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GROUND NOISE

Like diseases, noise is never eliminated, just prevented, cured, or endured,

depending on its nature, seriousness, and the cost/difficulty of treating.

 (Sheingold)

  1. Engin A.E., Ndip I., Lang K.D.: Higher-order virtual ground fence design for filtering power plane noise. IEEE 20th Workshop on Signal and Power Integrity (SPI), 2016, pp. 1 – 3. DOI 10.1109/SaPIW.2016.7496286

  2. Stumpf M.: Analysis of Dispersive Power-Ground Structures Using the Time-Domain Contour Integral Method. IEEE Trans on EMC, Vol. 57, no. 2, 2015, pp. 224 – 231. DOI 10.1109/TEMC.2014.2366491

  3. Kontargyri V.T., Gonos I.F., Stathopulos I.A.: Study on Wind Farm Grounding System. IEEE Trans on Industry Applications, Vol. 51, no. 6, 2015, pp. 4969 – 4977. DOI 10.1109/TIA.2015.2418315

  4. Jinpeng Wu, Bo Zhang, Jinliang He, Rong Zeng: A Comprehensive Approach for Transient Performance of Grounding System in the Time Domain. IEEE Trans on EMC, Vol. 57, no. 2, 2015, pp. 250 – 256. DOI 10.1109/TEMC.2014.2366875

  5. Wenxia Sima, Peng Wu, Tao Yuan, Qing Yang, Bin Zhu, Yang Bai: Method for the estimation of soil structure in the vicinity of a grounding system. IET Science, Measurement & Technology, Vol. 9, no. 7, 2015, pp. 800 – 806. DOI 10.1049/iet-smt.2014.0361

  6. Zhang Zhenyuan, Lee Wei-Jen, Dini D.A.: Grounding and Isolation of Sensitive Measurement Equipment for Arc Flash Testing at High-Power Laboratory. IEEE Trans on Industry Applications, Vol. 51, no. 6, Part 2, 2015, pp. 5281 – 5287. DOI 10.1109/TIA.2015.2411654

  7. Sun J., Wang P., Zhang H.: Reducing power-supply and ground noise induced timing jitter in short pulse generation circuits. IEEE Symp on Electromagnetic Compatibility and Signal Integrity (EMCSI), 2015, pp. 17 – 21. DOI 10.1109/EMCSI.2015.7107652

  8. Ko J., An C.H., Kwon C.K., Kim S.W., Kim C.: Rail-to-rail regulating voltage-controlled oscillator with low supply and ground noise sensitivity. Electronics Lett., Vol. 51, no. 24, 2015, pp. 1980 – 1982. DOI 10.1049/el.2015.3128

  9. Kim M.: A Compact EBG Structure With Wideband Power/Ground Noise Suppression Using Meander-Perforated Plane. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 595 – 598. DOI 10.1109/TEMC.2015.2405615

  10. Shi Y., Tang W., Liu S., Wang C., Zhuang W.: Mode Analysis of Miniaturized and Stopband-Enhanced Composite Electromagnetic Bandgap Structure for Power/Ground Noise Suppression. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 532 – 537. DOI 10.1109/TEMC.2014.2387949

  11. Trifunovic J., Kostic M.B.: An Algorithm for Estimating the Grounding Resistance of Complex Grounding Systems Including Contact Resistance. IEEE Trans on Industry Applications, Vol. 51, no. 6, 2015, pp. 5167 – 5174. DOI 10.1109/TIA.2015.2429644

  12. Cafaro G. et al.: The Global Grounding System: Definitions and guidelines. IEEE Int. Conf on Environment and Electrical Eng. (EEEIC), 2015, pp. 537 – 541. DOI 10.1109/EEEIC.2015.7165219

  13. Kokorus M., Zildzo H., Gacanovic R., Ahmovic A.: Modeling of phenomena in the grounding system including fields correlation. IEEE Int. Conf on Computer as a Tool (EUROCON), 2015, pp.1 – 6. DOI 10.1109/EUROCON.2015.7313721

  14. Angelov J., Vuletić J., Ačkovski R., Todorovski M.: An Extension in Cable Modeling for Grounding System Analysis. IEEE Trans on Industry Applications, Vol. 51, no. 6, 2015, pp. 5086 – 5094. DOI 10.1109/TIA.2015.2409807

