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GROUND NOISE

Like diseases, noise is never eliminated, just prevented, cured, or endured,

depending on its nature, seriousness, and the cost/difficulty of treating.

 (Sheingold)

  1. Kherif O., Chiheb S., Teguar M., et al.: Time-Domain Modeling of Grounding Systems' Impulse Response Incorporating Nonlinear and Frequency-Dependent Aspects. IEEE Trans on EMC, Vol. 60, no. 4, 2018, pp. 907 – 916. DOI 10.1109/TEMC.2017.2751564

  2. Karami Hamidreza, Sheshyekani Keyhan: Harmonic Impedance of Grounding Electrodes Buried in a Horizontally Stratified Multilayer Ground: A Full-Wave Approach. IEEE Trans on EMC, Vol. 60, no. 4, 2018, pp. 899 – 906. DOI 10.1109/TEMC.2017.2759259

  3. Shariatinasab Reza, Gholinezhad Javad, Sheshyekani Keyhan: Estimation of Energy Stress of Surge Arresters Considering the High-Frequency Behavior of Grounding Systems. IEEE Trans on EMC, Vol. 60, no. 4, 2018, pp. 917 – 925. DOI 10.1109/TEMC.2017.2756700

  4. Kim Heegon, Cho Jonghyun, Achkir Brice, et al.: Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer With On-Chip Low-Dropout (LDO) Regulator. IEEE Trans on EMC, Vol. 60, no. 4, 2018, pp. 1022 – 1025. DOI 10.1109/TEMC.2017.2759123

  5. Clavel E., Roudet J., Guichon J.-M., et al.: A Nonmeshing Approach for Modeling Grounding. IEEE Trans on EMC, Vol. 60, no. 3, 2018, pp. 795 – 802. DOI 10.1109/TEMC.2017.2743227

  6. Mokhtari Mehrdad, Gharehpetian Gevork B.: Integration of Energy Balance of Soil Ionization in CIGRE Grounding Electrode Resistance Model. IEEE Trans on EMC, Vol. 60, no. 2, 2018, pp. 402 – 413. DOI 10.1109/TEMC.2017.2731807

  7. Chu Xiuqin, Hwang Chulsoon, Fan Jun, et al.: Analytic Calculation of Jitter Induced by Power and Ground Noise Based on IBIS I/V Curve. IEEE Trans on EMC, Vol. 60, no. 2, 2018, pp. 468 – 477. DOI 10.1109/TEMC.2017.2725270

  8. Han X.L., Wu Q.H., Li M.S., et al.: Mathematical morphology-based single phase-to-ground fault feeder selector for a resonant grounded distribution system. IEEJ Trans on Electrical & Electronic Engineering, Vol. 13, no. 3, 2018, pp. 517 – 518. DOI 10.1002/tee.22596

  9. Ding Yuxuan, Du Ya Ping, Chen Mingli: Lightning Surge Propagation on a Grounded Vertical Conductor. IEEE Trans on EMC, Vol. 60, no. 1, 2018, pp. 276 – 279. DOI 10.1109/TEMC.2017.2700079

  10. Honarbakhsh Babak, Karami Hamidreza, Sheshyekani Keyhan: Direct Characterization of Grounding System Wide-Band Input Impedance. IEEE Trans on EMC, Vol. 60, no. 1, 2018, pp. 292 – 293. DOI 10.1109/TEMC.2017.2700499

  11. Koliushko D.G., Rudenko S.S.: Experimental Substantiation of the Calculation Procedure of Normalized Parameters of Grounding Device Based on the Three-Layer Soil Model. Electrical Eng. & Electromechanics, no. 1, 2018, pp. 66 – 70. DOI 10.20998/2074-272X.2018.1.11

  12. Parise Giuseppe, Parise Luigi, Martirano Luigi: Intrinsically Safe Grounding Systems and Global Grounding Systems. IEEE Trans on Industry Applications, Vol. 54, no. 1, 2018, pp. 25 – 31. DOI 10.1109/TIA.2017.2743074

  13. Engin Arif Ege, Ndip Ivan, Lang Klaus-Dieter, et al.: Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 8, no. 1, 2018, pp. 50 – 56. DOI 10.1109/TCPMT.2017.2764801

