Measurement began our might”

(W. B. Yeats)

  1. I-Chyn Wey, Chien-Chang Peng, Hwang-Cherng Chow: Wide Bandwidth and High Precision Power Supply Noise Detector by Using Dual Peak Detection Sample and Hold Circuits. Int. Journal of Circuit and Theory Applications, Vol. 42, no. 5, 2014, pp. 529 – 541. DOI 10.1002/cta.1868

  2. Ameya Michitaka, Kurokawa Satoru: Automatic site-VSWR measurement using mobile robot platform. Int. Symp. on Electromagnetic Compatibility (EMC EUROPE), 2014, pp. 957 – 961. DOI 10.1109/EMCEurope.2014.6931041

  3. De Keulenaer T., Yu Ban, Torfs G., Sercu S., De Geest J., Bauwelinck J.: Measurements of millimeter wave test structures for high speed chip testing. IEEE 18th Workshop on Signal and Power Integrity (SPI), 2014, pp. 1 – 4. DOI 10.1109/SaPIW.2014.6844529

  4. Yu Zhanqing, Zhang Xiao, He Jinliang, Huang Yin, Qiu Wei: Measurements of electromagnetic interference in an operating ±800 kV DC converter station. XXXIth URSI General Assembly and Scientific Symp., 2014, pp. 1 – 4. DOI 10.1109/URSIGASS.2014.6929536

  5. Leca J.P., Froidevaux N., Dupre P., Jacquemod G., Braquet H.: EMI Measurements, Modeling, and Reduction of 32-Bit High-Performance Microcontrollers. IEEE Trans on EMC, Vol. 56, no. 5, 2014, pp. 1035 – 1044. DOI 10.1109/TEMC.2014.2304744

  6. Alnasser E.: The Stability Analysis of a Biopotential Measurement System Equipped With Driven-Right-Leg and Shield-Driver Circuits. IEEE Trans on Instr. & Meas., Vol. 63, no. 7, 2014, pp. 1731 – 1738. DOI 10.1109/TIM.2013.2293811

  7. Pous M., Silva F.: APD radiated transient measurements produced by electric sparks employing time-domain captures. Int. Symp. on Electromagnetic Compatibility (EMC EUROPE), 2014, pp. 813 – 817. DOI 10.1109/EMCEurope.2014.6931016

  8. Joodaki M., Attar A.: A radiated EMI measurement setup for un-buffered DRAM PCBs. Int. Symp. on Electromagnetic Compatibility (EMC EUROPE), 2014, pp. 756 – 759. DOI 10.1109/EMCEurope.2014.6931005

  9. Sun A.G., Crofton M.W., Young J.A., Cox W.A., Beiting E.J.: Time-domain radiated emissions measurement of laboratory simulated spacecraft on-orbit electrostatic discharge. Int. Symp. on Electromagnetic Compatibility (EMC EUROPE), 2014, pp. 775 – 780. DOI 10.1109/EMCEurope.2014.6931009

  10. Qi Huang, Xiaohua Wang, Wei Zhen, Pong P.W.T.: Broadband Point Measurement of Transient Magnetic Interference in Substations With Magnetoresistive Sensors. IEEE Trans on Magnetics, Vol. 50, no. 7, 2014, pp. 1 – 5. DOI 10.1109/TMAG.2013.2297394

  11. Mirtalaei S.M.M., Sadeghi S.H.H., Moini R.: A Combined Method-of-Moments and Near-Field Measurements for EMI Evaluation of Switched-Mode Power Supplies. IEEE Trans on Industrial Electronics, Vol. 61, no. 4, 2014, pp. 1811 – 1818. DOI 10.1109/TIE.2013.2267703

  12. Grobler I., Gitau M.N.: Modelling and measurement of high switching frequency conducted EMI. Conf. on IEEE Industrial Electronics Society (IECON), 2013, pp. 1031 – 1036. DOI 10.1109/IECON.2013.6699275

  13. Kiyoshige S., Ichimura W., Terasaki M., Kobayashi R., Kubo G., Otsuka H., Sudo T.: Measurement and analysis of anti-resonance peak in total PDN impedance. Int. Symp. on Electromagnetic Compatibility (EMC EUROPE), 2013, pp. 931 – 936. http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6653435&isnumber=6653179

  14. Ji Zhang, Kam K.W., Jin Min, Khilkevich V.V., Pommerenke D., Jun Fan: An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application. IEEE Trans on Instr. & Meas., Vol. 62, no. 3, 2013, pp. 648 – 658. DOI 10.1109/TIM.2012.2218678

  15. Tabbakh M.S., Morel F., Mrad R., Zaatar Y.: High frequency battery impedance measurements for EMI prediction. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2013, pp. 763 – 767. DOI 10.1109/ISEMC.2013.6670512

  16. Huadong Li, Kye Yak See: Conversion Factors Between Common Detectors in EMI Measurement for Impulse and Gaussian Noises. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 657 – 663. DOI 10.1109/TEMC.2012.2227752

  17. Kostov K.S., Nee H.-P., Priecinsky M.: The input impedance of common mode and differential mode noise separators. IEEE Energy Conversion Congress and Exposition (ECCE), 2013, pp. 1688 – 1695. DOI 10.1109/ECCE.2013.6646910

  18. Fujita H., Takatani H., Tanaka Y., Kawaguchi S., Sato M., Sudo T.: Evaluation of PDN impedance and power supply noise for different on-chip decoupling structures. Int. Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2013, pp. 142 – 146. DOI 10.1109/EMCCompo.2013.6735189

  19. Baev A., Gorbunova A., Konovalyuk M., Kuznetsov Y., Russer J.A.: Stochastic EMI sources localization based on ultra wide band near-field measurements. European Microwave Conf. (EuMC), 2013, pp. 11311134.

