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CABLES, LINES, WIRES, INTERCONNECTS & ASSOCIATED PARASITICS

As far as the laws of mathematics refer to reality,

they are not certain; and as far as they are certain,

they do not refer to reality” (Albert Einstein)

  1. Rai Mayank Kumar, Garg Harsh, Kaushik B.K.: Temperature-Dependent Modeling and Crosstalk Analysis in Mixed Carbon Nanotube Bundle Interconnects. J. of Electronic Materials, Vol. 46, no. 8, 2017, pp. 5324 – 5337. DOI 10.1007/s11664-017-5538-1

  2. Kang Kai, Cao Xin, Wu Yunqiu, et al.: A Wideband Model for On-Chip Interconnects With Different Shielding Structures. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 7, no. 10, 2017, pp. 1702 – 1712. DOI 10.1109/TCPMT.2017.2732445

  3. Bagheri Amin, Ranjbar Mahboubeh, Haji-Nasiri Saeed, et al.: Modelling and analysis of crosstalk induced noise effects in bundle SWCNT interconnects and its impact on signal stability. J. of Computational Electronics, Vol. 16, no. 3, 2017, pp. 845 – 855. DOI 10.1007/s10825-017-1028-1

  4. Guenther A., Schneider S., Rezem M., et al.: Automated Misalignment Compensating Interconnects Based on Self-Written Waveguides. J. of Lightwave Technology, Vol. 35, no. 13, 2017, pp. 2678 – 2684. DOI 10.1109/JLT.2017.2692305

  5. Fang Wenxiao, En Yunfei, Huang Yun, et al.: Orientation Effect of Field-to-Line Coupling in a TEM Cell. IEEE Trans on EMC, Vol. 59, no. 3, 2017, pp. 970 – 979. DOI 10.1109/TEMC.2016.2633062

  6. Chabane S., Besnier P., Klingler M.: A Modified Enhanced Transmission Line Theory Applied to Multiconductor Transmission Lines. IEEE Trans on EMC, Vol. 59, no. 2, 2017, pp. 518 – 528, Part: 1. DOI 10.1109/TEMC.2016.2611672

  7. Wunsch B., Stevanovic I., Skibin S.: Length-Scalable Multiconductor Cable Modeling for EMI Simulations in Power Electronics. IEEE Trans on Power Electronics, Vol. 32, no. 3, 2017, pp. 1908 – 1916. DOI 10.1109/TPEL.2016.2556752

  8. Peng Xiaosheng, Wen Jinyu, Li Zhaohui, et al.: Rough Set Theory Applied to Pattern Recognition of Partial Discharge in Noise Affected Cable Data. IEEE Trans on Dielectrics and Electrical Insulation, Vol. 24, no. 1, 2017, pp. 147 – 156. DOI 10.1109/TDEI.2016.006060

  9. Liang Yuan, Yu Hao, Feng Guangyin, et al.: An Energy- Efficient and Low-Crosstalk Sub-THz I/O by Surface Plasmonic Polariton Interconnect in CMOS. IEEE Trans on MTT, Vol. 65, no. 8, 2017, pp. 2762 – 2774. DOI 10.1109/TMTT.2017.2666808

  10. Doevenspeck Jonas, Zografos Odysseas, Gurunarayanan Surya, et al.: Design and simulation of plasmonic interference-based majority gate. AIP Advances, Vol. 7, no. 6, 2017, Article # 065116. DOI 10.1063/1.4989817

  11. Peng Zhen, Shao Yang, Gao Hong-Wei, et al.: High-Fidelity, High-Performance Computational Algorithms for Intrasystem Electromagnetic Interference Analysis of IC and Electronics. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 7, no. 5, 2017, pp. 653 – 668. DOI 10.1109/TCPMT.2016.2636296

  12. D'Aloia Alessandro G., Zhao Wen-Sheng, Wang Gaofeng, et al.: Near-Field Radiated From Carbon Nanotube and Graphene-Based Nanointerconnects. IEEE Trans on EMC, Vol. 59, no. 2, Special Issue: SI, Part: 2, 2017, pp. 646 – 653. DOI 10.1109/TEMC.2016.2639319

  13. Su Meng, Huang Zhandong, Huang Yong, et al: Swarm Intelligence-Inspired Spontaneous Fabrication of Optimal Interconnect at the Micro/Nanoscale. Advanced Materials, Vol. 29, no. 7, 2017, Article # UNSP 1605223. DOI 10.1002/adma.201605223

  14. Rider T., Kuhn W.B., Wolf A.: Crosstalk and EMI in mixed-signal / microwave multi-layer pc boards. IEEE Int. Symp. on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, pp. 26 – 31. DOI 10.1109/ISEMC.2017.8077836

  15. Huang Shaowu, Ye Xiaoning, Kang Nan, et al.: Suppression of Couplings in High-Speed Interconnects Using Absorbing Materials. IEEE Trans on EMC, Vol. 58, no. 5, 2016, pp. 1432 – 1439. DOI 10.1109/TEMC.2016.2582867

  16. Huang Shaowu, Xiao Kai, Lee Beomtaek, et al.: Stub Effect Mitigations Using Absorbing Materials. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 6, no. 8, 2016, pp. 1233 – 1244. DOI 10.1109/TCPMT.2016.2582385

  17. Tripathy Srijeet, Bhattacharyya Tarun Kanti: Role of inter-tube coupling and quantum interference on electrical transport in carbon nanotube junctions. Physica E - Low-Dimensional Systems & Nanostructures, Vol. 83, 2016, pp. 314 – 321. DOI 10.1016/j.physe.2016.04.033

  18. Frankel Binyamin, Wimer Shmuel: Optimal VLSI Delay Tuning by Wire Shielding. J. of Optimization Theory and Applications, Vol. 170, no. 3, 2016, pp. 1060 – 1067. DOI 10.1007/s10957-016-0960-8

  19. Jung Yei Hwan, Lee Juhwan, Qiu Yijie, et al.: Stretchable Twisted-Pair Transmission Lines for Microwave Frequency Wearable Electronics. Advanced Functional Materials, Vol. 26, no. 26, 2016, pp. 4635 – 4642. DOI 10.1002/adfm.201600856

  20. Yuan Keliang, Wang Jianguo, Xie Haiyan, et al.: A Time-Domain Macromodel Based on the Frequency-Domain Moment Method for the Field-to-Wire Coupling. IEEE Trans on EMC, Vol. 58, no. 3, 2016, pp. 868 – 876. DOI 10.1109/TEMC.2016.2518802

  21. Lin Ding-Bing, Huang Chung-Pin, Ke Hsin-Nan: Using Stepped-Impedance Lines for Common-Mode Noise Reduction on Bended Coupled Transmission Lines. IEEE Trans on Components, Packaging & Manufacturing Technology, Vol. 6, no. 5, 2016, pp. 757 – 766. DOI 10.1109/TCPMT.2016.2537838

  22. Beyne S., Croes K., De Wolf I., et al.: 1/f noise measurements for faster evaluation of electromigration in advanced microelectronics interconnections. J. of Applied Physics, Vol. 119, no. 18, 2016, Article # 184302. DOI 10.1063/1.4947582

  23. Shahzad Faisal, Kumar Pradip, Kim Yoon-Hyun, et al.: Biomass-Derived Thermally Annealed Interconnected Sulfur-Doped Graphene as a Shield against Electromagnetic Interference. ACS Applied Materials & Interfaces, Vol. 8, no. 14, 2016, pp. 9361 – 9369. DOI 10.1021/acsami.6b00418

  24. Gharibdoust Kiarash, Tajalli Armin, Leblebici Yusuf: A 4 x 9 Gb/s 1 pJ/b Hybrid NRZ/Multi-Tone I/O With Crosstalk and ISI Reduction for Dense Interconnects. IEEE Journal of Solid State Circ., Vol. 51, no. 4, Special Issue: SI, 2016, pp. 992 – 1002. DOI 10.1109/JSSC.2015.2504410

  25. Cao Ying S., Jiang Li Jun, Ruehli A.E., et al.: New Detailed Understanding of the Mechanism of Radiation in Interconnect Problems. 25th IEEE Conf. on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2016, pp. 219 – 221. DOI 10.1109/EPEPS.2016.7835454

  26. Huang Nick K.H., Jiang Li Jun, Luo Xingyun, et al.: A Novel Data Pattern Dependent Electromagnetic Emission Modeling for High Speed Multi-Channel Interconnects. Asia-Pacific Int. Symp. on Electromagnetic Compatibility (APEMC), 2016, pp. 735 – 737. DOI 10.1109/APEMC.2016.7522850

  27. Xiao Pei, Du Pingan, Nie Bao-Lin: An Analytical Approach for Calculating Load Response of a Transmission Line with Interference Source in Interconnected Equipment. Asia-Pacific Int. Symp. on Electromagnetic Compatibility (APEMC), 2016, pp. 755 – 757. DOI 10.1109/APEMC.2016.7522857

  28. Papistas I.A., Pavlidis V.F.: Inter-Tier Crosstalk Noise on Power Delivery Networks for 3-D ICs with Inductively-Coupled Interconnects. 26th ACM Great Lakes Symposium on VLSI (GLSVLSI), 2016, pp. 257 – 262. DOI 10.1145/2902961.2903020

  29. Khorrami M.A., Dixon P., Steigerwald T., et al.: Employment of Microwave Absorbers for EMI/RFI mitigations from High Speed Digital Buses with Signal Integrity Considerations. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), 2016, pp. 1 – 6. DOI 10.1109/ISEMC.2016.7571564

  30. Allred R.J., Katz B., Furse C.: Ripple Analysis: Identify and Quantify Reflective Interference through ISI Decomposition. IEEE 20th Workshop on Signal and Power Integrity (SPI), 2016, pp. 1 – 4. DOI 10.1109/SaPIW.2016.7496279

  31. Subbaraman Harish, Xu Xiaochuan, Hosseini Amir, et al.: Recent advances in silicon-based passive and active optical interconnects. Optics Express, Vol. 23, no. 3, 2015, pp. 2487 – 2510. DOI 10.1364/OE.23.002487