  14. Dozortsev Alexander, Goldshtein Israel, Kvatinsky Shahar: Analysis of the row grounding technique in a memristor-based crossbar array. Int. J. of Circuit Theory and Applications, Vol. 46, no. 1, Special Issue: SI, 2018, pp. 122 – 137. DOI 10.1002/cta.2399

  15. Pantoja J.J., Roman F., Amortegui F., et al.: Lightning grounding system of a tall-mast for human safety. Electric Power Systems Research, Vol. 153, Special Issue: SI, 2017, pp. 119 – 127. DOI 10.1016/j.epsr.2017.02.013

  16. Panetta Sergio A.R.: Hybrid Grounding of Electrical Systems. IEEE Trans on Industry Applications, Vol. 53, no. 6, 2017, pp. 6033 – 6037. DOI 10.1109/TIA.2017.2732339

  17. Ramos-Leanos O., Naredo J.L., Uribe F.A., et al.: Accurate and Approximate Evaluation of Power-Line Earth Impedances Through the Carson Integral. IEEE Trans on EMC, Vol. 59, no. 5, 2017, pp. 1465 – 1473. DOI 10.1109/TEMC.2017.2679213

  18. Karami Hamidreza, Sheshyekani Keyhan, Rachidi Farhad: Mixed-Potential Integral Equation for Full-Wave Modeling of Grounding Systems Buried in a Lossy Multilayer Stratified Ground. IEEE Trans on EMC, Vol. 59, no. 5, 2017, pp. 1505 – 1513. DOI 10.1109/TEMC.2017.2655497

  19. Nahman J., Salamon D.: Mutual interference of neighboring grounding systems and approximate formulation. Electric Power Systems Research, Vol. 151, 2017, pp. 166 – 173. DOI 10.1016/j.epsr.2017.05.029

  20. Androvitsaneas V.P., Gonos I.F., Stathopulos I.A.: Research and applications of ground enhancing compounds in grounding systems. IET Generation Transmission & Distribution, Vol. 11, no. 13, 2017, pp. 3195 – 3201. DOI 10.1049/iet-gtd.2017.0233

  21. Li Ping, Jiang Li Jun, Bagci Hakan: Discontinuous Galerkin Time-Domain Analysis of Power-Ground Planes Taking Into Account Decoupling Capacitors. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 7, no. 9, 2017, pp. 1476 – 1485. DOI 10.1109/TCPMT.2017.2671413

  22. Souza Francisco Alexandre A., Neto Tobias R. Fernandes, Magalhaes Francisco Rodrigo P., et al.: Predicting the Grounding Topology Based on Grounding Impedance and the Pattern Recognition Framework: A Case Study on One to Four Ground Rods in Straight Line. IEEE Trans on Power Delivery, Vol. 32, no. 4, 2017, pp. 1748 – 1757. DOI 10.1109/TPWRD.2016.2626339

  23. Yuan Tao, Bai Yang, Sima Wenxia, et al.: Grounding Resistance Measurement Method Based on the Fall of Potential Curve Test Near Current Electrode. IEEE Trans on Power Delivery, Vol. 32, no. 4, 2017, pp. 2005 – 2012. DOI 10.1109/TPWRD.2016.2614519

  24. Wang Wen, Zeng Xiangjun, Yan Lingjie, et al.: Principle and Control Design of Active Ground-Fault Arc Suppression Device for Full Compensation of Ground Current. IEEE Trans on Industrial Electronics, Vol. 64, no. 6, 2017, pp. 4561 – 4570. DOI 10.1109/TIE.2017.2652400

  25. Xue Yongduan, Chen Xiaoru, Song Huamao, et al.: Resonance Analysis and Faulty Feeder Identification of High-Impedance Faults in a Resonant Grounding System. IEEE Trans on Power Delivery, Vol. 32, no. 3, 2017, pp. 1545 – 1555. DOI 10.1109/TPWRD.2016.2641045

  26. Kim Youngwoo, Cho Jonghyun, Kim Jonghoon J., et al.: Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling. IEEE Trans on EMC, Vol. 59, no. 3, 2017, pp. 940 – 951. DOI 10.1109/TEMC.2016.2632703