  20. Russer J.A., Braun S., Frech A., Russer P.: Time-domain measurement of spectra of stochastic electromagnetic fields. Int. Conf on Electromagnetics in Advanced Applications (ICEAA), 2013, pp. 1123 – 1126. DOI 10.1109/ICEAA.2013.6632417

  21. Decrock L., Catrysse J., Vanhee F., Pissoort D.: Measuring and simulating EMI on very small components at high frequencies. Int. Symp. on Electromagnetic Compatibility (EMC EUROPE), 2013, pp. 961 – 965. http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6653440&isnumber=6653179

  22. Osabe K., Kato T.: Proposal for evaluation method of proficiency test results on EMI measurement. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2013, pp. 138 – 143. DOI 10.1109/ISEMC.2013.6670397

  23. Sun A.G., Crofton M.W., Young J.A., Cox W.A., Beiting E.J.: L-, S-, and C-Band EMI Measurement and Characterization of Spacecraft ESD Events. IEEE Trans on Plasma Science, Vol. 41, no. 12, 2013, pp. 3505 – 3511. DOI 10.1109/TPS.2013.2288099

  24. Adusumilli S., Almalkawi M., Devabhaktuni V.: A robust correction model based neural network modeling framework for electromagnetic simulations and RF measurements. 82nd Microwave Measurement Conference (ARFTG), 2013, pp. 1 – 6. DOI 10.1109/ARFTG-2.2013.6737364

  25. Fuketa Hiroshi, Takahashi Ryo, Takamiya Makoto, Nomura Masahiro, Shinohara Hirofumi, Sakurai Takayasu: Increase of Crosstalk Noise Due to Imbalanced Threshold Voltage Between nMOS and pMOS in Subthreshold Logic Circuits. IEEE Journal of SSC, Vol. 48, no. 8, Special Issue: SI, 2013, pp. 19861994. DOI 10.1109/JSSC.2013.2258831

  26. Teixeira H.M., Dghais W., Cunha T.R., Pedro J.C.: Measurement Setup for RF/Digital Buffers Characterization. IEEE Trans on Instr. & Meas., Vol. 62, no. 7, 2013, pp. 1892 – 1899. DOI 10.1109/TIM.2013.2248294

  27. Russer P., Russer J., Hoffmann C., Slim H.H.: Real-time EM spectrum and EM interference measurement techniques. European Microwave Conf. (EuMC), 2013, pp. 1115 – 1118. http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6686857&isnumber=6686544

  28. Moravek O., Hoffmann K., Polivka M., Jelinek L.: Precise Measurement Using Coaxial-to-Microstrip Transition Through Radiation Suppression. IEEE Trans on MTT, Vol. 61, no. 8, Part I, 2013, pp. 2956 – 2965. DOI 10.1109/TMTT.2013.2272380

  29. Goyal A., Swaminathan M., Chatterjee A.: One-Port Resonance-Based Test Technique for RF Interconnect and Filters Embedded in RF Substrates. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 2, 2013, pp. 236 – 246. DOI 10.1109/TCPMT.2012.2226582

  30. Tait G.B., Hager C., Slocum M.B., Hatfield M.O.: On Measuring Shielding Effectiveness of Sparsely Moded Enclosures in a Reverberation Chamber. IEEE Trans on EMC, Vol. 55, no. 2, 2013, pp. 231 – 240. DOI 10.1109/TEMC.2012.2220779

  31. Lei Zhao, Xiaofang Hu, Changqing Feng, Shaochun Tang, Shubin Liu, Qi An: A 1.6-Gsps High-Resolution Waveform Digitizer Based on a Time-Interleaved Technique. IEEE Trans on Nuclear Science, Vol. 60, no. 3, 2013, pp. 2180 – 2187. DOI 10.1109/TNS.2013.2257846

  32. Li H., See K.Y.: Conversion Factors Between Common Detectors in EMI Measurement for Impulse and Gaussian Noises. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 657 – 663. DOI 10.1109/TEMC.2012.2227752

  33. Amador E., Krauthauser H.G., Besnier P.: A Binomial Model for Radiated Immunity Measurements. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 683 – 691. DOI 10.1109/TEMC.2012.2231942

  34. Sanchez A.-M., Regue J.-R., Ribo M., Perez A., Rodriguez-Cepeda P., Pajares F.-J.: Automated Power-Line Filter Design Under High 50-Hz Current Load Conditions. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 717 – 724. DOI 10.1109/TEMC.2012.2225626

  35. Park H.H., Jang H.-T., Park H.-B., Choi C.: An EMI Evaluation Method for Integrated Circuits in Mobile Devices. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 780 – 787. DOI 10.1109/TEMC.2012.2227753

  36. Cuellar C., Idir N., Benabou A., Margueron X.: High frequency current probes for common-mode impedance measurements of power converters under operating conditions. Proc. of the European Conf. on Power Electronics and Applications (EPE), 2013, pp. 1 – 8 DOI 10.1109/EPE.2013.6631983

  37. Xiaoxia Zhou, Jing Li, Hongmei Fan, Bhobe A., Sochoux P., Jinghan Yu: High-frequency EMC design verification through full-wave simulations and measurements in Reverberation Chamber. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2013, pp. 299 – 305. DOI 10.1109/ISEMC.2013.6670427

  38. Harada Yuji, Yoshikawa Kumpei, Miura Noriyuki, Nagata Makoto, Murata Akitaka, Agatsuma Syuji, Ichikawa Kouji: Power-Noise Measurements of Small-Scale Inverter Chains. IEEE Int. Meeting for Future of Electron Devices Kansai (IMFEDK), 2013.

  39. Rengarajan S.R.: Improving Signal Integrity in Time Domain Measurements of Antenna Boresight Fields. Proc of URSI Int. Symp. on Electromagnetic Theory, 2013, pp. 970 – 972.