  15. Sekioka S., Lorentzou M.I., Hatziargyriou N.D.: Approximate Formulas for Terminal Voltages on the Grounding Conductor. IEEE Trans on EMC, Vol. 56, no. 2, 2014, pp. 444 – 453. DOI 10.1109/TEMC.2013.2287015

  16. Run Xiong, Bin Chen, Cheng Gao, Yun Yi, Wen Yang: FDTD Calculation Model for the Transient Analyses of Grounding Systems. IEEE Trans on EMC, Vol. 56, no. 5, 2014, pp. 1155 – 1162. DOI 10.1109/TEMC.2014.2313918

  17. Choi, J.H., Hon, P.W.C., Itoh, T.: Dispersion Analysis and Design of Planar Electromagnetic Bandgap Ground Plane for Broadband Common-Mode Suppression. IEEE Microwave & Wireless Comp. Lett., Vol. 24, no. 11, 2014, pp. 772 – 774. DOI 10.1109/LMWC.2014.2303166

  18. Myunghoi Kim, Dong Gun Kam: A Wideband and Compact EBG Structure With a Circular Defected Ground Structure. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 4, no. 3, 2014, pp. 496 – 503. DOI 10.1109/TCPMT.2013.2285407

  19. Jae Young Choi, Swaminathan M.: Modeling of Power/Ground Planes Using Triangular Elements. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 4, no. 2, 2014, pp. 291 – 302. DOI 10.1109/TCPMT.2013.2277659

  20. Cavka D., Rachidi F., Poljak D.: On the Concept of Grounding Impedance of Multipoint Grounding Systems. IEEE Trans on EMC, Vol. 56, no. 6, 2014, pp. 1540 – 1544. DOI 10.1109/TEMC.2014.2341043

  21. Lee E. et al.: Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2014, pp. 260 – 264. DOI 10.1109/ISEMC.2014.6898981

  22. Cheng Lin, Wang Sen, Li Zhizhong, Wang Jing, Zhang Bo, Shi Weidong: Design of grounding system for wind-photovoltaic-energy storage Hybrid power station. Int. Conf on High Voltage Engineering and Application (ICHVE), 2014, pp. 1-5. DOI 10.1109/ICHVE.2014.7035509

  23. Yutthagowith P.: Transient characteristics of grounding systems. Int.Electrical Eng. Congress (iEECON), 2014, pp. 1-5. DOI 10.1109/iEECON.2014.6925975

  24. Guang-Hwa Shiue, Chi-Lou Yeh, Pei-Wei Huang, Huan-Yi Liao, Zhi-Hao Zhang: Ground Bounce Noise Induced by Crosstalk Noise for Two Parallel Ground Planes With a Narrow Open-Stub Line and Adjacent Signal Traces in Multilayer Package Structure. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 4, no. 5, 2014, pp. 870 – 881. DOI 10.1109/TCPMT.2014.2299281

  25. Bhattacharyya B.K., Laskar N., Debnath S., Baral D.: Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 4, no. 9, 2014, pp. 1489 – 1494. DOI 10.1109/TCPMT.2014.2339272

  26. Deokjin Joo, Taewhan Kim: A Fine-Grained Clock Buffer Polarity Assignment for High-Speed and Low-Power Digital Systems. IEEE Trans on CAD of Integrated Circuits and Systems, Vol. 33, no. 3, 2014, pp. 423 – 436. DOI 10.1109/TCAD.2013.2288698

  27. Mingjing Chen, Orailoglu A.: Examining Timing Path Robustness Under Wide-Bandwidth Power Supply Noise Through Multi-Functional-Cycle Delay Test. IEEE Trans on VLSI, Vol. 22, no. 4, 2014, pp. 734 – 746. DOI 10.1109/TVLSI.2013.2256810

  28. Araga Y., Nagata M., Van der Plas G., Marchal P., Libois M., La Manna A., Wenqi Zhang, Beyer G., Beyne E.: Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 4, no. 6, 2014, pp. 1026 – 1037. DOI 10.1109/TCPMT.2014.2316150

  29. Kumar Y., Paliwal S., Sahu P., Balasubramanian S.K.: Ground bounce noise minimization using Multi-VDD Level Converter. IEEE Int. Conf on Electronics, Computing & Communication Technologies (CONECCT), 2014, pp.1 – 4. DOI 10.1109/CONECCT.2014.6740179