  32. Mehri M., Masoumi N.: A thorough investigation into active and passive shielding methods for nano-VLSI interconnects against EMI and crosstalk. AEU-Int. Journal of Electronics & Comm., Vol. 69, no. 9, 2015, pp. 1199 – 1207. DOI 10.1016/j.aeue.2015.04.018

  33. van Leersumt B.J.A.M. (Bart), van der Vent C.C.J. (Jan-Kees), Buesink F.J.K. (Frits), et al.: Protection Against Common Mode Currents on Exposed Cables. Joint IEEE Int. Symp. on Electromagnetic Compatibility (EMC) and EMC Europe, 2015, pp. 1478 – 1483. DOI 10.1109/ISEMC.2015.7256392

  34. Xiao F.K. Murano, Y. Kami: Analytical solution of the electromagnetic radiation from coupled differential microstrip pairs. Asia-Pacific Symp. on Electromagnetic Compatibility (APEMC), 2015, pp. 708 – 711. DOI 10.1109/APEMC.2015.7175358

  35. Shuai Sun, Badawy A.-H.A., Narayana V., El-Ghazawi T., Sorger V.J.: The Case for Hybrid Photonic Plasmonic Interconnects (HyPPIs): Low-Latency Energy-and-Area-Efficient On-Chip Interconnects. IEEE Photonics Journal, Vol. 7, no. 6, 2015, pp. 1 – 14. DOI 10.1109/JPHOT.2015.2496357

  36. Thubthimthong B., Sasaki T., Hane K.: Asymmetrically and Vertically Coupled Hybrid Si/GaN Microring Resonators for On-Chip Optical Interconnects. IEEE Photonics Journal, Vol. 7, no. 4, 2015, pp. 1 – 11. DOI 10.1109/JPHOT.2015.2464721

  37. Monayakul S., Sinha S., Wang C.-T., Weimann N., Schmuckle F.J., Hrobak M., Krozer V., John W., Weixelbaum L., Wolter P., Kruger O., Heinrich W.: Flip-Chip Interconnects for 250 GHz Modules. IEEE Microwave & Wireless Comp. Lett., Vol. 25, no. 6, 2015, pp. 358 – 360. DOI 10.1109/LMWC.2015.2424294

  38. Morthier G., Spuesens T., Mechet P., Roelkens G., Van Thourhout D.: InP Microdisk Lasers Integrated on Si for Optical Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 21, no. 6, 2015, pp. 359 – 368. DOI 10.1109/JSTQE.2014.2376697

  39. Hui Li, Wolf P., Moser P., Larisch G., Lott J.A., Bimberg D.: Temperature-Stable, Energy-Efficient, and High-Bit Rate Oxide-Confined 980-nm VCSELs for Optical Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 21, no. 6, 2015, pp. 405 – 413. DOI 10.1109/JSTQE.2015.2389731

  40. Hiratani T., Shindo T., Kyohei Doi, Atsuji Y., Inoue D., Amemiya T., Nishiyama N., Arai S.: Energy Cost Analysis of Membrane Distributed-Reflector Lasers for On-Chip Optical Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 21, no. 6, 2015, pp. 299 – 308. DOI 10.1109/JSTQE.2015.2456334

  41. Sato T., Takeda K., Shinya A., Notomi M., Hasebe K., Kakitsuka T., Matsuo S.: Photonic Crystal Lasers for Chip-to-Chip and On-Chip Optical Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 21, no. 6, 2015, pp. 728 – 737. DOI 10.1109/JSTQE.2015.2420991

  42. Westbergh P., Gustavsson J.S., Larsson A., Taunay T.F., Bansal L., Gruner-Nielsen L.: Crosstalk Characteristics and Performance of VCSEL Array for Multicore Fiber Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 21, no. 6, 2015, pp. 429 – 435. DOI 10.1109/JSTQE.2015.2416124

  43. Romero-Garcia S., Bin Shen, Merget F., Marzban B., Witzens J.: Alignment Tolerant Couplers for Silicon Photonics. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 21, no. 6, 2015, pp. 765 – 778. DOI 10.1109/JSTQE.2015.2432025

  44. Liehui Ren, Peng Shao, Kelvin Qiu, Jane Lim, Rick Brooks, Xinxin Tian, Yaojiang Zhang, Jun Fan: A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair. IEEE Trans on EMC, Vol. 57, no. 4, 2015, pp. 885 – 893. DOI 10.1109/TEMC.2015.2453406

  45. Kim S., Lee J.H., Lee S.S.: Novel Sidewall Interconnection Using a Perpendicular Circuit Die for 3-D Chip Stacking. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 5, no. 9, 2015, pp. 1265 – 1272. DOI 10.1109/TCPMT.2015.2457419

  46. Zhu Y., Kang K., Wu Y., Zhao C., Ban Y., Guo J., Sun L.L., Yin W., Xue Q.: An Equivalent Circuit Model With Current Return Path Effects for ON-Chip Interconnect up to 80 GHz. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 5, no. 9, 2015, pp. 1320 – 1330. DOI 10.1109/TCPMT.2015.2448572

  47. Shih-Ya Huang, Ting-Yi Huang, Chia-Tsung Liu, Ruey-Beei Wu: Ringing Noise Suppression for Differential Signaling in Unshielded Flexible Flat Cable. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 5, no. 8, 2015, pp. 1152 – 1159. DOI 10.1109/TCPMT.2015.2455074

  48. Mora N., Rachidi F., Pelissou P., Junge A.: An Improved Formula for the Transfer Impedance of Two-Layer Braided Cable Shields. IEEE Trans on EMC, Vol. 57, no. 3, 2015, pp. 607 – 610. DOI 10.1109/TEMC.2015.2388771

  49. Ndip I., Oz A., Reichl H., Lang K.-D., Henke H.: Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials. IEEE Trans on EMC, Vol. 57, no. 2, 2015, pp. 241 – 249. DOI 10.1109/TEMC.2014.2378284

  50. Tlaxcalteco-Matus M.A., Cortes-Hernandez D.M., Torres-Torres R.: Modeling Coupled Transmission Lines Considering Current-Distribution Dependent Inductance on PCB. IEEE Microwave & Wireless Comp. Lett., Vol. 25, no. 3, 2015, pp. 148 – 150. DOI 10.1109/LMWC.2015.2390535

  51. Jun Wang, Jian-Min Lu, Xiu-Qin Chu, Yang Liu, Xin-Quan Lai, Yu-Shan Li: Influence and mitigation of long differential via stub on signal integrity. Electronics Lett., Vol. 51, no. 13, 2015, pp. 975 – 977. DOI 10.1049/el.2015.0823

  52. Spadacini G., Grassi F., Pignari S.A.: Field-to-Wire Coupling Model for the Common Mode in Random Bundles of Twisted-Wire Pairs. IEEE Trans on EMC, Vol. 57, no. 5, 2015, pp. 1246 – 1254. DOI 10.1109/TEMC.2015.2414356

  53. Serafy C., Srivastava A.: TSV Replacement and Shield Insertion for TSV–TSV Coupling Reduction in 3-D Global Placement. IEEE Trans on CAD of Integrated Circuits and Systems, Vol. 34, no. 4, 2015, pp. 554 – 562. DOI 10.1109/TCAD.2014.2385754

  54. Kruizinga B., Wouters P.A.A.F., Steennis E.F.: High frequency modeling of a shielded four-core low voltage underground power cable. IEEE Trans on Dielectrics and Electrical Insulation, Vol. 22, no. 2, 2015, pp. 649 – 656. DOI 10.1109/TDEI.2015.7076759

  55. Ning Zhang, Shuo Wang, Hui Zhao: Develop Parasitic Inductance Model for the Planar Busbar of an IGBT H Bridge in a Power Inverter. IEEE Trans on Power Electronics, Vol. 30, no. 12, 2015, pp. 6924 – 6933. DOI 10.1109/TPEL.2015.2396529

  56. Sahoo M., Ghosal P., Rahaman H.: Modeling and Analysis of Crosstalk Induced Effects in Multiwalled Carbon Nanotube Bundle Interconnects: An ABCD Parameter-Based Approach. IEEE Trans on Nanotechnology, Vol. 14, no. 2, 2015, pp. 259 – 274. DOI 10.1109/TNANO.2014.2388252

  57. Takemoto T., Yamashita H., Yazaki T., Chujo N., Yong Lee, Matsuoka Y.: A 25-to-28 Gb/s High-Sensitivity ( - 9.7 dBm) 65 nm CMOS Optical Receiver for Board-to-Board Interconnects. IEEE Journal of SSC, Vol. 49, no. 10, 2014, pp. 2259 – 2276. DOI 10.1109/JSSC.2014.2349976

  58. Po-Kuan Shen, Chin-Ta Chen, Chia-Hao Chang, Chien-Yu Chiu, Sheng-Long Li, Chia-Chi Chang, Mount-Learn Wu: Implementation of Chip-Level Optical Interconnect With Laser and Photodetector Using SOI-Based 3-D Guided-Wave Path. IEEE Photonics Journal, Vol. 6, no. 6, 2014, pp. 1 – 10. DOI 10.1109/JPHOT.2014.2366165

  59. Wiltshire M.C.K., Syms R.R.A.: Noise performance of magneto-inductive cables. J. of Applied Physics, Vol. 116, 2014, Article # 034503. http://dx.doi.org/10.1063/1.4890308

  60. Guang-Hwa Shiue, Chi-Lou Yeh, Huan Yi Liao, Pei-Wei Huang: Significant Reduction of Common-Mode Noise in Weakly Coupled Differential Serpentine Delay Microstrip Lines Using Different- Layer-Routing-Turned Traces. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 4, no. 10, 2014, pp. 1671 – 1683. DOI 10.1109/TCPMT.2014.2348858

  61. Engin A.E.: Passive Multiport RC Model Extraction for Through Silicon Via Interconnects in 3-D ICs. IEEE Trans on EMC, Vol. 56, no. 3, 2014, pp. 646 – 652. DOI 10.1109/TEMC.2013.2295049

  62. Nishad A.K., Sharma R.: Analytical Time-Domain Models for Performance Optimization of Multilayer GNR Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 20, no. 1, 2014, Article # 3700108. DOI 10.1109/JSTQE.2013.2272458