  40. Grossman B., Fledell E., Aca E.: Adventures in measurement. IEEE Microwave Magazine, Vol. 14, no. 3, 2013, pp. 94 102. DOI 10.1109/MMM.2013.2240854

  41. Joohee Kim, Joungho Kim: Signal integrity modeling and measurement of TSV in 3D IC. Asia and South Pacific Design Automation Conference (ASP-DAC), 2013, pp.13 16. DOI 10.1109/ASPDAC.2013.6509551

  42. F. Wan, J.-X. Ge, Y. Zhou, B. Yu: Improved immunity measurement of a microcontroller to conducted continuous wave interference. Progress In Electromagnetics Research M, Vol. 31, 2013, pp. 117 – 127. http://www.jpier.org/PIERM/pierm31/09.13041902.pdf

  43. F. Wan, J.-X. Ge, M. Qu: Conducted emission measurement of a cell phone processor module. Progress In Electromagnetics Research C, Vol. 42, 2013, pp. 191 – 203. http://www.jpier.org/PIERC/pierc42/15.13060705.pdf

  44. Melia G.C.R., Robinson M.P., Flintoft I.D., Marvin A.C., Dawson J.F.: Broadband Measurement of Absorption Cross Section of the Human Body in a Reverberation Chamber. IEEE Trans on EMC, Vol. 55, no. 6, 2013, pp. 1043 – 1050. DOI 10.1109/TEMC.2013.2248735

  45. Medler J.: New requirements in the treatment of measurement instrumentation uncertainty in accordance with CISPR 16-4-2 edition 2. Asia-Pacific Symp. on Electromagnetic Compatibility (APEMC), 2012, pp. 377 – 380. DOI 10.1109/APEMC.2012.6237880

  46. Niitsu K., Sakurai M., Harigai N., Hirabayashi D., Yamaguchi T.J., Kobayashi H.: A reference-free on-chip timing jitter measurement circuit using self-referenced clock and a cascaded time difference amplifier in 65nm CMOS. 17th Asia and South Pacific Design Automation Conference (ASP-DAC), 2012, pp 553 – 554. DOI 10.1109/ASPDAC.2012.6165014

  47. Bo Pu, Jae Joong Lee, Sang Keun Kwak, So Young Kim, Wansoo Nah: Electromagnetic susceptibility analysis of ICs using DPI method with consideration of PDN. Asia-Pacific Symp on Electromagnetic Compatibility (APEMC), 2012, pp 77 – 80. DOI 10.1109/APEMC.2012.6237980

  48. Chih-Ping Cheng, Jen-Chieh Liu, Kuo-Hsing Cheng: Auto-calibration techniques in built-in jitter measurement circuit. IEEE 15th Int. Symp on Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2012, pp 248 – 249. DOI 10.1109/DDECS.2012.6219066

  49. Hoffmann C., Russer P.: A Real-Time Low-Noise Ultrabroadband Time-Domain EMI Measurement System up to 18 GHz. IEEE Trans on Electromagnetic Compatibility, Vol. PP, no. 99, 2011, pp. 1 – 9. DOI 10.1109/TEMC.2011.2158827

  50. Miyazaki C., Tanakajima K., Yamaguchi M., Endo K., Muramatsu H., Kawano J.: A round-robin test on effectiveness of a VHF LISN for radiated emission measurements. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2011, pp. 405 – 410. DOI 10.1109/ISEMC.2011.6038345

  51. Crovetti P. S., Fiori F. : A critical assessment of the closed-loop bulk current injection immunity test performed in compliance with ISO 11452-4. IEEE Trans on Instr. & Meas.,Vol. 60, no 4, 2011, pp 1291 – 1297. DOI 10.1109/TIM.2010.2084870

  52. Kuo-Hsing Cheng, Jen-Chieh Liu, Chih-Yu Chang, Shu-Yu Jiang, Kai-Wei Hong: Built-in Jitter Measurement Circuit With Calibration Techniques for a 3-GHz Clock Generator. IEEE Trans on VLSI, Vol. 19, no 8, 2011, pp 1325 – 1335. DOI 10.1109/TVLSI.2010.2052377

  53. Shimeng Yu, Jeyasingh R., Yi Wu, Wong H.-S.P.: Understanding the conduction and switching mechanism of metal oxide RRAM through low frequency noise and AC conductance measurement and analysis. IEEE Int. Electron Devices Meeting (IEDM), 2011, pp 12.1.1 – 12.1.4. DOI 10.1109/IEDM.2011.6131537

  54. Xin Fan, Krstic M., Wolf C., Grass E.: GALS Design for On-chip Ground Bounce Suppression. 17th IEEE Int. Symp on Asynchronous Circuits and Systems (ASYNC), 2011, pp 43 – 52. DOI 10.1109/ASYNC.2011.11

  55. Angrisani L., Capriglione D., Ferrigno L., Miele G.: Packet jitter measurement in communication networks: A sensitivity analysis. IEEE Int. Workshop on Measurements and Networking Proceedings (M&N), 2011, pp 146 – 151. DOI 10.1109/IWMN.2011.6088488

  56. Kuo-Hsing Cheng, Chih-Yu Chang, Jen-Chieh Liu, Chih-Ping Cheng: Measurement error analysis and calibration techniques for built-in jitter measurement circuit. Int. Symp on VLSI Design, Automation and Test (VLSI-DAT), 2011, pp 1 – 4. DOI 10.1109/VDAT.2011.5783600

  57. Jong Hwa Kwon, Dong Uk Sim, Sang Il Kwak, Jong Gwan Yook: Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High-Speed Signals. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 365 – 372. DOI 10.1109/TEMC.2010.2045894

  58. Jianjun Yu, Dai F.F.: On-chip Jitter Measurement Using Vernier Ring Time-to-Digital Converter. 19th IEEE Asian Test Symp (ATS), 2010, pp 167 – 170. DOI 10.1109/ATS.2010.38