  30. Asokan A., Todri-Sanial A., Bosio A., Dilillo L., Girard P., Pravossoudovitch S., Virazel A.: Path delay test in the presence of multi-aggressor crosstalk, power supply noise and ground bounce. IEEE Int. Symp on Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2014, pp. 207 – 212. DOI 10.1109/DDECS.2014.6868791

  31. Yang De-Cao, Wei Xing-Chang, Zhang Xue-Cang, Zhang Ling-Song, Li Er-Ping: A Novel Hybrid Analytical Method for Impedance Calculation of Power and Ground Planes. IEEE Trans on EMC, Vol. 55, no. 5, 2013, pp. 949 – 955. DOI 10.1109/TEMC.2013.2241068

  32. Yu-Chieh Lee, Wen-Yang Hsu, Tai-Ting Huang, Hsin Chen: A compact Gm-C filter architecture with an ultra-low corner frequency and high ground-noise rejection. IEEE Biomedical Circuits and Systems Conf. (BioCAS), 2013, pp. 318 – 321. DOI 10.1109/BioCAS.2013.6679703

  33. Todri A., Bosio A., Dilillo L., Girard P., Virazel A.: Uncorrelated Power Supply Noise and Ground Bounce Consideration for Test Pattern Generation. IEEE Trans on VLSI, Vol. 21, no. 5, 2013, pp. 958 – 970. DOI 10.1109/TVLSI.2012.2197427

  34. Singh R., Akashe S.: New high performance low power 4 bit full adder with reduce ground bounce noise. Int. Conf. on Advanced Electronic Systems (ICAES), 2013, pp.346 – 349. DOI 10.1109/ICAES.2013.6659428

  35. Seunghyun Hwang, Daehyun Chung, Satagopan V., Sudhakaran S., Lin D., Moghadam F.: Simultaneous switching noise model by distributed power port and ground current capture. IEEE Electronic Components and Technology Conf. (ECTC), 2013, pp. 1076 – 1080. DOI 10.1109/ECTC.2013.6575707

  36. Yongrong Shi, Wanchun Tang, Sheng Liu, Xin Rao, Chow Y.L.: Ultra-Wideband Suppression of Power/Ground Noise in High-Speed Circuits Using a Novel Electromagnetic Bandgap Power Plane. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 4, 2013, pp. 653 – 660. DOI 10.1109/TCPMT.2012.2235529

  37. Kumar Y., Paliwal S., Rai C.K., Balasubramanian S.K.: A novel ground bounce reduction technique using four step power gating. Students Conf. on Engineering and Systems (SCES), 2013, pp. 1 – 5 DOI 10.1109/SCES.2013.6547487

  38. Chuen-De Wang, Tzong-Lin Wu: Model and Mechanism of Miniaturized and Stopband-Enhanced Interleaved EBG Structure for Power/Ground Noise Suppression. IEEE Trans on EMC, Vol. 55, no. 1, 2013, pp. 159 – 167. DOI 10.1109/TEMC.2012.2210900

  39. Weichen Liu, Yu Wang, Xuan Wang, Jiang Xu, Huazhong Yang: On-Chip Sensor Network for Efficient Management of Power Gating-Induced Power/Ground Noise in Multiprocessor System on Chip. IEEE Trans on Parallel & Distributed Systems, Vol. 24, no. 4, 2013, pp. 767 – 777. DOI 10.1109/TPDS.2012.193

  40. Akbari M., Sheshyekani K., Alemi M.R.: The Effect of Frequency Dependence of Soil Electrical Parameters on the Lightning Performance of Grounding Systems. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 739 – 746. DOI 10.1109/TEMC.2012.2222416

  41. Packiaraj D., Vinoy K.J., Nagarajarao P., Ramesh M., Kalghatgi A.T.: Miniaturized Defected Ground High Isolation Crossovers. IEEE Microwave & Wireless Comp. Lett., Vol. 23, no. 7, 2013, pp. 347 – 349. DOI 10.1109/LMWC.2013.2263219

