A.: Electromagnetic Equivalent Models for Printed Circuit Boards Inside a Metallic Enclosure Using a Coaxial-to-Waveguide Transition Calibration. IEEE Trans on EMC, Vol. 54, no. 4, 2012, pp. 931 – 939. DOI 10.1109/TEMC.2012.2184120

  66. Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang, Yujeong Shim, Joungho Kim, Jonghoon Kim: A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs. IEEE Trans on EMC, Vol. 54, no. 3, 2012, pp. 689 – 695. DOI 10.1109/TEMC.2012.2187662

  67. Koul A., Koledintseva M.Y., Hinaga S., Drewniak J.L.: Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards. IEEE Trans on EMC, Vol. 54, no. 2, 2012, pp. 421 – 433. DOI 10.1109/TEMC.2010.2087341

  68. F. de Paulis, A. Orlandi : Accurate and Efficient Analysis of Planar Electromagnetic Band-Gap Structures for Power Bus Noise Mitigation in the GHz Band. Progress in Electromagnetics Research B, Vol. 37, 2012, pp 59 – 80. http://www.jpier.org/PIERB/pierb37/04.11100402.pdf

  69. Hui-Fen Huang, Wei Guo, Qing-Xin Chu: Vein Power Plane for Printed Circuit Board Based on Constructal Theory. IEEE Trans on EMC, Vol. 53, no. 4, 2011, pp. 987 – 995. DOI 10.1109/TEMC.2011.2142418

  70. Visacro S., Alipio R., Murta Vale M.H., Pereira C.: The Response of Grounding Electrodes to Lightning Currents: The Effect of Frequency-Dependent Soil Resistivity and Permittivity. IEEE Trans on EMC, Vol. 53, no. 2, 2011, pp. 401 – 406. DOI 10.1109/TEMC.2011.2106790

  71. Changyi Su, Hubing T.H.: Imbalance Difference Model for Common-Mode Radiation From Printed Circuit Boards. IEEE Trans on EMC, Vol. 53, no. 1, 2011, pp. 150 – 156. DOI 10.1109/TEMC.2010.2049853

  72. Ashish Kumar, Pushek Madaan: Top 10 EMC Design Considerations. Cypress Perform, 2011, pp. 1 – 4. http://www.cypress.com/?docID=28761

  73. Wu Boping, Mo Tingting : Printed circuit board electrical design for wafer-level packaging. 12th Int. Conf. on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011, pp. 1 – 4. DOI 10.1109/ICEPT.2011.6066808

  74. Huadong Li, Subramanyam G.: Closed-Form Expression for the Net Ground Plane Inductance of Coplanar Stripline PCBs. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 2, 2011, pp. 531 – 533. DOI 10.1109/TEMC.2011.2107577

  75. Su C., Hubing T. H.: Improvements to a Method for Estimating the Maximum Radiated Emissions From PCBs With Cables. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 4, 2011, pp.1087 – 1091. DOI 10.1109/TEMC.2011.2165217

  76. Xinbo He, Hubing T., Haixin Ke, Kobayashi N., Morishita K., Harada T.: Calculation of Optimal Ground Post Resistance for Reducing Emissions from Chassis-Mounted Printed Circuit Boards. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 2, 2011, pp. 475 – 481. DOI 10.1109/TEMC.2011.2104375

  77. Rao P.H., Swaminathan M. A.: Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low Radiation. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 4, 2011, pp. 996 – 1004. DOI 10.1109/TEMC.2011.2156408

  78. Moongilan D.: Method for direct interconnection of PCB power layer to chassis to minimize radiated emissions. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2011, pp. 173 – 178. DOI 10.1109/ISEMC.2011.6038305

  79. Sudo Toshio: Experiments and simulation of electromagnetic radiation due to power bus structure in a printed circuit board. Int. Conf. on Electromagnetics in Advanced Applications (ICEAA), 2011, pp. 977 – 980. DOI 10.1109/ICEAA.2011.6046474

  80. De Paulis F., Zhang Yao-Jiang, Fan Jun: Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 1008 – 1018. DOI 10.1109/TEMC.2010.2072784