  63. d'Alessandro V., de Magistris M., Magnani A., et al.: Dynamic Electrothermal Macromodeling: an Application to Signal Integrity Analysis in Highly Integrated Electronic Systems. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 7, 2013, pp. 12371243. DOI 10.1109/TCPMT.2013.2253609

  64. Lee Minji, Kim Dongchul, Eo Yungseon: Analytical Eye-Diagram Determination for the Efficient and Accurate Signal Integrity Verification of Coupled Interconnect Lines. J. of Semiconductor Technology & Science, Vol. 13, no. 6, 2013, Special Issue SI, pp. 594607. DOI 10.5573/JSTS.2013.13.6.594

  65. Yung-Yu Hsu, Lucas K., Davis D., Elolampi B., Ghaffari R., Rafferty C., Dowling K.: Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects. IEEE Trans on ED, Vol. 60, no. 7, 2013, pp 2338 – 2345. DOI 10.1109/TED.2013.2264217

  66. Li H., Liu W., Cassell A.M., Kreupl F., Banerjee K.: Low-Resistivity Long-Length Horizontal Carbon Nanotube Bundles for Interconnect Applications—Part I: Process Development. IEEE Trans on ED, Vol. 60, no. 9, 2013, pp 2862 – 2869. DOI 10.1109/TED.2013.2275259

  67. Li H., Liu W., Cassell A.M., Kreupl F., Banerjee K.: Low-Resistivity Long-Length Horizontal Carbon Nanotube Bundles for Interconnect Applications—Part II: Characterization. IEEE Trans on ED, Vol. 60, no. 9, 2013, pp 2870 – 2876. DOI 10.1109/TED.2013.2275258

  68. Sharad M., Roy K.: Spintronic Switches for Ultralow Energy On-Chip and Interchip Current-Mode Interconnects. IEEE ED Lett., Vol. 34, no. 8, 2013, pp 1068 – 1070. DOI 10.1109/LED.2013.2268152

  69. Ceyhan A., Naeemi A.: Cu Interconnect Limitations and Opportunities for SWNT Interconnects at the End of the Roadmap. IEEE Trans on ED, Vol. 60, no. 1, 2013, pp 374 – 382. DOI 10.1109/TED.2012.2224663

  70. Subash S., Kolar J., Chowdhury M.: A New Spatially Rearranged Bundle of Mixed Carbon Nanotubes as VLSI Interconnection. IEEE Trans. on Nanotechnology, Vol. 12, no. 1, 2013, pp 3 – 12. DOI 10.1109/TNAno. 2011.2159014

  71. Sewell P., Benson T.M., Vukovic A., Cole S.: Mesh optimisation methods for unstructured transmission-line modelling. IET Science, Measurement & Technology, Vol. 7, no. 1, 2013, pp. 32 – 40. DOI 10.1049/iet-smt.2012.0069

  72. Coelho Marques da Costa E., Kurokawa S., Gomes Pinto A.J., Kordi B., Pissolato J.: Simplified computational routine to correct the modal decoupling in transmission lines and power systems modelling. IET Science, Measurement & Technology, Vol. 7, no. 1, 2013, pp.7 – 15. DOI 10.1049/iet-smt.2012.0057

  73. Yang D.-C., Xie J., Swaminathan M., Wei X.-C., Li E.-P.: A Rigorous Model for Through-Silicon Vias With Ohmic Contact in Silicon Interposer. IEEE Microwave and Guided Wave Letters, Vol. 23, no. 8, 2013, pp 385 – 387. DOI 10.1109/LMWC.2013.2270459

  74. Wolf P., Moser P., Larisch G., Hofmann W., Bimberg D.: High-Speed and Temperature-Stable, Oxide-Confined 980-nm VCSELs for Optical Interconnects. IEEE Journal of Selected Topics in Quantum Electronics, Vol. 19, no. 4, 2013, Article # 1701207. DOI 10.1109/JSTQE.2013.2246773

  75. Chiariello A.G., Maffucci A., Miano G.: Circuit Models of Carbon-Based Interconnects for Nanopackaging. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 11, 2013, pp. 1926 – 1937. DOI 10.1109/TCPMT.2013.2262213

  76. Guang-Hwa Shiue, Zhi-Hao Zhang, Chi-Lou Yeh, Chun-Fu Huang: Analysis and Reduction of Coupling Noise in Coupled Striplines With Inserted Guard Trace With Different Trace Spacings. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 8, 2013, pp. 1372 – 1383. DOI 10.1109/TCPMT.2012.2231467

  77. Shiue G.-H., Kao Y.-H., Hsu C.-M., Tsai Y.-C., Ginste D.V.: Common-Mode Noise Reduction Schemes for Weakly Coupled Differential Serpentine Delay Microstrip Lines. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 3, no. 6, 2013, pp. 1016 – 1027. DOI 10.1109/TCPMT.2013.2254487

  78. Rakheja S., Kumar V., Naeemi A.: Evaluation of the Potential Performance of Graphene Nanoribbons as On-Chip Interconnects. Proc. of the IEEE, Vol. 101, no. 7, 2013, pp. 1740 – 1765. DOI 10.1109/JPROC.2013.2260235

  79. Li K. S.-M., Yi-Yu Liao: IEEE 1500 Compatible Multilevel Maximal Concurrent Interconnect Test. IEEE Trans on VLSI, Vol. 21, no. 7, 2013, pp. 1333 – 1337. DOI 10.1109/TVLSI.2012.2210451

  80. Zhigang Hao, Guoyong Shi, Tan S.X.-D., Tlelo-Cuautle E.: Symbolic Moment Computation for Statistical Analysis of Large Interconnect Networks. IEEE Trans on VLSI, Vol. 21, no. 5, 2013, pp. 944 – 957. DOI 10.1109/TVLSI.2012.2197835

  81. Shelar R.S., Patyra M.: Impact of Local Interconnects on Timing and Power in a High Performance Microprocessor. IEEE Trans on CAD of Integrated Circuits and Systems, Vol. 32, no. 10, 2013, pp. 1623 – 1627. DOI 10.1109/TCAD.2013.2266404

  82. Chao Zhang, Wenjian Yu: Efficient Space Management Techniques for Large-Scale Interconnect Capacitance Extraction With Floating Random Walks. IEEE Trans on CAD of Integrated Circuits and Systems, Vol. 32, no. 10, 2013, pp. 1633 – 1637. DOI 10.1109/TCAD.2013.2273985

  83. Hashim A., Bamiedakis N., Beals J., Penty R.V., White I.H.: Cost-effective 10 Gb/s polymer-based chip-to-chip optical interconnect. IET Optoelectronics, Vol. 6, no. 3, 2012, pp 140 – 146. DOI 10.1049/iet-opt.2012.0003

  84. Chang C.-H., Fang R.-Y., Wang C.-L.: Bended Differential Transmission Line Using Compensation Inductance for Common-Mode Noise Suppression. IEEE Trans on Components, Packaging and Manufacturing Technology, Vol. 2, no. 9, 2012, pp. 1518 – 1525. DOI 10.1109/TCPMT.2012.2192439

  85. Friedrich M., Leone M., Bednarz C.: Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures. IEEE Trans on EMC, Vol. 54, no. 5, 2012, pp. 1097 – 1104. DOI 10.1109/TEMC.2012.2189573

  86. Jian-Min Lu, Yu-Shan Li, Mu-Shui Zhang: An Efficient SPICE-Compatible Model for Striplines Including Cavity Resonant Effect. IEEE Trans on EMC, Vol. 54, no. 4, 2012, pp. 815 – 825. DOI 10.1109/TEMC.2011.2178418

  87. Vande Ginste D., Rogier H., De Zutter D.: An Efficient 1-D Periodic Boundary Integral Equation Technique to Analyze Radiation onto Straight and Meandering Microstrip Lines. IEEE Trans on EMC, Vol. 54, no. 3, 2012, pp. 625 – 633. DOI 10.1109/TEMC.2011.2171491

  88. Silveira F.H., Visacro S., De Conti A., de Mesquita C.R.: Backflashovers of Transmission Lines Due to Subsequent Lightning Strokes. IEEE Trans on EMC, Vol. 54, no. 2, 2012, pp. 316 – 322. DOI 10.1109/TEMC.2011.2181851

  89. Eudes T., Ravelo B., Louis A.: Experimental Validations of a Simple PCB Interconnect Model for High-Rate Signal Integrity. IEEE Trans on EMC, Vol. 54, no. 2, 2012, pp. 397 – 404. DOI 10.1109/TEMC.2011.2165216

  90. Guang-Hwa Shiue, Jia-Hung Shiu, Yi-Chin Tsai, Che-Ming Hsu: Analysis of Common-Mode Noise for Weakly Coupled Differential Serpentine Delay Microstrip Line in High-Speed Digital Circuits. IEEE Trans on EMC, Vol. 54, no. 3, 2012, pp. 655 – 666. DOI 10.1109/TEMC.2011.2173765

  91. Yang Shao, Zhen Peng, Jin-Fa Lee : Signal Integrity Analysis of High-Speed Interconnects by Using Nonconformal Domain Decomposition Method. IEEE Trans. on Components, Packaging and Manufacturing Technology, Vol. 2, no. 1, 2012, pp. 122 – 130. DOI 10.1109/TCPMT.2011.2152402

  92. Sugiura A., Kami Y.: Generation and Propagation of Common-Mode Currents in a Balanced Two-Conductor Line. IEEE Trans on EMC, Vol. 54, no. 2, 2012, pp. 466 – 473. DOI 10.1109/TEMC.2011.2162523

  93. Antonini G.: Spectral Models of Lossy Nonuniform Multiconductor Transmission Lines. IEEE Trans on EMC, Vol. 54, no. 2, 2012, pp. 474 – 481. DOI 10.1109/TEMC.2011.2167015

  94. Rimolo-Donadio R., Supper J., Winkel T., Harrer H., Schuster C.: Analysis and Mitigation of Parasitic Mode Conversion for Microstrip to Stripline Transitions. IEEE Trans on EMC, Vol. 54, no. 2, 2012, pp. 495 – 498. DOI 10.1109/TEMC.2011.2182054