  42. Pen-Li You, Tzuen-Hsi Huang: A Switched Inductor Topology Using a Switchable Artificial Grounded Metal Guard Ring for Wide-FTR MMW VCO Applications. IEEE Trans on ED, Vol. 60, no. 2, 2013, pp. 759 – 766. DOI 10.1109/TED.2012.2234750

  43. Khan N.H., Alam S.M., Hassoun S.: GND Plugs: A Superior Technology to Mitigate TSV-Induced Substrate Noise. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 5, 2013, pp. 849 – 857. DOI 10.1109/TCPMT.2013.2241178

  44. Chun-Hsiang Huang, Tzong-Lin Wu: Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 1, 2013, pp. 21 – 30. DOI 10.1109/TCPMT.2012.2220139

  45. Liu Y., Lee J., Kim H.H., Kim H.: Ground radiation method using slot with coupling capacitors. Electronics Lett., Vol. 49, no. 7, 2013, pp. 447 – 448. DOI 10.1049/el.2012.4520

  46. Adamshick S., Coolbaugh D., Liehr M.: Feasibility of coaxial through silicon via 3D integration. Electronics Lett., Vol. 49, no. 16, 2013, pp. 1028 – 1030. DOI 10.1049/el.2013.1165

  47. Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang, Yujeong Shim, Joungho Kim, Jonghoon Kim: A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs. IEEE Trans on EMC, Vol. 54, no. 3, 2012, pp. 689 – 695. DOI 10.1109/TEMC.2012.2187662

  48. Theodoulidis T.: Exact Solution of Pollaczek's Integral for Evaluation of Earth-Return Impedance for Underground Conductors. IEEE Trans on EMC, Vol. 54, no. 4, 2012, pp. 806 – 814. DOI 10.1109/TEMC.2011.2181849

  49. Xinbo He, Hubing T., Haixin Ke, Kobayashi N., Morishita K., Harada T.: Calculation of Optimal Ground Post Resistance for Reducing Emissions from Chassis-Mounted Printed Circuit Boards. IEEE Trans on EMC, Vol. 53, no. 2, 2011, pp. 475 – 481. DOI 10.1109/TEMC.2011.2104375

  50. Huadong Li, Subramanyam G.: Closed-Form Expression for the Net Ground Plane Inductance of Coplanar Stripline PCBs. IEEE Trans on EMC, Vol. 53, no. 2, 2011, pp. 531 – 533. DOI 10.1109/TEMC.2011.2107577

  51. Jun Zou, JunJie Li, Lee J.B., Chang S.H.: Fast and Highly Accurate Algorithm for Calculating the Earth-Return Impedance of Underground Conductors. IEEE Trans on EMC, Vol. 53, no. 1, 2011, pp. 237-240 DOI 10.1109/TEMC.2010.2057432

  52. Yutthagowith P., Ametani A., Nagaoka N., Baba Y.: Application of the Partial Element Equivalent Circuit Method to Analysis of Transient Potential Rises in Grounding Systems. IEEE Trans on EMC, Vol. 53, no. 3, 2011, pp. 726 – 736. DOI 10.1109/TEMC.2010.2077676

  53. Cooray V., Rakov V.A.: Engineering Lightning Return Stroke Models Incorporating Current Reflection From Ground and Finitely Conducting Ground Effects. IEEE Trans on EMC, Vol. 53, no. 3, 2011, pp. 773 – 781. DOI 10.1109/TEMC.2011.2113350

  54. Henglin Chen, Chen Chen, Yuancheng Ren: Modeling and Characterization of Incomplete Shielding Effect of GND on Common-Mode EMI of a Power Converter. IEEE Trans on EMC, Vol. 53, no. 3, 2011, pp. 676 – 683. DOI 10.1109/TEMC.2011.2155660

  55. Arnautovski-Toseva V., Grcev L.: Image and Exact Models of a Vertical Wire Penetrating a Two-Layered Earth. IEEE Trans on EMC, Vol. 53, no. 4, 2011, pp. 968 – 976. DOI 10.1109/TEMC.2011.2149533

  56. Saxena R. S., Bhan R. K., Saini N.K., Muralidharan R.: Virtual Ground Technique for Crosstalk Suppression in Networked Resistive Sensors. IEEE Sensors Journal, Vol. 11, no 2, 2011, pp 432 – 433. DOI 10.1109/JSEN.2010.2060186