  81. Vahrenholt V., Brüns H.-D., Singer H.: Fast EMC Analysis of Systems Consisting of PCBs and Metallic Antenna Structures by a Hybridization of PEEC and MoM. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 962 – 973. DOI 10.1109/TEMC.2010.2044577

  82. Taesik Yang, Bayram Y, Volakis J L: Hybrid Analysis of Electromagnetic Interference Effects on Microwave Active Circuits Within Cavity Enclosures. IEEE Trans on EMC, Vol. 52, no 3, 2010, pp 745 – 748. DOI 10.1109/TEMC.2009.2038993

  83. Boping Wu, Leung Tsang: Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics. IEEE Trans. on Advanced Packaging, Vol. 33, no. 2, 2010, pp 510 – 516. DOI 10.1109/TADVP.2009.2026482

  84. Guan-Zong Wu, Yi-Che Chen, Tzong-Lin Wu: Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression. IEEE Trans. on Advanced Packaging, Vol. 33, no. 1, 2010, pp. 206 – 211. DOI 10.1109/TADVP.2009.2034334

  85. H.-S. He, X.-Q. Lai, Q. Ye, Q. Wang, W.-D. Xu, J.-G. Jiang, M.-X. Zang : Wideband SSN Suppression in High-Speed PCB Using Novel Planar EBG. Progress In Electromagnetics Research Letters, Vol. 18, 2010 pp 29 – 39. http://www.jpier.org/PIERL/pierl18/04.10080102.pdf

  86. Chung-Huan Li, , J. Jekkonen, G. Tudosie, N. Chavannes, N. Kuster : Study of Mutual Coupling on Mobile Phone PCB with Shielding using FDTD. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2010, pp 419 – 424. DOI 10.1109/ISEMC.2010.5711311

  87. Gang Feng, Jun Fan: Analysis of Simultaneous Switching Noise Coupling in Multilayer Power/Ground Planes With Segmentation Method and Cavity Model. IEEE Trans on EMC, Vol. 52, no 3, 2010, pp 699 – 711. DOI 10.1109/TEMC.2010.2046665

  88. Xiaomin Duan, Rimolo-Donadio R., Brüns H.-D., Schuster C.: A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 487 – 495. DOI 10.1109/TEMC.2010.2041238

  89. Rogard E., Azanowsky B., Ney M.M: Comparison of Radiation Modeling Techniques Up to 10 GHz—Application on a Microstrip PCB Trace. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 479 – 486. DOI 10.1109/TEMC.2010.2046170

  90. Triverio P., Grivet-Talocia S., Bandinu M., Canavero F. G.: Geometrically Parameterized Circuit Models of Printed Circuit Board Traces Inclusive of Antenna Coupling. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 471 – 478. DOI 10.1109/TEMC.2010.2043256

  91. Xin Tong, Thomas D.W P., Nothofer A., Sewell P., Christopoulos C.: Modeling Electromagnetic Emissions From Printed Circuit Boards in Closed Environments Using Equivalent Dipoles. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 462 – 470. DOI 10.1109/TEMC.2010.2044181

  92. Archambeault B., Brench C., Connor S.: Review of Printed-Circuit-Board Level EMI/EMC Issues and Tools. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 455 – 461. DOI 10.1109/TEMC.2010.2044182

  93. Ndip I., Ohnimus F., Löbbicke K., Bierwirth M., Tschoban C., Guttowski S, Reichl H., Lang K.-D., Henke H.: Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and Boards. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 421 – 435. DOI 10.1109/TEMC.2010.2049069

  94. Hee-do Kang, Hyun Kim, Sang-Gyu Kim, Jong-Gwan Yook: A Localized Enhanced Power Plane Topology for Wideband Suppression of Simultaneous Switching Noise. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 373 – 380. DOI 10.1109/TEMC.2010.2044415

  95. Scogna Ciccomancini A., Orlandi A., Ricchiuti V.: Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap Structures. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 357 – 364. DOI 10.1109/TEMC.2009.2027125

  96. Tzong-Lin Wu, Hao-Hsiang Chuang, Ting-Kuang Wang: Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 346 – 356. DOI 10.1109/TEMC.2009.2039575

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