  27. Mashayekhi V., Sadeghi S.H. Hesamedin, Moini R., et al.: An Adaptive Chebyshev Approach for Fast Computation of Grounding System Admittance Matrix. IEEE Trans on EMC, Vol. 59, no. 2, Part: 1, 2017, pp. 420 – 428. DOI 10.1109/TEMC.2016.2611675

  28. Mokhtari Mehrdad, Abdul-Malek Zulkurnain, Gharehpetian Gevork B.: A new soil ionization model for grounding electrodes. Int. Trans on Electrical Energy Systems, Vol. 27, no. 3, 2017, Article # e2266. DOI 10.1002/etep.2266

  29. Liang Xiaodong, Wang Chenyang: Factors Affecting Ground Potential Rise and Fault Currents Along Transmission Lines With Multigrounded Shield Wires. IEEE Trans on Industry Applications, Vol. 53, no. 2, 2017, pp. 888 – 900. DOI 10.1109/TIA.2016.2628358

  30. Brovont Aaron D., Pekarek Steven D.: Derivation and Application of Equivalent Circuits to Model Common-Mode Current in Microgrids. IEEE Journal of Emerging & Selected Topics in Power Electronics, Vol. 5, no. 1, 2017, pp. 297 – 308. DOI 10.1109/JESTPE.2016.2642835

  31. Tan Xin, Li Xiao-Chun, Mao Junfa: Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 7, no. 2, 2017, pp. 269 – 275. DOI 10.1109/TCPMT.2016.2628050

  32. Tossani Fabio, Napolitano Fabio, Borghetti Alberto: New Integral Formulas for the Elements of the Transient Ground Resistance Matrix of Multiconductor Lines. IEEE Trans on EMC, Vol. 59, no. 1, 2017, pp. 193 – 198. DOI 10.1109/TEMC.2016.2591590

  33. Stumpf Martin: The Equivalent Thevenin-Network Representation of a Pulse-Excited Power-Ground Structure. IEEE Trans on EMC, Vol. 59, no. 1, 2017, pp. 249 – 255. DOI 10.1109/TEMC.2016.2590565

  34. Seixas C.M., Kurokawa S.: A Grounding System Model Directly in Time-Domain. IEEE Latin America Transactions, Vol. 14, no. 10, 2016, pp. 4261 – 4266. DOI 10.1109/TLA.2016.7786303

  35. Haga Nozomi, Kasahara Yusaku, Motojima Kuniyuki: Dynamic Measurements of Intrabody Communication Channels and Their Dependences on Grounding Conditions. IEICE Trans on Communications, Vol. E99B, no. 6, 2016, pp. 1380 – 1385. DOI 10.1587/transcom.2015EBP3497

  36. Chang Choong-Koo, Hassan Mostafa Ahmed Fouad: Application of Low Voltage High Resistance Grounding in Nuclear Power Plants. Nuclear Engineering and Technology, Vol. 48, no. 1, 2016, pp. 211 – 217. DOI 10.1016/j.net.2015.08.008

  37. Kuhar Andrijana, Grcev Leonid: Contribution to Calculating the Impedance of Grounding Electrodes Using Circuit Equivalents. Facta Universitatis - Series Electronics and Energetics, Vol. 29, no. 4, 2016, pp. 721 – 732. DOI 10.2298/FUEE1604721K

  38. de Menezes M.A., Da Costa P.P., Jr., De Sao Jose A.N., et al.: Signal Integrity Considerations Applied to Automotive Grounding Systems Design. IEEE Latin America Transactions, Vol. 14, no. 11, 2016, pp. 4474 – 4481. DOI 10.1109/TLA.2016.7795817

  39. Ghoneim Sherif S.M., Taha Ibrahim B.M.: Control the cost, touch and step voltages of the grounding grids design. IET Science, Measurement & Technology, Vol. 10, no. 8, 2016, pp. 943 – 951. DOI 10.1049/iet-smt.2016.0153

  40. Engin A.E., Ndip I., Lang K.D.: Higher-order virtual ground fence design for filtering power plane noise. IEEE 20th Workshop on Signal and Power Integrity (SPI), 2016, pp. 1 – 3. DOI 10.1109/SaPIW.2016.7496286

  41. Stumpf M.: Analysis of Dispersive Power-Ground Structures Using the Time-Domain Contour Integral Method. IEEE Trans on EMC, Vol. 57, no. 2, 2015, pp. 224 – 231. DOI 10.1109/TEMC.2014.2366491