  57. Guan-Zong Wu, Yi-Che Chen, Tzong-Lin Wu: Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression. IEEE Trans. on Advanced Packaging, Vol. 33, no. 1, 2010, pp. 206 – 211. DOI 10.1109/TADVP.2009.2034334

  58. Scogna A.C., Tzong-Lin Wu, Orlandi A.: Noise Coupling Mitigation in PWR/GND Plane Pair by Means of Photonic Crystal Fence: Sensitivity Analysis and Design Parameters Extraction. IEEE Trans. on Advanced Packaging, Vol. 33, no. 3, 2010, pp. 574 – 581. DOI 10.1109/TADVP.2009.2036596

  59. Chuntian Liu, Junfa Mao, Min Tang: A New Power-Ground Plane Modeling Method With Rectangle and Triangle Segmentation. IEEE Trans. on Advanced Packaging, Vol. 33, no. 3, 2010, pp. 639 – 646. DOI 10.1109/TADVP.2009.2037603

  60. Wang Shuo, Maillet Y.Y., Wang Fei, Lai Rixin, Luo Fang, Boroyevich D.: Parasitic Effects of Grounding Paths on Common-Mode EMI Filter's Performance in Power Electronics Systems. IEEE Trans on Industrial Electronics, Vol. 57, no 9, 2010, pp 3050 – 3059. DOI 10.1109/TIE.2009.2037643

  61. Chen Henglin, Meing Peipei, Li Jie, Qian Zhaoming: Series-Connected Grounding of Common-Mode EMI Filter. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 1066 – 1068. DOI 10.1109/TEMC.2010.2072510

  62. Kapora S., Laermans E., van Deursen A. P. J.: Protection of Cables by Open-Metal Conduits. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 1026 – 1033. DOI 10.1109/TEMC.2010.2056374

  63. Wei Xing-Chang, Shi Zhi-Guo, Li Er-Ping: A Novel Combined Equivalent Networks Analysis for Power and Ground Planes With Narrow Slots. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 994 – 1000. DOI 10.1109/TEMC.2010.2064320

  64. Ametani A, Nishitsuji M, Nagaoka N, Baba Y, Okabe S: On the Equivalence of a Conducting Plate in a Laboratory Experiment to a Real Earth. IEEE Trans on EMC, Vol. 52, no 3, 2010, pp 691 – 698. DOI 10.1109/TEMC.2009.2036161

  65. Xiaomin Duan, Rimolo-Donadio R., Brüns H.-D., Schuster C.: A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 487 – 495. DOI 10.1109/TEMC.2010.2041238

  66. Loan S.A., Qureshi S., Iyer S.: A Novel Partial-Ground-Plane-Based MOSFET on Selective Buried Oxide: 2-D Simulation Study. IEEE Trans on ED, Vol. 57, no 3, 2010, pp 671 – 680. DOI 10.1109/TED.2009.2039545

  67. Jiao H., Kursun V.: Ground-Bouncing-Noise-Aware Combinational MTCMOS Circuits. IEEE Trans on CAS I: Regular Papers, Vol. 52, no 2, 2010, pp 1 – 1. DOI 10.1109/TCSI.2010.2041505

  68. Bell J.M., Iskander M.F.: Experimental Analysis of an Ultrawideband Hybrid EBG/Ferrite Ground Plane. IEEE Trans on Instr. & Meas., Vol. 58, no 8, 2009, pp 2899 – 2905. DOI 10.1109/TIM.2009.2016374

  69. Sharma R., Chakravarty T., Bhattacharyya A.B.: Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks. IEEE Trans on EMC, Vol. 51, no 1, 2009, pp 67 – 77. DOI 10.1109/TEMC.2008.2010054

  70. Bhanuprakash R., Pattanaik M., Rajput S.S., Mazumdar K.: Analysis and reduction of ground bounce noise and leakage current during mode transition of stacking power gating logic circuits. TENCON 2009 - IEEE Region 10 Conf, 2009, pp 1 – 6. DOI 10.1109/TENCON.2009.5395850

  71. Hailong Jiao, Kursun V.: Ground bouncing noise suppression techniques for MTCMOS circuits. 1st Asia Symp on Quality Electronic Design, 2009, pp 64 – 70. DOI 10.1109/ASQED.2009.5206297