  59. Kubíček M.: In-system jitter measurement using FPGA. 20th Int. Conf. Radioelektronika (RADIOELEKTRONIKA), 2010, pp 1 – 4. DOI 10.1109/RADIOELEK.2010.5478560

  60. Vauchamp S., Lalande M., Andrieu J., Jecko B., Lasserre J.L., Pecastaing L., Cadilhon B.: Utilization of Target Scattering to Measure High-Level Electromagnetic Fields: The MICHELSON Method. IEEE Trans on Instr. & Meas., Vol. 59, no 9, 2010, pp 2405 – 2413. DOI 10.1109/TIM.2009.2034574

  61. Hung-I Hsieh: Effects of mix-mode noise emissions on the design method of power factor correction boost rectifier EMI filters. 2010 Int. Power Electronics Conf. (IPEC), Sapporo, 2010, pp 2438. DOI 10.1109/IPEC.2010.5542386

  62. Ferragina V., Ghittori N., Torelli G., Boselli G., Trucco G., Liberali V.: Analysis and Measurement of Crosstalk Effects on Mixed-Signal CMOS ICs With Different Mounting Technologies. IEEE Trans on Instr. & Meas., Vol. 59, no 8, 2010, pp 2015 – 2025. DOI 10.1109/TIM.2009.2030915

  63. Musolino F.: Measurement of IC-Conducted Emissions by Employing a Backward-Wave Directional Coupler. IEEE Trans on Instr. & Meas., Vol. 59, no 7, 2010, pp 1983 – 1985. DOI 10.1109/TIM.2010.2047970

  64. Pjevalica V., Vujicic V.: Further Generalization of the Low-Frequency True-RMS Instrument. IEEE Trans on Instr. & Meas., Vol. 59, no 4, 2010, pp 736 – 744. DOI 10.1109/TIM.2009.2030874

  65. Jarrix S., Dubois T., Adam R., Nouvel P., Azais B., Gasquet D.: Probe Characterization for Electromagnetic Near-Field Studies. IEEE Trans on Instr. & Meas., Vol. 59, no 2, 2010, pp 292 – 300. DOI 10.1109/TIM.2009.2023148

  66. Kapora S., Laermans E., van Deursen A. P. J.: Protection of Cables by Open-Metal Conduits. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 1026 – 1033. DOI 10.1109/TEMC.2010.2056374

  67. Knockaert J., Peuteman J., Catrysse J., Belmans R.: A Vector Impedance Meter Method to Characterize Multiconductor Transmission-Line Parameters. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 1019 – 1025. DOI 10.1109/TEMC.2010.2053712

  68. Cortes J. A., Diez L., Canete F. J., Sanchez-Martinez J. J.: Analysis of the Indoor Broadband Power-Line Noise Scenario. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 849 – 858. DOI 10.1109/TEMC.2010.2052463

  69. Baran J., Sroka J.: Distortion of ESD Generator Pulse Due to Limited Bandwidth of Verification Path. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 797 – 803. DOI 10.1109/TEMC.2010.2071386

  70. Tarateeraseth V., Kye Yak See, Canavero F. G., Chang R. W.: Systematic Electromagnetic Interference Filter Design Based on Information From In-Circuit Impedance Measurements. IEEE Trans on EMC, Vol. 52, no 3, 2010, pp 588 – 598. DOI 10.1109/TEMC.2010.2046419

  71. Fernandez I., Angueira P, Landa I, Arrinda A, Guerra D, Gil U: Indoor noise measurements in medium wave band. Electronics Lett., Vol. 46, no 16, 2010, pp 1162 – 1163. DOI 10.1049/el.2010.1629

  72. Awan F.G., Sheikh N.M., Fawad M.: Radiation Emission EMC Measurement in Real-Time. Sixth Int. Conf. on Information Technology New Generations ( ITNG '09), 27-29 April 2009, Las Vegas, NV, pp 528 – 533. DOI 10.1109/ITNG.2009.146

  73. M. Shen, T. Tong, J. H. Mikkelsen, T. Larsen: A measurement fixture suitable for measuring substrate noise in the UWB frequency band. Analog Integr Circ Sig Process., Vol. 58, 2009, pp 11 – 17. http://www.springerlink.com/content/f40w2677641r2014/fulltext.pdf

  74. Cote M.: A Four-Terminal Coaxial-Pair Maxwell–Wien Bridge for the Measurement of Self-Inductance. IEEE Trans on Instr. & Meas., Vol. 58, no 4, 2009, pp 962 – 966. DOI 10.1109/TIM.2008.2012384

  75. Scholz M., Linten D., Thijs S., Sangameswaran S., Sawada M., Nakaei T., Hasebe T., Groeseneken G.: ESD On-Wafer Characterization: Is TLP Still the Right Measurement Tool? IEEE Trans on Instr. & Meas., Vol. 58, no 10, 2009, pp 3418 – 3426. DOI 10.1109/TIM.2009.2017657

  76. Shu-Yu Jiang, Kuo-Hsing Cheng, Pei-Yi Jian: A 2.5-GHz Built-in Jitter Measurement System in a Serial-Link Transceiver. IEEE Trans on VLSI, Vol. 17, no 12, 2009, pp 1698 – 1708. DOI 10.1109/TVLSI.2008.2006476

  77. Long Li, Qiang Chen, Qiaowei Yuan, Sawaya K.: Ultrawideband Suppression of Ground Bounce Noise in Multilayer PCB Using Locally Embedded Planar Electromagnetic Band-Gap Structures. IEEE Antennas and Wireless Propagation Letters, Vol. 8, 2009, pp 740 – 743. DOI 10.1109/LAWP.2008.2009363