  42. Kontargyri V.T., Gonos I.F., Stathopulos I.A.: Study on Wind Farm Grounding System. IEEE Trans on Industry Applications, Vol. 51, no. 6, 2015, pp. 4969 – 4977. DOI 10.1109/TIA.2015.2418315

  43. Jinpeng Wu, Bo Zhang, Jinliang He, Rong Zeng: A Comprehensive Approach for Transient Performance of Grounding System in the Time Domain. IEEE Trans on EMC, Vol. 57, no. 2, 2015, pp. 250 – 256. DOI 10.1109/TEMC.2014.2366875

  44. Wenxia Sima, Peng Wu, Tao Yuan, Qing Yang, Bin Zhu, Yang Bai: Method for the estimation of soil structure in the vicinity of a grounding system. IET Science, Measurement & Technology, Vol. 9, no. 7, 2015, pp. 800 – 806. DOI 10.1049/iet-smt.2014.0361

  45. Zhang Zhenyuan, Lee Wei-Jen, Dini D.A.: Grounding and Isolation of Sensitive Measurement Equipment for Arc Flash Testing at High-Power Laboratory. IEEE Trans on Industry Applications, Vol. 51, no. 6, Part 2, 2015, pp. 5281 – 5287. DOI 10.1109/TIA.2015.2411654

  46. Sun J., Wang P., Zhang H.: Reducing power-supply and ground noise induced timing jitter in short pulse generation circuits. IEEE Symp on Electromagnetic Compatibility and Signal Integrity (EMCSI), 2015, pp. 17 – 21. DOI 10.1109/EMCSI.2015.7107652

  47. Ko J., An C.H., Kwon C.K., Kim S.W., Kim C.: Rail-to-rail regulating voltage-controlled oscillator with low supply and ground noise sensitivity. Electronics Lett., Vol. 51, no. 24, 2015, pp. 1980 – 1982. DOI 10.1049/el.2015.3128

  48. Kim M.: A Compact EBG Structure With Wideband Power/Ground Noise Suppression Using Meander-Perforated Plane. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 595 – 598. DOI 10.1109/TEMC.2015.2405615

  49. Shi Y., Tang W., Liu S., Wang C., Zhuang W.: Mode Analysis of Miniaturized and Stopband-Enhanced Composite Electromagnetic Bandgap Structure for Power/Ground Noise Suppression. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 532 – 537. DOI 10.1109/TEMC.2014.2387949

  50. Trifunovic J., Kostic M.B.: An Algorithm for Estimating the Grounding Resistance of Complex Grounding Systems Including Contact Resistance. IEEE Trans on Industry Applications, Vol. 51, no. 6, 2015, pp. 5167 – 5174. DOI 10.1109/TIA.2015.2429644

  51. Cafaro G. et al.: The Global Grounding System: Definitions and guidelines. IEEE Int. Conf on Environment and Electrical Eng. (EEEIC), 2015, pp. 537 – 541. DOI 10.1109/EEEIC.2015.7165219

  52. Kokorus M., Zildzo H., Gacanovic R., Ahmovic A.: Modeling of phenomena in the grounding system including fields correlation. IEEE Int. Conf on Computer as a Tool (EUROCON), 2015, pp.1 – 6. DOI 10.1109/EUROCON.2015.7313721

  53. Angelov J., Vuletić J., Ačkovski R., Todorovski M.: An Extension in Cable Modeling for Grounding System Analysis. IEEE Trans on Industry Applications, Vol. 51, no. 6, 2015, pp. 5086 – 5094. DOI 10.1109/TIA.2015.2409807

  54. Sekioka S., Lorentzou M.I., Hatziargyriou N.D.: Approximate Formulas for Terminal Voltages on the Grounding Conductor. IEEE Trans on EMC, Vol. 56, no. 2, 2014, pp. 444 – 453. DOI 10.1109/TEMC.2013.2287015

  55. Run Xiong, Bin Chen, Cheng Gao, Yun Yi, Wen Yang: FDTD Calculation Model for the Transient Analyses of Grounding Systems. IEEE Trans on EMC, Vol. 56, no. 5, 2014, pp. 1155 – 1162. DOI 10.1109/TEMC.2014.2313918