  72. Ting-Kuang Wang, Chia-Yuan Hsieh, Hao-Hsiang Chuang, Tzong-Lin Wu: Design and Modeling of a Stopband-Enhanced EBG Structure Using Ground Surface Perturbation Lattice for Power/Ground Noise Suppression. IEEE Trans on Microwave Theory & Techniques, Vol. 57, no 8, 2009, pp 2047 – 2054. DOI 10.1109/TMTT.2009.2025466

  73. R. Chen, H. Wang, Abhari R.: Suppression of power/ground noise using differential vias. Electrical Performance of Electronic Packaging, 2008, pp 325 – 328. DOI: 10.1109/EPEP.2008.4675946 

  74. Trinkle J., Cantoni A.: Impedance Expressions for Unloaded and Loaded Power Ground Planes. IEEE Trans on EMC, Vol. 50, no 2, 2008, pp 390 – 398. DOI 10.1109/TEMC.2008.919036

  75. Wei Xing-Chang, Li Er-Ping, Liu En-Xiao, Cui Xing: Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation. IEEE Trans on EMC, Vol. 50, no 3, part 2, 2008, pp 740 – 743. DOI 10.1109/TEMC.2008.924392

  76. C. L. Holloway, E. F. Kuester: Closed-Form Expressions for the Current Densities on the Ground Planes of Asymmetric Stripline Structures. IEEE Trans on EMC, Vol. 49, no 1, 2007, pp 49 – 57. DOI 10.1109/TEMC.2006.890219

  77. Jiwoon Park, Chunghyun Ryu, Changwook Yoon, Kyoungchoul Koo, Joungho Kim: Analysis of the Effect of Digital Power Ground Noise on Active Balun in UHF RFID SiP. 9th Electronics Packaging Technology Conference (EPTC 2007), 2007, pp 586 – 590. DOI 10.1109/EPTC.2007.4469737

  78. Maeno T., Unou T., Ichikawa K., Fujiwara O.: Slit Effect of Ground Patterns on Conducted Noise Currents from Printed Circuit Board. Proc of APMC 2007, pp 1 – 4. DOI 10.1109/APMC.2007.4555098

  79. Jun Zou, Bo Zhang, Jian Guo, Jin-Liang He, Jaebok Lee, Chang S.: Efficient evaluation of the [Z] matrix with method of moment in grounding analysis by using adaptive spatial sampling approach. IEEE Trans on EMC, Vol. 48, no 1, 2006, pp 33 – 41. DOI 10.1109/TEMC.2006.870712

  80. Zhao Zhihua, Yuan Jiansheng, Ma Weiming: Coupling model and impedance calculation of the steel ground loops with proximity effect. IEEE Trans on EMC, Vol. 48, no 3, 2006, pp 522 – 529. DOI 10.1109/TEMC.2006.877780

  81. Tsumura M., Baba Y., Nagaoka N., Ametani A.: FDTD Simulation of a Horizontal Grounding Electrode and Modeling of its Equivalent Circuit. IEEE Trans on EMC, Vol. 48, no 4, 2006, pp 817 – 825. DOI 10.1109/TEMC.2006.884448

  82. Karmakar N.C., Roy S.M., Balbin I.: Quasi-static modeling of defected ground structure. IEEE IEEE Trans on MTT, Vol. 54, no 5, 2006, pp 2160 – 2168. DOI 10.1109/TMTT.2006.873633

  83. D. E. Swenson: Grounding Considerations for an Electrostatic-Protected Area. Compliance Eng., 2006, http://www.ce-mag.com/archive/06/ARG/swenson.htm

  84. Salman E., Friedman E.G., Secareanu R.M.: Substrate and Ground Noise Interactions in Mixed-Signal Circuits. 2006 IEEE Int. SOC Conf., 2006, pp 293 – 296. DOI 10.1109/SOCC.2006.283901

  85. Chien-Lin Wang, Guang-Hwa Shiue, Wei-Da Guo, Ruey-Beei Wu: A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers. IEEE Trans on Microwave Theory & Techniques, Vol. 54, no 12, 2006, pp 4209 – 4217. DOI 10.1109/TMTT.2006.886387

  86. Zeeff T.M., Hubing T.H., Van Doren T.P.: Traces in proximity to gaps in return planes. IEEE Trans on EMC, Vol. 47, no 2, 2005, pp 388 – 392. DOI 10.1109/TEMC.2005.847405