  95. Jiang-Peng Cui, Wen-Sheng Zhao, Wen-Yan Yin, Jun Hu: Signal Transmission Analysis of Multilayer Graphene Nano-Ribbon (MLGNR) Interconnects. IEEE Trans on EMC, Vol. 54, no. 1, 2012, pp. 126 – 132. DOI 10.1109/TEMC.2011.2172947

  96. Stievano I.S., Manfredi P., Canavero F.G.: Carbon Nanotube Interconnects: Process Variation via Polynomial Chaos. IEEE Trans on EMC, Vol. 54, no. 1, 2012, pp. 140 – 148. DOI 10.1109/TEMC.2011.2171490

  97. Wen-Sheng Zhao, Wen-Yan Yin, Yong-Xin Guo: Electromagnetic Compatibility-Oriented Study on Through Silicon Single-Walled Carbon Nanotube Bundle Via (TS-SWCNTBV) Arrays. IEEE Trans on EMC, Vol. 54, no. 1, 2012, pp. 149 – 157. DOI 10.1109/TEMC.2011.2167336

  98. Chiariello A.G., Maffucci A., Miano G.: Electrical Modeling of Carbon Nanotube Vias. IEEE Trans on EMC, Vol. 54, no. 1, 2012, pp. 158 – 166. DOI 10.1109/TEMC.2011.2180024

  99. Poljak D., Shoory A., Rachidi F., Antonijevic S., Tkachenko S.V.: Time-Domain Generalized Telegrapher's Equations for the Electromagnetic Field Coupling to Finite Length Wires Above a Lossy Ground. IEEE Trans on EMC, Vol. 54, no. 1, 2012, pp. 218 – 224 DOI 10.1109/TEMC.2011.2181518

  100. Gazizov T.R., Zabolotsky A.M.: Experimental Results on UWB Pulse Propagation in Low-Voltage Power Cables With Different Cross Sections. IEEE Trans on EMC, Vol. 54, no. 1, 2012, pp. 229 – 231. DOI 10.1109/TEMC.2011.2171971

  101. SangKeun Kwak, Jeongmin Jo, SoYoung Kim: Modeling and co-simulation of I/O interconnects for on-chip and off-chip EMI prediction. Asia-Pacific Symp. on Electromagnetic Compatibility (APEMC), 2012, pp. 821 – 824. DOI 10.1109/APEMC.2012.6237995

  102. Abdel-Majeed M., Chen M., Annavaram M. : A case for 3D stacked analog circuits in high-speed sensing systems. 13th Int. Symp. on Quality Electronic Design (ISQED), 2012, pp. 412 – 417. DOI 10.1109/ISQED.2012.6187526

  103. Park H.H. : Mitigation of noise coupling on RF cable using electromagnetic bandgap structures. Electronics Lett., Vol 47, no 15, 2011, pp 849 – 850. DOI 10.1049/el.2011.1029

  104. Jeonghyeon Cho, Eakhwan Song, Heegon Kim, Seungyoung Ahn, Jun So Pak, Jiseong Kim, Joungho Kim: Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects. IEEE Trans on EMC, Vol. 53, no. 3, 2011, pp. 814 – 822. DOI 10.1109/TEMC.2010.2064319

  105. Stievano I.S., Manfredi P., Canavero F.G.: Stochastic Analysis of Multiconductor Cables and Interconnects. IEEE Trans on EMC, Vol. 53, no. 2, 2011, pp. 501 – 507. DOI 10.1109/TEMC.2011.2119488

  106. Haiyan Xie, Jianguo Wang, Ruyu Fan, Yinong Liu: SPICE Models for Prediction of Disturbances Induced by Nonuniform Fields on Shielded Cables. IEEE Trans on EMC, Vol. 53, no. 1, 2011, pp. 185 – 192. DOI 10.1109/TEMC.2010.2045895

  107. Pable S.D., Hasan M., Kafeel M.A.: Performance Analysis of Ultra Low-Power Mixed CNT Interconnects for Scaled Technology. Int. Symp. on Electronic System Design (ISED), 2011, pp. 285 – 289. DOI 10.1109/ISED.2011.74

  108. Wen-Yan Yin, Wen-Sheng Zhao: Modeling of carbon nanotube (CNT) interconnects. 15th IEEE Workshop on Signal Propagation on Interconnects (SPI), 2011, pp. 79 – 82. DOI 10.1109/SPI.2011.5898845

  109. Marconcini P., Totaro M., Macucci M.: Discussion on the possibility of diffusive transport in mesoscopic conductors. 21st Int. Conf. on Noise and Fluctuations (ICNF), 2011, pp 250 – 253. DOI 10.1109/ICNF.2011.5994314

  110. Bin-Chyi Tseng, Li-Chun Liao, Lin-Kun Wu, Hui-Tsui Lung: Analytical Solutions for the Radiated Emission of Parallel Microstrip Traces. IEEE Trans on Electromagnetic Compatibility, Vol. 53, no. 3, 2011, pp. 842 – 845. DOI 10.1109/TEMC.2011.2136344

  111. Fridhi H., Duchamp G., Vigneras V.: Simulation of aging effects on radiated emission of microstrip line. 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011, pp. 1/6 – 6/6. DOI 10.1109/ESIME.2011.5765837

  112. Leone M., Friedrich M.: Modeling the electromagnetic behavior of parallel-plane interconnections. Int. Conf. on Electromagnetics in Advanced Applications (ICEAA), 2011, pp. 1396 – 1399. DOI 10.1109/ICEAA.2011.6046283

  113. Lijun Jiang, Chuan Xu, Rubin B.J., Weger A.J., Deutsch A., Smith H., Caron A., Banerjee K.: A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures. IEEE Trans. on Advanced Packaging, Vol. 33, no. 4, 2010, pp 777 – 786. DOI 10.1109/TADVP.2010.2090348

  114. Leung Tsang, Braunisch H., Ruihua Ding, Xiaoxiong Gu: Random Rough Surface Effects on Wave Propagation in Interconnects. IEEE Trans. on Advanced Packaging, Vol. 33, no. 4, 2010, pp 839 – 856. DOI 10.1109/TADVP.2010.2089789

  115. Joong-Ho Kim, Dan Oh, Woopoung Kim: Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems. IEEE Trans. on Advanced Packaging, Vol. 33, no. 4, 2010, pp 857 – 867. DOI 10.1109/TADVP.2010.2050204

  116. Fan-Zhi Kong, Wen-Yan Yin, Jun-Fa Mao, Qing-Huo Liu: Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse. IEEE Trans. on Advanced Packaging, Vol. 33, no. 3, 2010, pp 729 – 737. DOI 10.1109/TADVP.2010.2048902

  117. Wei Tan, Ume I.C., Ying Hung, Wu C.F.J.: Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies. IEEE Trans. on Advanced Packaging, Vol. 33, no. 2, 2010, pp 314 – 322. DOI 10.1109/TADVP.2010.2041451

  118. Min Tang, Junfa Mao: Finite-Difference Analysis of Interconnects With Frequency-Dependent Parameters Based on Equivalent Circuit Models. IEEE Trans. on Advanced Packaging, Vol. 33, no. 2, 2010, pp 457 – 467. DOI 10.1109/TADVP.2009.2033200

  119. Li-Han Hsu, Wei-Cheng Wu, Chang Edward-Yi, Zirath H., Yun-Chi Wu, Chin-Te Wang, Lee Ching-Ting: Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications. IEEE Trans. on Advanced Packaging, Vol. 33, no. 1, 2010, pp 30 – 36. DOI 10.1109/TADVP.2009.2034137

  120. Ali G., Ahmad M., Akhter J.I., Maaz K., Karim S., Maqbool M., Shao Guang Yang: Characterization of Cobalt Nanowires Fabricated in Anodic Alumina Template Through AC Electrodeposition. IEEE Trans on Nanotechnology, Vol. 9, no 2, 2010, pp 223 – 228. DOI 10.1109/TNANO.2009.2027599

  121. Sarto M.S., Tamburrano A.: Single-Conductor Transmission-Line Model of Multiwall Carbon Nanotubes. IEEE Trans on Nanotechnology, Vol. 9, no 1, 2010, pp 82 – 92. DOI 10.1109/TNANO.2009.2023516

  122. Hansang Lim: Frequency-Domain Analysis of Effects of a Diverged Interconnect Design Involved in High-Speed Front-End Electronics. IEEE Trans on Instr. & Meas., Vol. 59, no 10, 2010, pp 2779 – 2786. DOI 10.1109/TIM.2010.2045257

  123. Knockaert J., Peuteman J., Catrysse J., Belmans R.: A Vector Impedance Meter Method to Characterize Multiconductor Transmission-Line Parameters. IEEE Trans on EMC, Vol. 52, no 4, 2010, pp 1019 – 1025. DOI 10.1109/TEMC.2010.2053712

  124. Okazima N, Baba Y, Nagaoka N, Ametani A, Temma K, Shimomura T: Propagation Characteristics of Power Line Communication Signals Along a Power Cable Having Semiconducting Layers. IEEE Trans on EMC, Vol. 52, no 3, 2010, pp 756 – 769. DOI 10.1109/TEMC.2010.2046171

  125. D'Amore M., Sarto M. S., Tamburrano A.: Fast Transient Analysis of Next-Generation Interconnects Based on Carbon Nanotubes. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 496 – 503. DOI 10.1109/TEMC.2010.2045383

  126. Antonini G., Orlandi A., Raimondo L.: Advanced Models for Signal Integrity and Electromagnetic Compatibility-Oriented Analysis of Nanointerconnects. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 447 – 454. DOI 10.1109/TEMC.2010.2042603

  127. Er-Ping Li, Xing-Chang Wei, Cangellaris A.C., En-Xiao Liu, Yao-Jiang Zhang, D'Amore M., Joungho Kim, Sudo Toshio: Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects. IEEE Trans on EMC, Vol. 52, no 2, 2010, pp 248 – 265. DOI 10.1109/TEMC.2010.2048755