  56. Choi, J.H., Hon, P.W.C., Itoh, T.: Dispersion Analysis and Design of Planar Electromagnetic Bandgap Ground Plane for Broadband Common-Mode Suppression. IEEE Microwave & Wireless Comp. Lett., Vol. 24, no. 11, 2014, pp. 772 – 774. DOI 10.1109/LMWC.2014.2303166

  57. Myunghoi Kim, Dong Gun Kam: A Wideband and Compact EBG Structure With a Circular Defected Ground Structure. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 4, no. 3, 2014, pp. 496 – 503. DOI 10.1109/TCPMT.2013.2285407

  58. Jae Young Choi, Swaminathan M.: Modeling of Power/Ground Planes Using Triangular Elements. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 4, no. 2, 2014, pp. 291 – 302. DOI 10.1109/TCPMT.2013.2277659

  59. Cavka D., Rachidi F., Poljak D.: On the Concept of Grounding Impedance of Multipoint Grounding Systems. IEEE Trans on EMC, Vol. 56, no. 6, 2014, pp. 1540 – 1544. DOI 10.1109/TEMC.2014.2341043

  60. Lee E. et al.: Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2014, pp. 260 – 264. DOI 10.1109/ISEMC.2014.6898981

  61. Cheng Lin, Wang Sen, Li Zhizhong, Wang Jing, Zhang Bo, Shi Weidong: Design of grounding system for wind-photovoltaic-energy storage Hybrid power station. Int. Conf on High Voltage Engineering and Application (ICHVE), 2014, pp. 1-5. DOI 10.1109/ICHVE.2014.7035509

  62. Yutthagowith P.: Transient characteristics of grounding systems. Int.Electrical Eng. Congress (iEECON), 2014, pp. 1-5. DOI 10.1109/iEECON.2014.6925975

  63. Guang-Hwa Shiue, Chi-Lou Yeh, Pei-Wei Huang, Huan-Yi Liao, Zhi-Hao Zhang: Ground Bounce Noise Induced by Crosstalk Noise for Two Parallel Ground Planes With a Narrow Open-Stub Line and Adjacent Signal Traces in Multilayer Package Structure. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 4, no. 5, 2014, pp. 870 – 881. DOI 10.1109/TCPMT.2014.2299281

  64. Bhattacharyya B.K., Laskar N., Debnath S., Baral D.: Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 4, no. 9, 2014, pp. 1489 – 1494. DOI 10.1109/TCPMT.2014.2339272

  65. Deokjin Joo, Taewhan Kim: A Fine-Grained Clock Buffer Polarity Assignment for High-Speed and Low-Power Digital Systems. IEEE Trans on CAD of Integrated Circuits and Systems, Vol. 33, no. 3, 2014, pp. 423 – 436. DOI 10.1109/TCAD.2013.2288698

  66. Mingjing Chen, Orailoglu A.: Examining Timing Path Robustness Under Wide-Bandwidth Power Supply Noise Through Multi-Functional-Cycle Delay Test. IEEE Trans on VLSI, Vol. 22, no. 4, 2014, pp. 734 – 746. DOI 10.1109/TVLSI.2013.2256810

  67. Araga Y., Nagata M., Van der Plas G., Marchal P., Libois M., La Manna A., Wenqi Zhang, Beyer G., Beyne E.: Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 4, no. 6, 2014, pp. 1026 – 1037. DOI 10.1109/TCPMT.2014.2316150

  68. Kumar Y., Paliwal S., Sahu P., Balasubramanian S.K.: Ground bounce noise minimization using Multi-VDD Level Converter. IEEE Int. Conf on Electronics, Computing & Communication Technologies (CONECCT), 2014, pp.1 – 4. DOI 10.1109/CONECCT.2014.6740179

  69. Asokan A., Todri-Sanial A., Bosio A., Dilillo L., Girard P., Pravossoudovitch S., Virazel A.: Path delay test in the presence of multi-aggressor crosstalk, power supply noise and ground bounce. IEEE Int. Symp on Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2014, pp. 207 – 212. DOI 10.1109/DDECS.2014.6868791

  70. Yang De-Cao, Wei Xing-Chang, Zhang Xue-Cang, Zhang Ling-Song, Li Er-Ping: A Novel Hybrid Analytical Method for Impedance Calculation of Power and Ground Planes. IEEE Trans on EMC, Vol. 55, no. 5, 2013, pp. 949 – 955. DOI 10.1109/TEMC.2013.2241068