  78. Metra C., Omana M., Mak T.M., Rahman A., Tam S.: Novel On-Chip Clock Jitter Measurement Scheme for High Performance Microprocessors. IEEE Int. Symp on Defect and Fault Tolerance of VLSI Systems (DFTVS '08), 2008, pp 465 – 473. DOI 10.1109/DFT.2008.51

  79. M. S. Sarto, A. Tamburrano: Innovative Test Method for the Shielding Effectiveness Measurement of Conductive Thin Films in a Wide Frequency Range. Trans on EMC, Vol. 50, no 2, May 2008, pp 331 – 341. DOI 10.1109/TEMC.2006.874664

  80. I. Chahine, M. Kadi, E. Gaboriaud, A. Louis, B. Mazari: Characterization and Modeling of the Susceptibility of Integrated Circuits to Conducted Electromagnetic Disturbances Up to 1 GHz. Trans on EMC, Vol 50, no 2, May 2008, pp 285 – 293. DOI 10.1109/TEMC.2008.918983

  81. Milosevic P., Schutt-Aine J.E.: On-chip oscilloscope for signal integrity characterization of interconnects in 130nm CMOS technology. Electrical Performance of Electronic Packaging, 2008, pp 65 – 68. DOI: 10.1109/EPEP.2008.4675878

  82. Steenstra H. T., van Deursen A.P.J.: Reduction of conducted interference by steel armor in buried cables: Measurements and modeling. IEEE Trans on EMC, Vol. 50, no 3, part 2, 2008, pp 678 – 686. DOI 10.1109/TEMC.2008.926902

  83. S. Deng, T. H. Hubing, D. G. Beetner: Using TEM Cell Measurements to Estimate the Maximum Radiation From PCBs With Cables Due to Magnetic Field Coupling. Trans on EMC, vol 50, no 2, May 2008, pp 419 – 423. DOI 10.1109/TEMC.2008.919026

  84. Floridia C., de Moraes J.C.: Fast on-line OSNR measurements based on polarisation-nulling method with downhill simplex algorithm. Electronics Lett., Vol. 44, no 15, 2008, pp 926 – 927. DOI 10.1049/el:20081201

  85. Uematsu Y., Osaka H., Suzuki E., Yagyu M., Saito T.: Measurement techniques for on-chip power supply noise waveforms based on fluctuated sampling delays in inverter chain circuits. Electrical Performance of Electronic Packaging, 2008, pp 69 – 72. DOI 10.1109/EPEP.2008.4675879

  86. Takagi Y., Kumazaki N., Ishihara M., Kasahara K., Sugiyama A., Akikusa N., Edamura T.: Relative intensity noise measurements of 5 μm quantum cascade laser and 1.55 μm semiconductor laser. Electron. Lett., 3 July 2008, Vol. 44, Issue 14, pp 860 – 861. DOI 10.1049/el:20080795

  87. Dubois T., Jarrix S., Penarier A., Nouvel P., Gasquet D., Chusseau L., Azais B.: Near-Field Electromagnetic Characterization and Perturbation of Logic Circuits. IEEE Trans on Instr. & Meas., Vol. 57, no 11, 2008, pp 2398 – 2404. DOI 10.1109/TIM.2008.926371

  88. Redoute J.-M., Steyaert M.: Measurement of EMI induced input offset voltage of an operational amplifier. Electronics Lett., Vol. 43, no 20, 2007, pp 1088 – 1090. DOI 10.1049/el:20071017

  89. Boyer A., Bendhia S., Sicard E.: Characterisation of electromagnetic susceptibility of integrated circuits using near-field scan. Electronics Lett., Vol. 43, no 1, 2007, pp 15 – 16. ISSN:  0013-5194

  90. Xiong Y.-Z., Issaoun A., Nan L., Shi J., Mouthaan K.: Simplified RF noise de-embedding method for on-wafer CMOS FET. Electronics Lett., Vol. 43, no 18, 2007, pp 1000 – 1001. DOI 10.1049/el:20071442

  91. F. Grassi, F. Marliani, S. A. Pignari: Circuit Modeling of Injection Probes for Bulk Current Injection. Trans on EMC, vol 49, no 3, August 2007, pp 563 – 576. DOI 10.1109/TEMC.2007.902385

  92. Vives-Gilabert Y., Arcambal C., Louis A., de Daran F., Eudeline P., Mazari B.: Modeling Magnetic Radiations of Electronic Circuits Using Near-Field Scanning Method. IEEE Trans on EMC, Vol. 49, no 2, 2007, pp 391 – 400. DOI 10.1109/TEMC.2006.890168

  93. Iorga C., Yi-Chang Lu, Dutton R.W.: A Built-in Technique for Measuring Substrate and Power-Supply Digital Switching Noise Using PMOS-Based Differential Sensors and a Waveform Sampler in System-on-Chip Applications. IEEE Trans on Instr. & Meas., Vol. 56, no 6, 2007, pp 2330 – 2337. DOI 10.1109/TIM.2007.908603

  94. Inasawa Y., Kuroda S., Kakizaki K., Nishikawa H., Yoneda N., Makino S.: Near-field to far-field transformation for RCS measurement including ground bounce. IEEE Int. Symp on Antennas and Propagation Society, 2007, pp 1629 – 1632. DOI 10.1109/APS.2007.4395823

  95. Zhang Jingkai, Lee Chung Len, Tian Chao, Yu Fei: On-chip multi-giga bit cycle-to-cycle jitter measurement circuit. Tsinghua Science and Technology, Vol. 12, no S1, 2007, pp 1 – 7. DOI 10.1016/S1007-0214(07)70075-5

  96. Xueqing Wang, Eisenstadt W.R., Fox R.M.: Embedded Jitter Measurement of High-speed I/O Signals. IEEE Int. Symp on Circuits and Systems (ISCAS), 2007, pp 153 – 156. DOI 10.1109/ISCAS.2007.378244