  128. Hao-Hsiang Chuang, Chih-Jung Hsu, Hong J., Chun-Huang Yu, Cheng A., Ku J., Tzong-Lin Wu: A Broadband Chip-Level Power-Bus Model Feasible for Power Integrity Chip-Package Codesign in High-Speed Memory Circuits. IEEE Trans on EMC, Vol. 52, no 1, 2010, pp 235 – 239. DOI 10.1109/TEMC.2009.2035614

  129. Haiyan Xie, Jianguo Wang, Ruyu Fan, Yinong Liu: SPICE Models to Analyze Radiated and Conducted Susceptibilities of Shielded Coaxial Cables. IEEE Trans on EMC, Vol. 52, no 1, 2010, pp 215 – 222. DOI 10.1109/TEMC.2009.2036929

  130. Poljak D., Antonijevic S., Drissi K., Kerroum K.: Transient Response of Straight Thin Wires Located at Different Heights Above a Ground Plane Using Antenna Theory and Transmission Line Approach. IEEE Trans on EMC, Vol. 52, no 1, 2010, pp 108 – 116. DOI 10.1109/TEMC.2009.2038486

  131. Schuet S.: Wiring Diagnostics Via l1-Regularized Least Squares. IEEE Sensors Journal, Vol. 10, no 7, 2010, pp 1218 – 1225. DOI 10.1109/JSEN.2009.2037823

  132. Al-Qedra M., Aronsson J., Okhmatovski V.: Surface Integral Equation Formulation for Inductance Extraction in 3-D Interconnects. Microwave and Wireless Components Letters, Vol. 20, no 5, 2010, pp 250 – 252. DOI 10.1109/TEMC.2009.2038486

  133. Kichul Kim, Wallis T.M., Rice P., Chin-Jen Chiang, Imtiaz A., Kabos P., Filipovic D.S.: A Framework for Broadband Characterization of Individual Nanowires. Microwave and Wireless Components Letters, Vol. 20, no 3, 2010, pp 178 – 180. DOI 10.1109/LMWC.2010.2040224

  134. Chung D.J., Papapolymerou J: 60-110 GHz low loss HDI transitions for LCP-packaged silicon substrate. Electronics Lett., Vol. 46, no 8, 2010, pp 577 – 578. DOI 10.1049/el.2010.0241

  135. Beche B, Jimenez A, Courbin L, Camberlein L, Artzner F, Gaviot E: Functional silica nano-connections based on fluidic approach for integrated photonics. Electronics Lett., Vol. 46, no 5, 2010, pp 356 – 358. DOI 10.1049/el.2010.2569

  136. Hsu S.-H., Chen Y.-J., You H.-Z.: 10 GHz high-speed optical interconnection. Electronics Lett., Vol. 46, no 2, 2010, pp 149 – 150. DOI 10.1049/el.2010.1439

  137. Lee Kyeong-Jae, Qazi M., Kong J., Chandrakasan A.P.: Low-Swing Signaling on Monolithically Integrated Global Graphene Interconnects. IEEE Trans on ED, Vol. 57, no 12, 2010, pp 3418 – 3425. DOI 10.1109/TED.2010.2083667

  138. Xu Chuan, Li Hong, Suaya R., Banerjee K.: Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs. IEEE Trans on ED, Vol. 57, no 12, 2010, pp 3405 – 3417. DOI 10.1109/TED.2010.2076382

  139. Xiangyu Chen, Akinwande D, Kyeong-Jae Lee, Close G F, Yasuda S, Paul B. C.; Fujita S, Jing Kong, Wong H. P.: Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed CMOS Electronics. IEEE Trans on ED, Vol. 57, no 11, 2010, pp 3137 – 3143. DOI 10.1109/TED.2010.2069562

  140. Ramazani M., Miladi H., Shahabadi M., Mohajerzadeh S.: Loss Measurement of Aluminum Thin-Film Coplanar Waveguide (CPW) Lines at Microwave Frequencies. IEEE Trans on ED, Vol. 57, no 8, 2010, pp 2037 – 2040. DOI 10.1109/TED.2010.2050110

  141. Giustiniani A., Tucci V., Zamboni W.: Modeling Issues and Performance Analysis of High-Speed Interconnects Based on a Bundle of SWCNT. IEEE Trans on ED, Vol. 57, no 8, 2010, pp 1978 – 1986. DOI 10.1109/TED.2010.2050836

  142. Tzu-Yuan Chao, Chun-Hsing Li, Yang Chuan Chen, Hsin-Yu Chen, Yu-Ting Cheng, Chien-Nan Kuo: An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration. IEEE Trans on ED, Vol. 57, no 4, 2010, pp 928 – 938. DOI 10.1109/TED.2010.2040660

  143. Tsuchiya H., Ando H., Sawamoto S., Maegawa T., Hara T., Yao H., Ogawa M.: Comparisons of Performance Potentials of Silicon Nanowire and Graphene Nanoribbon MOSFETs Considering First-Principles Bandstructure Effects. IEEE Trans on ED, Vol. 57, no 2, 2010, pp 404 – 414. DOI 10.1109/TED.2009.2037365

  144. Bontzios Y. I., Hatzopoulos A. A.: A Unified Method for Calculating Capacitive and Resistive Coupling Exploiting Geometry Constraints on Lightly and Heavily Doped CMOS Processes. IEEE Trans on ED, Vol. 57, no 8, 2010, pp 1751 – 1760. DOI 10.1109/TED.2010.2050112

  145. Wu Joyce H, del Alamo J. A.: Fabrication and Characterization of Through-Substrate Interconnects. IEEE Trans on ED, Vol. 57, no 6, 2010, pp 1261 – 1268. DOI 10.1109/TED.2010.2045671

  146. Demeester T., De Zutter D.: Fields at a Finite Conducting Wedge and Applications in Interconnect Modeling. IEEE Trans on MTT, Vol. 58, no 8, 2010, pp 2158 – 2165. DOI 10.1109/TMTT.2010.2053061

  147. Broyde F., Clavelier E.: Echo-Free and Crosstalk-Free Transmission in Particular Interconnections. IEEE Microwave and Wireless Components Letters, Vol. 19, no 4, 2009, pp 209 – 211. DOI 10.1109/LMWC.2009.2015496

  148. El-Desouki M.M., Abdelsayed S.M., Deen M.J., Nikolova N.K., Haddara Y.M.: The Impact of On-Chip Interconnections on CMOS RF Integrated Circuits. IEEE Trans on ED, Vol. 56, no 9, 2009, pp 1882-1890. DOI 10.1109/TED.2009.2026194

  149. Ding W., Wang G.: Efficient timing modelling of coupled inductance dominant RLC interconnects. Electronics Lett., Vol. 45, no 1, 2009, pp 22 – 24. DOI 10.1049/el:20092201

  150. Monteiro Â., ; Santos M., Neves A., Dias N.: Noise Minimization for Low Power Bandgap Reference and Low Dropout Regulator Cores. Journal of Low Power Electronics, Vol. 5, no 2, August 2009 , pp. 206 – 222. DOI 10.1166/jolpe.2009.1021

  151. Kai Kang, Lan Nan, Rustagi S.C., Mouthaan K., Jinglin Shi, Kumar R., Wen-Yan Yin, Le-Wei Li: A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up to 110 GHz. IEEE Trans on MTT, Vol. 56, no 4, 2008, pp 942 – 951. DOI 10.1109/TMTT.2008.919374

  152. L. N. Tran, Pasquet D., Bourdel E., Quintanel S.: CAD-Oriented Model of a Coplanar Line on a Silicon Substrate Including Eddy-Current Effects and Skin Effect. IEEE Trans on MTT, Vol. 56, no 3, 2008, pp 663 – 670. DOI 10.1109/TMTT.2008.916941

  153. S.-H. Lee, J.-M. Jin: Efficient Full-Wave Analysis of Multilayer Interconnection Structures Using a Novel Domain Decomposition–Model-Order Reduction Method. IEEE Trans on MTT, Vol. 56, no 1, 2008, pp 121 – 130. DOI 10.1109/TMTT.2007.912192

  154. Khan Z.A., Bayram Y., Volakis J.L.: EMI/EMC Measurements and Simulations for Cables and PCBs Enclosed Within Metallic Structures. IEEE Trans on EMC, Vol. 50, no 2, 2008, pp 441 – 445. DOI 10.1109/TEMC.2008.921030

  155. Lalgudi S.N., Engin E., Casinovi G., Swaminathan M.: Accurate transient simulation of interconnects characterized by band-limited data with propagation delay enforcement in a modified nodal analysis framework. IEEE Trans on EMC, Vol. 50, no 3, part 2, 2008, pp 715 – 729. DOI 10.1109/TEMC.2008.924394

  156. Pajovic M. M.: A Closed-Form Equation for Estimating Capacitance of Signal Vias in Arbitrarily Multilayered PCBs. IEEE Trans on EMC, Vol. 50, no 4, 2008, pp 966 – 973. DOI 10.1109/TEMC.2008.2004606

  157. S. N. Lalgudi, E. Engin, G. Casinovi, M. Swaminathan: Accurate Transient Simulation of Interconnects Characterized by Band-Limited Data With Propagation Delay Enforcement in a Modified Nodal Analysis Framework. IEEE Trans on EMC, Vol 50, no 3, August 2008, pp 715 – 729. DOI 10.1109/TEMC.2008.924394

  158. Levin B. M.: Calculation of Electrical Parameters of Two-Wire Lines in Multiconductor Cables. IEEE Trans on EMC, Vol 50, no 3, August 2008, pp 697 – 701. DOI 10.1109/TEMC.2008.927924

  159. Chinea A., Triverio A., Grivet-Talocia S.: Compact macromodeling of electrically long interconnects. Electrical Performance of Electronic Packaging, 2008, pp 199 – 202. DOI:10.1109/EPEP.2008.4675913

  160. Chen J., Abhari R.: Signal integrity improvement in transmission lines backed by an EBG structure. Electrical Performance of Electronic Packaging, 2008, pp 307 – 310. DOI: 10.1109/EPEP.2008.4675941

  161. Jiang L., Kolluri S., Rubin B.J., Smith H., Colgan E.G., Scheuermann M.R., Wakil J.A., Deutsch A., Gill J.: Thermal modeling of on-chip interconnects and 3D packaging using EM tools. Electrical Performance of Electronic Packaging, 2008, pp 279 – 282. DOI: 10.1109/EPEP.2008.4675934

  162. Lin R.-B.: Inter-wire coupling reduction analysis of bus-invert coding. IEEE Trans on CAS I, Vol. 55, no 7, July 2008, pp 1911 – 1920. DOI 10.1109/TCSI.2008.918197

  163. Unterweissacher M., Brandtner T., Mertens K., Pribyl W.: Inductance formulas adapted for direct use in Spice simulators. Electronics Lett., Vol. 44, no 2, 2008, pp 92 – 93. DOI 10.1049/el:20083205

  164. En-Xiao Liu, Er-Ping Li, Xingchang Wei : Thermal-aware electrical analysis of high-speed interconnect. Electrical Design of Advanced Packaging and Systems Symp. (EDAPS 2008), 2008, pp. 171 – 174. DOI 10.1109/EDAPS.2008.4736027

  165. Sabanayagam A., Kumar V. Abhai, Raju S Kumar, N. Suresh : Signal integrity analysis for high speed on-chip interconnects using Differential Evolution algorithm. 10th Int. Conf. on Electromagnetic Interference & Compatibility (INCEMIC 2008), 2008, pp. 117 – 122.