  87. Rautio J. C.: Deembedding the Effect of a Local Ground Plane in Electromagnetic Analysis. IEEE Trans on MTT, Vol 53, no 2, February 2005, pp 770 – 776. DOI 10.1109/TMTT.2004.840576

  88. Kratyuk V., Vytyaz I., Un-Ku Moon, Mayaram K.: Analysis of supply and ground noise sensitivity in ring and LC oscillators. 2005 IEEE Int Symp on Circuits and Systems (ISCAS 2005), Vol. 6, pp 5986 – 5989. DOI 10.1109/ISCAS.2005.1466003

  89. Nagata M., Okumoto T., Taki K.: A built-in technique for probing power supply and ground noise distribution within large-scale digital integrated circuits. IEEE Journal of Solid-State Circuits, Vol. 40, no 4, 2005, pp 813 – 819. DOI 10.1109/JSSC.2005.845559

  90. Antonini G., Scogna A.C., Orlandi A.: Grounding, unbalancing and length effects on termination voltages of a twinax cable during bulk current injection. IEEE Trans on EMC, Vol. 46, no 2, 2004, pp 302 – 308. DOI 10.1109/TEMC.2004.826882

  91. Zhao Zhihua, Ma Weiming: Frequency characteristic of ground impedance for a flat steel plane. IEEE Trans on EMC, Vol. 45, no 2, 2003, pp 468 – 474. DOI 10.1109/TEMC.2003.811310

  92. Minjia Xu, Hubing T.H.: The development of a closed-form expression for the input impedance of power-return plane structures. IEEE Trans on EMC, Vol. 45, no 3, 2003, pp 478 – 485. DOI 10.1109/TEMC.2003.815531

  93. Chen L.H., Marek-Sadowska M., Brewer F.: Buffer delay change in the presence of power and ground noise. IEEE Trans on VLSI Systems, Vol 11, no 3, 2003, pp 461 – 473. DOI 10.1109/TVLSI.2003.812310

  94. Chen, J., Hubing T.H., Van Doren T.P., DuBroff R.E.: Power bus isolation using power islands in printed circuit boards. IEEE Trans on EMC, Vol. 44, no 2, 2002, pp 373 – 380. DOI 10.1109/TEMC.2002.1003403

  95. Sievenpiper D., Schaffner J., Navarro J.: Axial ratio improvement in aperture antennas using high-impedance ground plane. Electronics Lett., Vol. 38, no 23, 2002, pp 1411 – 1512. DOI 10.1049/el:20020984

  96. Van Deursen A.R.J., van Waes J.B.M.: Mitigation of ground loop effects in high-voltage measurements. IEEE Trans on Instr. & Meas., Vol. 51, no 3, 2002, pp 480 – 486. DOI 10.1109/TIM.2002.1017718

  97. Youchul J., Hyungsoo Kim, Jingook Kim, Jongbae Park, Joungho Kim: An efficient hybrid transmission line method (HTLM) for analysis of perforated package power/ground plane. Electrical Performance of Electronic Packaging, 2002, pp 179 – 182. DOI: 10.1109/EPEP.2002.1057910

  98. Chen L.H., Marek-Sadowska M., Brewer F.: Coping with buffer delay change due to power and ground noise. Proc of 39th DAC, 2002, pp 860 – 865. DOI 10.1109/DAC.2002.1012742

  99. C. T. Wu, G. H. Shiue, S. M. Lin, R. B. Wu: Composite effects of reflections and ground bounce for signal line through a split power plane. IEEE Trans on Adv. Packag., Vol. 25, no 2, 2002, pp 297 – 301. DOI 10.1109/TADVP.2002.803263

  100. Yaqing Liu, Zitnik M., Thottappillil R.: An improved transmission-line model of grounding system. IEEE Trans on EMC, Vol. 43, no 3, 2001, pp 348 – 355. DOI 10.1109/15.942606

  101. Feferko M., John W., Reichl H., De Smedt R., Vervoort K.: A mathematical model of ground-noise for short-channel transistors. IEEE Int. Symp on Electromagnetic Compatibility (ISEMC), Vol. 2, 2001, pp. 1179 – 1184. DOI 10.1109/ISEMC.2001.950596

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