  97. Nose K., Kajita M., Mizuno M.: A 1ps-Resolution Jitter-Measurement Macro Using Interpolated Jitter Oversampling. IEEE Int. Solid-State Circuits Conference (ISSCC 2006) Digest of Technical Papers, 2006, pp 2112 – 2121. DOI 10.1109/ISSCC.2006.1696271

  98. Kaija T., Ristolainen E.O.: An improved model for ground-shielded CMOS test fixtures. IEEE IEEE Trans on MTT, Vol. 54, no 1, 2006, pp 82 – 87. DOI 10.1109/TMTT.2005.860895

  99. Weize Xu, Friedman E.G.: On-chip test circuit for measuring substrate and line-to-line coupling noise. IEEE J. of SSC, vol 41, no 2, Febr. 2006, pp 474 – 482. DOI 10.1109/JSSC.2005.862349

  100. Urabe J., Fujii K., Dowaki Y., Jito Y., Matsumoto Y., Sugiura A.: A Method for Measuring the Characteristics of an EMI Suppression Ferrite Core. IEEE Trans on EMC, Vol. 48, no 4, 2006, pp 774 – 780. DOI 10.1109/TEMC.2006.884507

  101. Dhanasekaran R., M.Rajaram, S.N.Sivanandam: Mixed Mode EMI Noise Level Measurement in SMPS. American Journal of Applied Sciences, Vol. 3, no. 5, 2006, pp 1824 – 1830. ISSN 1546-9239

  102. De Wilde, M., Meeus, W., Rombouts, P., Van Campenhout, J.: A simple on-chip repetitive sampling setup for the quantification of substrate noise. IEEE J. of SSC, vol 41, no 5, May 2006, pp 1062 – 1072. DOI 10.1109/JSSC.2006.872873

  103. Braun S., Russer P.: Taking Time-Domain EMI Measurements According to International EMC Standards. http://www.ce-mag.com/archive/06/ARG/braun.htm

  104. Chet Lo, Furse C.: Noise-domain reflectometry for locating wiring faults. IEEE Trans on EMC, Vol. 47, no 1, 2005, pp 97 – 104. DOI 10.1109/TEMC.2004.842109

  105. Pommerenke D., Chundru R., Chandra S.: A new test setup and method for the calibration of current clamps. IEEE Trans on EMC, Vol. 47, no 2, 2005, pp 335 – 343. DOI 10.1109/TEMC.2005.847381

  106. Zamek I., Zamek S.: Definitions of jitter measurement terms and relationships. Proc. of IEEE Int. Test Conference (ITC 2005), 2005, pp 10 – 34. DOI 10.1109/TEST.2005.1583959

  107. Jin Shi, Cracraft M.A., Slattery K.P., Yamaguchi M., DuBroff R.E.: Calibration and compensation of near-field scan measurements. IEEE Trans on EMC, Vol. 47, no 3, 2005, pp 642 – 650. DOI 10.1109/TEMC.2005.853165

  108. Pfeiffer U., Welch B.: Equivalent Circuit Model Extraction of Flip-Chip Ball Interconnects Based on Direct Probing Techniques. IEEE Microwave & Wireless Comp. Let., vol 15, no 9, Sept 2005, pp 594 – 596. DOI 10.1109/LMWC.2005.855380

  109. Kim Fung Tsang, Chung Ming Yuen: Phase noise measurement of free-running microwave oscillators at 5.8 GHz using 1/3-subharmonic injection locking. IEEE Microwave and Wireless Components Letters, Vol. 15, no 4, 2005, pp 217 – 219. DOI 10.1109/LMWC.2005.845695

  110. Murano K., Fengchao Xiao, Kami Y.: An immunity/susceptibility test method using electromagnetic wave of rotating polarization. IEEE Trans on Instr. & Meas., Vol. 53, no 4, 2004, pp 1184 – 1191. DOI 10.1109/TIM.2004.831452

  111. Sali S.: Cable shielding measurements at microwave frequencies. IEEE Trans on EMC, Vol. 46, no 2, 2004, pp 178 – 188. DOI 10.1109/TEMC.2004.826893

  112. Badaroglu M., Van der Plas G., Wambacq P., Balasubramanian L., Tiri K., Verbauwhede I.,
    Donnay S., Gielen G.G.E., De Man H.J.: Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate. IEEE Journal of SSC, Vol. 39, no 7, 2004, pp 1119 – 1130. DOI 10.1109/JSSC.2004.829393

  113. Kuo A., Farahmand T., Ou N., Tabatabaei S., Ivanov A.: Jitter models and measurement methods for high-speed serial interconnects. Proc. of IEEE Int. Test Conference (ITC 2004), 2004, pp 1295 – 1302. DOI 10.1109/TEST.2004.1387404

  114. Nandakumar V., Companieh A., Gallian A., Muller M.W., Indeck R.S.: Jitter measurements in magnetic recording. IEEE Trans on Magnetics, Vol. 40, no 4, 2004, pp 2314 – 2316. DOI 10.1109/TMAG.2004.829822

  115. Spadacini G., Pignari S.A.: A bulk current injection test conforming to statistical properties of radiation-induced effects. IEEE Trans on EMC, Vol. 46, no 3, 2004, pp 446 – 458. DOI 10.1109/TEMC.2004.831896

  116. Marvin A.C., Dawson J.F., Ward S., Dawson L., Clegg J., Weissenfeld A.: A proposed new definition and measurement of the shielding effect of equipment enclosures. IEEE Trans on EMC, Vol. 46, no 3, 2004, pp 459 – 468. DOI 10.1109/TEMC.2004.831901

  117. Muhtaroglu A., Taylor G., Rahal-Arabi T.: On-Die Droop Detector for Analog Sensing of Power Supply Noise. IEEE JSSC, Vol 39, No 4, April 2004, pp. 651 – 660. DOI 10.1109/JSSC.2004.825120