  166. A. Alu, A. Salandrino, N. Engheta : Parallel, series, and intermediate interconnections of optical nanocircuit elements. Part 2: Nanocircuit and physical interpretations. J. Opt. Soc. Am. B, Vol. 24, no. 12, 2007, pp. 3014 – 3022. DOI 10.1364/JOSAB.24.003014

  167. Naeemi A, Sarvari R, Meindl J.D.: Performance Modeling and Optimization for Single- and Multi-Wall Carbon Nanotube Interconnects. 44th ACM/IEEE Design Automation Conf. (DAC '07), 2007, pp. 568 – 573.

  168. Naeemi A., Meindl J. D.: Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems. IEEE Trans. on Electron Devices, Vol. 54, no. 1, 2007, pp. 26 – 37. DOI 10.1109/TED.2006.887210

  169. Wu W.C., Hsu L.H., Chang E.Y., Starski J.P., Zirath H. : 60 GHz broadband 0/1-level RF-via interconnect for RF-MEMS packaging. Electronics Lett., Vol. 43, no 22, 2007, pp 1203 – 1205. DOI 10.1049/el:20072083

  170. Kumar R., Kang K., Rustagi S.C., Mouthaan K., Wong T.K.S. : SPICE compatible modelling of on-chip coupled interconnects. Electronics Lett., Vol. 43, no 24, 2007, pp 1336 – 1338. DOI 10.1049/el:20072620

  171. Paul C. R.: A Brief History of Work in Transmission Lines for EMC Applications. IEEE Trans on EMC, vol 49, no 2, May 2007, pp 237 – 252. DOI 10.1109/TEMC.2007.897162

  172. M. de Magistris, L. de Tommasi, A. Maffucci, G. Miano: Low-Order Identification of Interconnects With the Generalized Method of Characteristics. IEEE Trans on EMC, vol 49, no 3, August 2007, pp 670 – 676. DOI 10.1109/TEMC.2007.902195

  173. Tiemeijer L. F., Pijper R. M. T., Havens R. J., Hubert O.: Low-Loss Patterned Ground Shield Interconnect Transmission Lines in Advanced IC Processes. IEEE Trans on MTT, Vol. 55, no 3, 2007, pp 561 – 570. DOI 10.1109/TMTT.2007.891691

  174. Page J.E., Marquez-Segura E., Casares-Miranda F.P., Esteban J., Otero P., Camacho-Pealosa C.: Exact Analysis of the Wire-Bonded Multiconductor Transmission Line. IEEE Trans on MTT, Vol. 55, no 8, 2007, pp 1585 – 1592. DOI 10.1109/TMTT.2007.902084

  175. Spencer T.J., Joseph P.J., Tae Hong Kim, Swaminathan M., Kohl P.A.: Air-Gap Transmission Lines on Organic Substrates for Low-Loss Interconnects. IEEE Trans on MTT, Vol. 55, no 9, 2007, pp 1919 – 1925. DOI 10.1109/TMTT.2007.904326

  176. Chen X.: EM Modeling of Microstrip Conductor Losses Including Surface Roughness Effect. IEEE Microwave and Wireless Components Letters, Vol. 17, no 2, 2007, pp 94 – 96. DOI 10.1109/LMWC.2006.890326

  177. Gil M., Bonache J., Selga J., Garcia-Garcia J., Martin F.: Broadband Resonant-Type Metamaterial Transmission Lines. IEEE Microwave and Wireless Components Letters, Vol. 17, no 2, 2007, pp 97 – 99. DOI 10.1109/LMWC.2006.890327

  178. Wu Y. C., Chang E. Y., Lin Y. C., Hsu H. T., Chen S. H., Wu W. C., Chu L. H., Chang C. Y.: SPDT GaAs Switches With Copper Metallized Interconnects. IEEE Microwave and Wireless Components Letters, Vol. 17, no 2, 2007, pp 133 – 135. DOI 10.1109/LMWC.2006.890340

  179. Ryu C., Park J., Jun So Pak, Lee K., Oh T., Kim J.: Suppression of Power/Ground Inductive Impedance and Simultaneous Switching Noise Using Silicon Through-Via in a 3-D Stacked Chip Package. IEEE Microwave and Wireless Components Letters, Vol. 17, no 12, 2007, pp 855 – 857. DOI 10.1109/LMWC.2007.910485

  180. Saito Y., Filipovic D.S.: Analysis and Design of Monolithic Rectangular Coaxial Lines for Minimum Coupling. IEEE Trans on MTT, Vol. 55, no 12, part 1, 2007, pp 2521 – 2530. DOI 10.1109/TMTT.2007.910092

  181. Magesacher T., Odling P., Borjesson P.O., Nordstrom T.: Verification of Multipair Copper-Cable Model by Measurements. IEEE Trans on Instr. & Meas., Vol. 56, no 5, 2007, pp 1883 – 1886. DOI 10.1109/TIM.2007.904486

  182. Nedev N.H., McLaughlin S., Cook J.W.: Wideband Unshielded-Twisted-Pair (UTP) Cable Measurements and Modeling for Multiple-Input–Multiple-Output (MIMO) Systems. IEEE Trans on Instr. & Meas., Vol. 56, no 6, 2007, pp 2515 – 2521. DOI 10.1109/TIM.2007.907951

  183. Triverio P., S. Grivet-Talocia, M. S. Nakhia, F. G. Canavero, R. Achar : Stability, causality, and passivity in electrical interconnect models. IEEE Trans. Adv. Packag., Vol. 30, no 4, 2007, pp. 795 – 808. DOI 10.1109/TADVP.2007.901567

  184. Nakhla N., A. E. Ruehli, M. S. Nakhla, R. Achar, C. Chen : Waveform relaxation techniques for simulation of coupled interconnects with frequency-dependent parameters. IEEE Trans. Adv. Packag., Vol. 30, no 2, 2007, pp. 257 – 269. DOI 10.1109/TADVP.2007.896010

  185. Saraswat D., R. Achar, M. S. Nakhla: Fast passivity verification and enforcement via reciprocal systems for interconnects with large order macromodels. IEEE Trans on VLSI Syst., Vol 15, no 1, 2007, pp 48 – 59. DOI 10.1109/TVLSI.2007.891085  

  186. Simpson J.J., Taflove A., Mix J.A., Heck H.: Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects. IEEE IEEE Trans on MTT, Vol. 54, no 5, 2006, pp 1983 – 1990. DOI 10.1109/TMTT.2006.873622

  187. Reza S., Bosman G., Islam M.S., Kamins T.I., Sharma S., Williams R.S.: Noise in Silicon Nanowires. IEEE Transactions on Nanotechnology, vol. 5, no. 5, 2006, pp. 523 – 529. DOI 10.1109/TNANO.2006.880908

  188. Zhang Z., Lu J., Hellstrom P.-E., Ostling M., Zhang S.-L.: Ni2Si nanowires of extraordinarily low resistivity. Applied Physics Letters, vol. 88, no. 21, 2006, pp. 213103 – 213103-3. DOI 10.1063/1.2207222

  189. Lahiji R.R., Herrick K.J., Yongshik Lee, Margomenos A., Mohammadi S., Katehi L.P.B.: Multiwafer vertical interconnects for three-dimensional integrated circuits. IEEE IEEE Trans on MTT, Vol. 54, no 6, 2006, pp 2699 – 2706. DOI 10.1109/TMTT.2006.874867

  190. Akalin T., Treizebré A., Bocquet B.: Single-wire transmission lines at terahertz frequencies. IEEE Trans on MTT, Vol. 54, no 6, 2006, pp 2762 – 2767. DOI 10.1109/TMTT.2006.874890

  191. Jin J.-D., Hsu S.S.H., Yang M.-T., Liu S.: Low-loss differential semicoaxial interconnects in CMOS process. IEEE Trans on MTT, Vol. 54, no 12, 2006, pp 4333 – 4340. DOI 10.1109/TMTT.2006.886000

  192. Reza S., Bosman G., Islam M.S., Kamins T.I., Sharma S., Williams R.S.: Noise in Silicon Nanowires. IEEE Trans on Nanotechnology, Vol. 5, no 5, 2006, pp 523 – 529. DOI 10.1109/TNANO.2006.880908

  193. Yu S., Petranovic D. M., Krishnan S., Lee K., Yang C.Y.: Loop-based inductance extraction and modeling for multicomponent on-chip interconnects. IEEE Trans on ED, vol. 53, no. 1, January 2006, pp 135 – 145. DOI 10.1109/TED.2005.860655

  194. Knickerbocker J.U., Patel C.S., Andry P.S.; Tsang C.K., Buchwalter L.P., Sprogis E.J., Gan H., Horton R.R., Polastre R.J., Wright S.L., Cotte J.: 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE J. of SSC, vol 41, no 8, Aug 2006, pp 1718 – 1725. DOI 10.1109/JSSC.2006.877252

  195. Antonini G., Orlandi A.: Efficient Transient Analysis of Long Lossy Shielded Cables. IEEE Trans on EMC, vol 48, no 1, February 2006, pp 42 – 56. DOI 10.1109/TEMC.2006.870767