  71. Yu-Chieh Lee, Wen-Yang Hsu, Tai-Ting Huang, Hsin Chen: A compact Gm-C filter architecture with an ultra-low corner frequency and high ground-noise rejection. IEEE Biomedical Circuits and Systems Conf. (BioCAS), 2013, pp. 318 – 321. DOI 10.1109/BioCAS.2013.6679703

  72. Todri A., Bosio A., Dilillo L., Girard P., Virazel A.: Uncorrelated Power Supply Noise and Ground Bounce Consideration for Test Pattern Generation. IEEE Trans on VLSI, Vol. 21, no. 5, 2013, pp. 958 – 970. DOI 10.1109/TVLSI.2012.2197427

  73. Singh R., Akashe S.: New high performance low power 4 bit full adder with reduce ground bounce noise. Int. Conf. on Advanced Electronic Systems (ICAES), 2013, pp.346 – 349. DOI 10.1109/ICAES.2013.6659428

  74. Seunghyun Hwang, Daehyun Chung, Satagopan V., Sudhakaran S., Lin D., Moghadam F.: Simultaneous switching noise model by distributed power port and ground current capture. IEEE Electronic Components and Technology Conf. (ECTC), 2013, pp. 1076 – 1080. DOI 10.1109/ECTC.2013.6575707

  75. Yongrong Shi, Wanchun Tang, Sheng Liu, Xin Rao, Chow Y.L.: Ultra-Wideband Suppression of Power/Ground Noise in High-Speed Circuits Using a Novel Electromagnetic Bandgap Power Plane. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 4, 2013, pp. 653 – 660. DOI 10.1109/TCPMT.2012.2235529

  76. Kumar Y., Paliwal S., Rai C.K., Balasubramanian S.K.: A novel ground bounce reduction technique using four step power gating. Students Conf. on Engineering and Systems (SCES), 2013, pp. 1 – 5 DOI 10.1109/SCES.2013.6547487

  77. Chuen-De Wang, Tzong-Lin Wu: Model and Mechanism of Miniaturized and Stopband-Enhanced Interleaved EBG Structure for Power/Ground Noise Suppression. IEEE Trans on EMC, Vol. 55, no. 1, 2013, pp. 159 – 167. DOI 10.1109/TEMC.2012.2210900

  78. Weichen Liu, Yu Wang, Xuan Wang, Jiang Xu, Huazhong Yang: On-Chip Sensor Network for Efficient Management of Power Gating-Induced Power/Ground Noise in Multiprocessor System on Chip. IEEE Trans on Parallel & Distributed Systems, Vol. 24, no. 4, 2013, pp. 767 – 777. DOI 10.1109/TPDS.2012.193

  79. Akbari M., Sheshyekani K., Alemi M.R.: The Effect of Frequency Dependence of Soil Electrical Parameters on the Lightning Performance of Grounding Systems. IEEE Trans on EMC, Vol. 55, no. 4, 2013, pp. 739 – 746. DOI 10.1109/TEMC.2012.2222416

  80. Packiaraj D., Vinoy K.J., Nagarajarao P., Ramesh M., Kalghatgi A.T.: Miniaturized Defected Ground High Isolation Crossovers. IEEE Microwave & Wireless Comp. Lett., Vol. 23, no. 7, 2013, pp. 347 – 349. DOI 10.1109/LMWC.2013.2263219

  81. Pen-Li You, Tzuen-Hsi Huang: A Switched Inductor Topology Using a Switchable Artificial Grounded Metal Guard Ring for Wide-FTR MMW VCO Applications. IEEE Trans on ED, Vol. 60, no. 2, 2013, pp. 759 – 766. DOI 10.1109/TED.2012.2234750

  82. Khan N.H., Alam S.M., Hassoun S.: GND Plugs: A Superior Technology to Mitigate TSV-Induced Substrate Noise. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 5, 2013, pp. 849 – 857. DOI 10.1109/TCPMT.2013.2241178

  83. Chun-Hsiang Huang, Tzong-Lin Wu: Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 1, 2013, pp. 21 – 30. DOI 10.1109/TCPMT.2012.2220139