  118. Castaldo D., Gallo D., Landi C., Testa A.: A digital instrument for nonstationary disturbance analysis in power lines. IEEE Trans on Instr. & Meas., Vol. 53, no 5, 2004, pp 1353 – 1361. DOI 10.1109/TIM.2004.830596

  119. Tian Xia, Jien-Chung Lo: Time-to-voltage converter for on-chip jitter measurement. IEEE Trans on Instr. & Meas., Vol. 52, no 6, 2003, pp 1738 – 1748. DOI 10.1109/TIM.2003.818731

  120. Kolding T., Iversen C.: Simple Noise Deembedding Technique for On-Wafer Shield-Based Test Fixtures. IEEE Trans. on MTT, vol. 51, no. 1, Jan. 2003, pp 11 – 14. DOI 10.1109/TMTT.2002.806938

  121. Fiori F.: Experimental Evaluation of IC Susceptibility to RFI. http://www.ce-mag.com/ce-mag.com/archive/01/03/0103CE_062.html

  122. Krug F., Russer P.: The time-domain electromagnetic interference measurement system. IEEE Trans on EMC, Vol. 45, no 2, 2003, pp 330 – 338. DOI 10.1109/TEMC.2003.811303

  123. Cerri G., De Leo R., Primiani V.M., Pennesi S., Russo P.: Wide-band characterization of current probes. IEEE Trans on EMC, Vol. 45, no 4, 2003, pp 616 – 625. DOI 10.1109/TEMC.2003.819061

  124. Fiori F., Musolino F.: Comparison of IC conducted emission measurement methods. IEEE Trans on Instr. & Meas., Vol. 52, no 3, 2003, pp 839 – 845. DOI 10.1109/TIM.2003.814685

  125. Shen-Shu Xiong, Zhao-Ying Zhou: Neural filtering of colored noise based on Kalman filter structure. IEEE Trans on Instr. & Meas., Vol. 52, no 3, 2003, pp 742 – 747. DOI 10.1109/TIM.2003.814669

  126. Henry L. G., Barth J., Verhaege K., Richner J.: Transmission-Line Pulse ESD Testing of ICs: A New Beginning. http://www.ce-mag.com/ce-mag.com/archive/01/03/0103CE_046.html

  127. Weize Xu, Friedman E.G.: A circuit technique for accurately measuring coupling capacitance. 15th Annual IEEE ASIC/SOC Int. Conf., 25-28 Sept. 2002, pp 176 – 180. ISBN: 0-7803-7494-0

  128. De Capua C., Landi C.: A Digital Measurement Station for RF-Conducted Emissions Monitoring. IEEE Trans on Instr & Meas, Vol.51, No.6, Dec 2002, pp 1363 – 1367. DOI 10.1109/TIM.2002.808029

  129. Klingler M., Egot S., Ghys J.-P., Rioult J.: On the use of 3-D TEM cells for total radiated power measurements. IEEE Trans on EMC, Vol. 44, no 2, 2002, pp 364 – 372. DOI 10.1109/TEMC.2002.1003402

  130. Wilson P.F., Hill D.A., Holloway C.L.: On determining the maximum emissions from electrically large sources. IEEE Trans on EMC, Vol. 44, no 1, 2002, pp 79 – 86. DOI 10.1109/15.990713

  131. Yong-Ju Kim, Jae-Kyung Wee, Young-Hee Kim, Seongsoo Lee: Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter. Electronics Lett., Vol. 38, no 17, 2002, pp 969 – 970. DOI 10.1049/el:20020683

  132. Murano K., Kami Y.: A new immunity test method. IEEE Trans on EMC, Vol. 44, no 1, 2002, pp 119 – 124. DOI 10.1109/15.990717

  133. Dvorak S.L., Sternberg B.K.: Suppression of phase-noise interference due to closely spaced data and calibration signals. IEEE Trans on Instr. & Meas., Vol. 51, no 6, 2002, pp 1157 – 1162. DOI 10.1109/TIM.2002.808051

  134. De Capua C., Landi C.: A digital measurement station for RF-conducted emissions monitoring. IEEE Trans on Instr. & Meas., Vol. 51, no 6, 2002, pp 1363 – 1366. DOI 10.1109/TIM.2002.808029

  135. Tzong-Lin Wu, Yen-Hui Lin, Jiuun-Nan Hwang, Jig-Jong Lin: The effect of test system impedance on measurements of ground bounce in printed circuit boards. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 600 – 607. DOI 10.1109/15.974640

  136. Rolain Y., Van Moer W., Vandersteen G., van Heijningen M.: Measuring mixed-signal substrate coupling. IEEE Trans on Instr. & Meas., Vol. 50, no 4, 2001, pp 959 – 964. DOI 10.1109/19.948307

  137. Van Horck F.B.M., Van Deursen A.P.J., Van der Laan P.C.T.: Common-mode currents generated by circuits on a PCB-measurements and transmission-line calculations. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 608 – 617. DOI 10.1109/15.974641

  138. Tae-Weon Kang, Hyo-Tae Kim: Reproducibility and uncertainty in radiated emission measurements at open area test sites and in semianechoic chambers using a spherical dipole radiator. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 677 – 685. DOI 10.1109/15.974650

  139. Audone B., Buzzo Margari M.: The use of MUSIC algorithm to characterize emissive sources. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 688 – 693. DOI 10.1109/15.974652

  140. Sato T., Sylvester D., Cao Y., Hu C.: Accurate In Situ Measurement of Peak Noise and Delay Change Induced by Interconnect Coupling. IEEE J. of Solid-State Circ, 36(10), Oct 2001, pp 1587 – 1591. DOI 10.1109/4.953489