  196. Orlandi A., Antonini G., Rizzi R. M.: Equivalent Circuit Model of a Bundle of Cables for Bulk Current Injection (BCI) Test. IEEE Trans on EMC, vol 48, no 4, November 2006, pp 701 – 713. DOI 10.1109/TEMC.2006.882850

  197. Kahng, S.: Improved Differential Signaling of the DeCap-Loaded Rectangular Power-Bus With a Fast Calculation Method. IEEE Microwave & Wireless Comp. Let., vol 16, no 9, Sept 2006, pp 484 – 486. DOI 10.1109/LMWC.2006.880716

  198. Choi J: Alternating impedance electromagnetic bandgap structure for noise isolation in ultra-wideband. Electronics Lett., Vol. 42, no 8, 2006, pp 467 – 468. DOI 10.1049/el:20060619

  199. Ryu C., Chung D., Lee C., Kim J., Bae K., Yu J., Lee S., Kim J.: A Three-Dimensional Stacked-Chip Star-Wiring Interconnection for a Digital Noise-Free and Low-Jitter I/O Clock Distribution Network. IEEE Microwave and Wireless Components Letters, Vol. 16, no 12, 2006, pp 651 – 653. DOI 10.1109/LMWC.2006.885604

  200. Jingook Kim, Youchul Jeong, Jaemin Kim, Joungho Kim: Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor. IEEE Microwave and Wireless Components Letters, Vol. 16, no 10, 2006, pp 534 – 536. DOI 10.1109/LMWC.2006.882405

  201. Antonini G., Orlandi A.: Efficient transient analysis of long lossy shielded cables. IEEE Trans on EMC, Vol. 48, no 1, 2006, pp 42 – 56. DOI 10.1109/TEMC.2006.870767

  202. Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang: Nondestructive analysis of interconnection in two-die BGA using TDR. IEEE Trans on Instr. & Meas., Vol. 55, no 2, 2006, pp 400 – 415. DOI 10.1109/TIM.2006.870318

  203. Shuo Wang, Lee Fred.C., van Wyk J.D.: Inductor winding capacitance cancellation using mutual capacitance concept for noise reduction application. IEEE Trans on EMC, Vol. 48, no 2, 2006, pp 311 – 318. DOI 10.1109/TEMC.2006.873867

  204. Xia L., Meng J., Xu R., Yan B., Guo Y.: Modeling of 3-D Vertical Interconnect Using Support Vector Machine Regression. IEEE Microwave and Wireless Components Letters, Vol. 16, no 12, 2006, pp 639 – 641. DOI 10.1109/LMWC.2006.885585

  205. Yoon-joo Kim, Joon-soo Kim, Ji-young Chung, Seok-ho Na, Jin-young Kim, Seok-bong Kim : Low-K Wire Bonding. Proc. 56th Electronic Components and Technology Conf., 2006, pp 1616 – 1622. DOI 10.1109/ECTC.2006.1645873

  206. Min Tang, J.-F. Mao, X.-C. Li: Analysis of interconnects with frequency-dependent parameters by differential quadrature method. IEEE Microwave & Wireless Comp. Let., vol 15, no 9, 2005, pp 877 – 879. DOI 10.1109/LMWC.2005.859982

  207. Kamgaing T., Ramahi O.: Design and Modeling of High-Impedance Electromagnetic Surfaces for Switching Noise Suppression in Power Planes. IEEE Trans on EMC, vol 47, no 3, Aug. 2005, pp 479 – 489. DOI 10.1109/TEMC.2005.850692

  208. Caputa P., Svensson C.: Well-Behave Global On-Chip Interconnect. IEEE Trans on CAS I, Vol 52, No 2, February 2005, pp 318 – 323. DOI 10.1109/TCSI.2004.840483

  209. Pfeiffer U., Welch B.: Equivalent Circuit Model Extraction of Flip-Chip Ball Interconnects Based on Direct Probing Techniques. IEEE Microwave & Wireless Comp. Let., vol 15, no 9, Sept 2005, pp 594 – 596. DOI 10.1109/LMWC.2005.855380

  210. Dudley S.E.M., Quinlan T., Henning I.D., Walker S.D., Davey R.P., Boyd I., Wallace A.D., Payne D.B.: Ultra-low power, band plan agnostic, hybrid optical/copper system for last mile access over twisted pair. Electronics Lett., Vol. 41, no 15, 2005, pp 879 – 880. DOI 10.1049/el:20051914

  211. Hagmann M.J.: Isolated carbon nanotubes as high-impedance transmission lines for microwave through terahertz frequencies. IEEE Trans on Nanotechnology, Vol. 4, no 2, 2005, pp 289 – 296. DOI 10.1109/TNANO.2004.842040

  212. Min Tang, Jun-Fa Mao, Xiao-Chun Li: Analysis of interconnects with frequency-dependent parameters by differential quadrature method. IEEE Microwave and Wireless Components Letters, Vol. 15, no 12, 2005, pp 877 – 879. DOI 10.1109/LMWC.2005.859982

  213. Mesa F., Jackson D.R.: A novel approach for calculating the characteristic impedance of printed-circuit lines. IEEE Microwave and Wireless Components Letters, Vol. 15, no 4, 2005, pp 283 – 285. DOI 10.1109/LMWC.2005.845751

  214. Liu H., Li Z., Sun X.: Compact defected ground structure in microstrip technology. Electronics Lett., Vol. 41, no 3, 2005, pp 132 – 134. DOI 10.1049/el:20057331

  215. Guckenberger D., Schuster C., Kwark Y., Kornegay K.: On-chip crosstalk mitigation for densely packed differential striplines using via fence enclosures. Electronics Lett., Vol. 41, no 7, 2005, pp 412 – 414. DOI 10.1049/el:20058423

  216. Amin K.M., Fikry W., Sabry M.N., Ragai H.F.: Modelling of thermal failure of metallic interconnects under electrostatic discharge transients. Electronics Lett., Vol. 41, no 19, 2005, pp 1056 – 1057. DOI 10.1049/el:20052032

  217. Oho K.: Delay calculation capturing crosstalk effects due to coupling capacitors. Electronics Lett., Vol. 41, no 8, 2005, pp 458– 460. DOI 10.1049/el:20050127

  218. Ip S.K.: Synthesis of generalised characteristic model for high-speed interconnects using current sources approach. Electronics Lett., Vol. 40, no 1, 2004, pp 8 – 10. DOI 10.1049/el:20040061

  219. Lin D.-B.: Signal integrity of bent differential transmission lines. Electronics Lett., Vol. 40, no 19, 2004, pp 1191 – 1192. DOI 10.1049/el:20045322

  220. Leuchtmann P., Rufenacht J.: On the calculation of the electrical properties of precision coaxial lines. IEEE Trans on Instr. & Meas., Vol. 53, no 2, 2004, pp 392 – 397. DOI 10.1109/TIM.2003.822719

  221. Rho B.S., Cho M.H., Cho H.S., Kang S., Park H.-H., Ha S.-W., Rhee B.-H.: Low-crosstalk and high-efficiency optical interconnection using 45/spl deg/-ended connection rods. Electronics Lett., Vol. 40, no 12, 2004, pp 730 – 732. DOI 10.1049/el:20040442

  222. Sasaki T., Morimoto T., Iwase Y., Aoki N., Ochiai Y., Shailos, A., Bird J.P.,  Lilly M.P.,  Reno J.L., Simmons J. A.: Novel Many-Body Transport Phenomenon in Coupled Quantum Wires. IEEE Trans on Nanotechnology, Vol. 3, no 1, 2004, pp 110 – 114. DOI 10.1109/TNANO.2003.820520

  223. Gavrilakis A., Duffy A.P., Hodge K.G., Willis A.J.: Partial capacitance calculation for shielded twisted pair cables. IEEE Trans on EMC, Vol. 46, no 2, 2004, pp 299 – 302. DOI 10.1109/TEMC.2004.826883

  224. Min S-H, Swaminathan M.: Construction of Broadband Passive Macromodels from Frequency Data for Simulation of Distributed Interconnect Networks. IEEE Trans on EMC, vol 46, no 4, Nov 2004, pp 544 – 558. DOI 10.1109/TEMC.2004.837683

  225. Burghartz J.N., Rejaei B., Schellevis H.: Saddle Add-On Metallization for RF-IC Technology. IEEE Trans on ED, Vol 51, No 3, March 2004, pp 460 – 465. DOI 10.1109/TED.2004.823325

  226. Antonini G., Orlandi A.: Spice equivalent circuit of a two-parallel-wires shielded cable for evaluation of the RF induced voltages at the terminations. IEEE Trans on EMC, Vol. 46, no 2, 2004, pp 189 – 198. DOI 10.1109/TEMC.2004.826887

  227. Karkkainen M.K.: FDTD surface impedance model for coated conductors. IEEE Trans on EMC, Vol. 46, no 2, 2004, pp 222 – 233. DOI 10.1109/TEMC.2004.826891

  228. Maffucci A., Miano G., Villone F.: An enhanced transmission line model for conducting wires. IEEE Trans on EMC, Vol. 46, no 4, 2004, pp 512 – 528. DOI 10.1109/TEMC.2004.837685

  229. Sung-Hwan Min; Swaminathan M.: Construction of broadband passive macromodels from frequency data for simulation of distributed interconnect networks. IEEE Trans on EMC, Vol. 46, no 4, 2004, pp 544 – 558. DOI 10.1109/TEMC.2004.837683

  230. Buccella C., Feliziani M., Manzi G.: Detection and localization of defects in shielded cables by time-domain measurements with UWB pulse injection and clean algorithm postprocessing. IEEE Trans on EMC, Vol. 46, no 4, 2004, pp 597 – 605. DOI 10.1109/TEMC.2004.837842

  231. Wang P., Tien N.C., Kan E. C.: Permalloy Loaded Transmission Lines for High-Speed Interconnect Applications. IEEE Tans on ED, Vol 51, No 1, January 2004, pp 74 – 81. DOI