  84. Liu Y., Lee J., Kim H.H., Kim H.: Ground radiation method using slot with coupling capacitors. Electronics Lett., Vol. 49, no. 7, 2013, pp. 447 – 448. DOI 10.1049/el.2012.4520

  85. Adamshick S., Coolbaugh D., Liehr M.: Feasibility of coaxial through silicon via 3D integration. Electronics Lett., Vol. 49, no. 16, 2013, pp. 1028 – 1030. DOI 10.1049/el.2013.1165

  86. Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang, Yujeong Shim, Joungho Kim, Jonghoon Kim: A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs. IEEE Trans on EMC, Vol. 54, no. 3, 2012, pp. 689 – 695. DOI 10.1109/TEMC.2012.2187662

  87. Theodoulidis T.: Exact Solution of Pollaczek's Integral for Evaluation of Earth-Return Impedance for Underground Conductors. IEEE Trans on EMC, Vol. 54, no. 4, 2012, pp. 806 – 814. DOI 10.1109/TEMC.2011.2181849

  88. Xinbo He, Hubing T., Haixin Ke, Kobayashi N., Morishita K., Harada T.: Calculation of Optimal Ground Post Resistance for Reducing Emissions from Chassis-Mounted Printed Circuit Boards. IEEE Trans on EMC, Vol. 53, no. 2, 2011, pp. 475 – 481. DOI 10.1109/TEMC.2011.2104375

  89. Huadong Li, Subramanyam G.: Closed-Form Expression for the Net Ground Plane Inductance of Coplanar Stripline PCBs. IEEE Trans on EMC, Vol. 53, no. 2, 2011, pp. 531 – 533. DOI 10.1109/TEMC.2011.2107577

  90. Jun Zou, JunJie Li, Lee J.B., Chang S.H.: Fast and Highly Accurate Algorithm for Calculating the Earth-Return Impedance of Underground Conductors. IEEE Trans on EMC, Vol. 53, no. 1, 2011, pp. 237-240 DOI 10.1109/TEMC.2010.2057432

  91. Yutthagowith P., Ametani A., Nagaoka N., Baba Y.: Application of the Partial Element Equivalent Circuit Method to Analysis of Transient Potential Rises in Grounding Systems. IEEE Trans on EMC, Vol. 53, no. 3, 2011, pp. 726 – 736. DOI 10.1109/TEMC.2010.2077676

  92. Cooray V., Rakov V.A.: Engineering Lightning Return Stroke Models Incorporating Current Reflection From Ground and Finitely Conducting Ground Effects. IEEE Trans on EMC, Vol. 53, no. 3, 2011, pp. 773 – 781. DOI 10.1109/TEMC.2011.2113350

  93. Henglin Chen, Chen Chen, Yuancheng Ren: Modeling and Characterization of Incomplete Shielding Effect of GND on Common-Mode EMI of a Power Converter. IEEE Trans on EMC, Vol. 53, no. 3, 2011, pp. 676 – 683. DOI 10.1109/TEMC.2011.2155660

  94. Arnautovski-Toseva V., Grcev L.: Image and Exact Models of a Vertical Wire Penetrating a Two-Layered Earth. IEEE Trans on EMC, Vol. 53, no. 4, 2011, pp. 968 – 976. DOI 10.1109/TEMC.2011.2149533

  95. Saxena R. S., Bhan R. K., Saini N.K., Muralidharan R.: Virtual Ground Technique for Crosstalk Suppression in Networked Resistive Sensors. IEEE Sensors Journal, Vol. 11, no 2, 2011, pp 432 – 433. DOI 10.1109/JSEN.2010.2060186

  96. Guan-Zong Wu, Yi-Che Chen, Tzong-Lin Wu: Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression. IEEE Trans. on Advanced Packaging, Vol. 33, no. 1, 2010, pp. 206 – 211. DOI 10.1109/TADVP.2009.2034334

  97. Scogna A.C., Tzong-Lin Wu, Orlandi A.: Noise Coupling Mitigation in PWR/GND Plane Pair by Means of Photonic Crystal Fence: Sensitivity Analysis and Design Parameters Extraction. IEEE Trans. on Advanced Packaging, Vol. 33, no. 3, 2010, pp. 574 – 581. DOI 10.1109/TADVP.2009.2036596

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