  141. Tzong-Lin Wu, Yen-Hui Lin, Jiuun-Nan Hwang, Jig-Jong Lin: The effect of test system impedance on measurements of ground bounce in printed circuit boards. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 600 – 607. DOI 10.1109/15.974640

  142. De Leo R., Cerri G., Claretti L., Mariaini Primiani V., Moglie F., Moscariello M., de Riso M.: Cars: Modeling the Electromagnetic Field for Radiated Immunity Tests. Compliance Engineering, March/April 2001, http://www.ce-mag.com/ce-mag.com/archive/01/03/0103CE_036.html

  143. E. Vandamme, D. Schreurs, C. van Dinther: Improved Three-Steps De-Embedding Method to Accurately Account for the Influence of Pad Parasitics in Silicon On-Wafer RF Test-Structures. IEEE Trans. on ED, vol. 48, no. 4, April 2001, pp 737 – 742. DOI 10.1109/16.915712

  144. Fiori F., Musolino F.: Measurement of integrated circuit conducted emissions by using a transverse electromagnetic mode (TEM) cell. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 622 – 628. DOI 10.1109/15.974643

  145. Jui-Chu Lee, Young R., Liou J.J., Croft G.D., Bernier J.C.: An improved experimental setup for electrostatic discharge (ESD) measurements based on transmission line pulsing technique. IEEE Trans on Instr. & Meas., Vol. 50, no 6, 2001, pp 1808 – 1814. DOI 10.1109/19.982985

  146. Cerri G. Coacco F., Fenucci L., Primiani V.M.: Measurement of magnetic fields radiated from ESD using field sensors. IEEE Trans on EMC, Vol. 43, no 2, 2001, pp 187 – 196. DOI 10.1109/15.925539

  147. Namba A., Wada O., Toyota Y., Fukumoto Y., Zhi Liang Wang, Koga R., Miyashita T., Watanabe T.: A simple method for measuring the relative permittivity of printed circuit board materials. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 515 – 519. DOI 10.1109/15.974630

  148. Hilty K., Ryser H., Herrmann U.: Calibration of electrostatic discharge generators and results of an international comparison. IEEE Trans on Instr. & Meas., Vol. 50, no 2, 2001, pp 414 – 418. DOI 10.1109/19.918155 

  149. Tzong-Lin Wu, Yen-Hui Lin, Jiuun-Nan Hwang, Jig-Jong Lin: The effect of test system impedance on measurements of ground bounce in printed circuit boards. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 600 – 607. DOI 10.1109/15.974640

  150. Voorakaranam R., Chatterjee A.: Low-cost jitter measurement technique for phase-locked loops. Proc of the 43rd IEEE Midwest Symp on Circuits and Systems, 2000, Vol. 2, pp 956 – 959. DOI 10.1109/MWSCAS.2000.952912

  151. Roy L., Rollin J.J., Arcari G.: Measurement of IC package shielding effectiveness using an integrated antenna. IEEE Trans on Instr. & Meas., Vol. 49, no 2, 2000, pp 409 – 412. DOI 10.1109/19.843087

  152. Jih-Jong Lin, Tzong-Lin Wu : FDTD modeling of the coaxial feed effect on the measurement of the ground bounce in the high speed digital PCB. IEEE Int. Symp on EMC, Vol. 2, 2000, pp 807 – 810. DOI 10.1109/ISEMC.2000.874725

  153. Tae-Weon Kang, Yeon-Choon Chung, Sung-Ho Won, Hyo-Tae Kim: On the uncertainty in the current waveform measurement of an ESD generator. IEEE Trans on EMC, Vol. 42, no 4, 2000, pp 405 – 413. DOI 10.1109/15.902310

  154. Mardiana R., Kawasaki Z.: Broadband radio interferometer utilizing a sequential triggering technique for locating fast-moving electromagnetic sources emitted from lightning. IEEE Trans on Instr. & Meas., Vol. 49, no 2, 2000, pp 376 – 381. DOI 10.1109/19.843081 

  155. Li M., Li J.: A New Type of Grounding Resistance Measurement Method. IEEE Trans on Instr & Meas, Vol 48, no 5, Oct. 1999, pp 899 – 902. DOI 10.1109/19.799643

  156. Makie-Fukuda K., Anbo T., Tsukada T.: Substrate Noise Measurement by Using Noise-Selective Voltage Comparators in Analog and Digital Mixed Signal Integrated Circuits. IEEE Trans. on Instr & Meas., Vol. 48, no. 6, Dec. 1999, pp 1068 – 1072. DOI 10.1109/19.816115

  157. Pfost M., Rein H.: Modeling and measurement of substrate coupling in Si-bipolar ICs up to 40 GHz. IEEE Journal of Solid-State Circuits, Vol 33, no 4, 1998, pp 582 – 591. DOI 10.1109/4.663563

  158. Münter K., Pape R., Glimm J.: Portable E-Field Strength Meter and its Traceable Calibration Up to 1 GHz Using a TEM Cell. IEEE Trans on Instr & Meas., Vol. 46, no 2, April 1997, pp 549 – 550. DOI 10.1109/19.571908

  159. Makie-Fukuda K., Kikuchi T., Matsuura T., Hotta M.: Measurement of digital noise in mixed-signal integrated circuits. IEEE Journal of Solid-State Circuits, Vol. 30, no. 2, 1995, pp 87–92. DOI 10.1109/4.341734

  160. Hirano N., Miura M., Hiruta Y., Sudo T.: Characterization and reduction of simultaneous switching noise for a multilayer package. Proc. on 44th Electronic Components and Technology Conf., 1994, pp 949 – 956. DOI 10.1109/ECTC.1994.367514

  161. IEEE Methods of Measurement of Radio-Noise Emissions From Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz. 1992, DOI 10.1109/IEEESTD.1992.81716

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