  232. Caniggia S., Maradei F.: SPICE-Like Models for the Analysis of the Conducted and Radiated Immunity of Shielded Cables. IEEE Trans on EMC, vol 46, no 4, Nov 2004, pp 606 – 615. DOI

  233. Carrillo-Ramirez R., Jackson R. W.: A Technique for Interconnecting Millimeter Wave Integrated Circuits Using BCB and Bump Bond. IEEE Microwave & Wireless Comp Let, Vol. 13, No 6, June 2003, pp 196 – 198. DOI 10.1109/LMWC.2003.811677

  234. Pignari S. A., Orlandi A.: Long-Cable Effects on Conducted Emissions Levels. IEEE Trans on EMC, Vol.45, No.1, February 2003, pp 43 – 54. DOI 10.1109/TEMC.2002.808023

  235. Kam D.G., Lee H., Kim J.: A New Twisted Differential Line Structure on High-Speed Printed Circuit Boards to Enhance Immunity to Crosstalk and External Noise. IEEE Microwave & Wireless Comp Let, Vol.13, No 9, Sept. 2003, pp 411 – 413. DOI 10.1109/LMWC.2003.815181

  236. Zhong G., Koh C-K., Roy K.: On-Chip Interconnect Modeling by Wire Duplication. IEEE Trans on CAD, Vol 22, No 11, November 2002, pp 1521 – 1532. DOI 10.1109/TCAD.2003.818303

  237. Vrudhula S., Blauww D.T., Sirichotiyakul S.: Probabilistic Analysis of Interconnect Coupling Noise. IEEE Trans on CAD, Vol 22, No 9, Sept. 2003, pp 1188 – 1230. DOI 10.1109/TCAD.2003.816212

  238. Kolding T., Iversen C.: Simple Noise Deembedding Technique for On-Wafer Shield-Based Test Fixtures. IEEE Trans. on MTT, vol. 51, no. 1, Jan. 2003, pp 11 – 14. DOI 10.1109/TMTT.2002.806938

  239. Jun Fan, Drewniak J.L., Knighten J.L.: Lumped-circuit model extraction for vias in multilayer substrates. IEEE Trans on EMC, Vol. 45, no 2, 2003, pp 272 – 280. DOI 10.1109/TEMC.2003.810808

  240. Tie Jun Cui, Weng Cho Chew: A full-wave model of wire structures with arbitrary cross sections. IEEE Trans on EMC, Vol. 45, no 4, 2003, pp 626 – 635. DOI 10.1109/TEMC.2003.819062

  241. Tzong-Lin Wu, Chun-Chih Kuo, Hsiao-Chen Chang, Jian-Sheng Hsieh: A novel systematic approach for equivalent model extraction of embedded high-speed interconnects in time domain. IEEE Trans on EMC, Vol. 45, no 3, 2003, pp 493 – 501. DOI 10.1109/TEMC.2003.815526

  242. Becer M.R., Blaauw D., Panda R., Hajj I.N.: Early Probabilistic Noise Estimation for Capacitively Coupled Interconnects. IEEE Trans on CAD, Vol 22, No 3, March 2003, pp 337 – 345. DOI 10.1109/TCAD.2002.807892

  243. Zhong G., Koh C-K.: Exact Closed-Form Formula for Partial Mutual Inductance of Rectangular Conductors. IEEE Trans on CAS I, vol 50, no 10, Oct 2003, pp 1349 – 1353. DOI 10.1109/TCSI.2003.817778

  244. Sim S.-P., Krishnan S., Petranovic D.M., Arora N., Lee K., Yang C.Y.: A Unified RLC Model for High-Speed On-Chip Interconnects. IEEE Trans on ED, Vol 50, No 6, June 2003, pp 1501 – 1509. DOI 10.1109/TED.2003.813345

  245. Elgamel M.A., Tharmalingam K.S., Bayoumi M.A.: Noise-constrained interconnect optimization for nanometer technologies. Proc. of the 2003 Int. Symp. on Circuits and Systems (ISCAS '03), vol. 5, 2003, pp. V-481 – V-484. DOI 10.1109/ISCAS.2003.1206323

  246. Kleveland B., Qi X., Maddem L.,Furusawa T., Dutton R., Horrowitz M, Wong S.S.: High-Frequency Characterization of On-Chip Digital Interconnects. IEEE J. of SSC, 37(6), Oct. 2002, pp 716 – 724. DOI 10.1109/JSSC.2002.1004576

  247. Sakalas P., Zirath H., Litwin A, Schröter M., Matulionis A.: Impact of Pad and Gate Parasitics on Small-Signal and Noise Modeling of 0.35 m Gate Length MOS Transistors. IEEE Trans. on ED, vol. 49, no. 5, May 2002, pp 871 – 879. DOI 10.1109/16.998597

  248. Van Deursen A.R.J., van Waes J.B.M.: Mitigation of ground loop effects in high-voltage measurements. IEEE Trans on Instr. & Meas., Vol. 51, no 3, 2002, pp 480 – 486. DOI 10.1109/TIM.2002.1017718

  249. Martinod E., Bertrand V., Lalande – Guionie M., Reineix A.R., Jecko B.: Behavior of Multifilar Connectors in Electromagnetic Compatibility: A New Experimental Transient Approach. IEEE Trans on EMC, Vol 44, No 3, August 2002, pp 424 – 433. DOI 10.1109/TEMC.2002.801754

  250. Maffucci A., Miano G.: Time-Domain Two-Port Representation of Some Non-uniform Two-Conductor Transmission Lines. IEEE Trans on CAS I, 49(11), Nov 2002, pp 1639 – 1645. DOI 10.1109/TCSI.2002.804539

  251. Zhao Zhihua, Ma Weiming: AC impedance of an isolated flat conductor. IEEE Trans on EMC, Vol. 44, no 3, 2002, pp 482 – 486. DOI 10.1109/TEMC.2002.801773

  252. Chul-Soo Kim, Jong-Sik Lim, Sangwook Nam, Kwang-Yong Kang, Dal Ahn: Equivalent circuit modelling of spiral defected ground structure for microstrip line. Electronics Lett., Vol. 38, no 19, 2002, pp 1109 – 1110. DOI 10.1049/el:20020742

  253. Shin H., Xu Z., Miyashiro K., Chang M.F.: Estimation of signal-to-noise ratio improvement in RF-interconnect. Electronics Lett., Vol. 38, no 25, 2002, pp 1666 – 1667. DOI 10.1049/el:20021167

  254. St John R.H., Holland R.: Simple deterministic solutions for cables over a ground plane or in an enclosure. IEEE Trans on EMC, Vol. 44, no 4, 2002, pp 574 – 579. DOI 10.1109/TEMC.2002.804777

  255. Hao Wang, Yun Ji, Hubing T.H.: Finite-element modeling of coaxial cable feeds and vias in power-bus structures. IEEE Trans on EMC, Vol. 44, no 4, 2002, pp 569 – 574. DOI 10.1109/TEMC.2002.804776

  256. Chai T.C., Lister K.A., Curnming D.R.S.: Wave-breaking on CMOS interconnect.  Electronics Lett., Vol. 38, no 16, 2002, pp 878 – 879. DOI 10.1049/el:20020620

  257. Sato T., Sylvester D., Cao Y., Hu C.: Accurate In Situ Measurement of Peak Noise and Delay Change Induced by Interconnect Coupling. IEEE J. of Solid-State Circ, 36(10), Oct 2001, pp 1587 – 1591. DOI 10.1109/4.953489

  258. E. Vandamme, D. Schreurs, C. van Dinther: Improved Three-Steps De-Embedding Method to Accurately Account for the Influence of Pad Parasitics in Silicon On-Wafer RF Test-Structures. IEEE Trans. on ED, vol. 48, no. 4, April 2001, pp 737 – 742. DOI 10.1109/16.915712

  259. Konefal T., Dawson J.F., Denton A.C., Benson T.M., Christopoulos C., Marvin A.C., Porter S.J., Thomas D.W.P.: Electromagnetic coupling between wires inside a rectangular cavity using multiple-mode-analogous-transmission-line circuit theory. IEEE Trans on EMC, Vol. 43, no 3, 2001, pp 273 – 281. DOI 10.1109/15.942600

  260. Deutsch A., Kopcsay G.V., Coteus P.W., Surovic C.W., Dahlen P.E., Heckmann D.L., Dah-Weih Duan: Frequency-dependent losses on high-performance interconnections. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 446 – 465. DOI 10.1109/15.974624

  261. Williams D.F., Holloway C.L.: Transmission-line parameter approximation for digital simulation. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 466 – 470. DOI 10.1109/15.974625

  262. Grivet-Talocia S., Canavero F.: Wavelet-based high-order adaptive modeling of lossy interconnects. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 471 – 484. DOI 10.1109/15.974626

  263. Nickel J.G.,  Trainor D., Schutt-Aine J.E.: Frequency-domain-coupled microstrip-line normal-mode parameter extraction from S-parameters. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 495 – 503. DOI 10.1109/15.974628

  264. Li L.Y., Bridges G.E., Ciric I.R.: Analysis of high-speed interconnects using efficient multipoint Pade approximation. Electronics Lett., Vol. 37, no 14, 2001, pp 874 – 875. DOI 10.1049/el:20010615

  265. Choong Y.K., Sewell P., Christopoulos C.: Accurate wire representation in numerical models for high-frequency simulation. Electronics Lett., Vol. 37, no 5, 2001, pp 280 – 282. DOI 10.1049/el:20010204

  266. Heinrich W., Jentzsch A., Richter H.: Flip-chip interconnects for frequencies up to W band. Electronics Lett., Vol. 37, no 3, 2001, pp 180 – 181. DOI 10.1049/el:20010140

  267. Gavrilakis A., Al-Asadi M.M., Duffy A.P., Willis A.J., Hodge K.G.: Method for prediction of capacitance of shielded transmission lines. Electronics Lett., Vol. 37, no 23, 2001, pp 1424 – 1425. DOI 10.1049/el:20010935

  268. Gazizov T.R.: Far-end crosstalk reduction in double-layered dielectric interconnects. IEEE Trans on EMC, Vol. 43, no 4, 2001, pp 566 – 572. DOI 10.1109/15.974636

  269. Erdin I., Nakhla M.S., Achar R.: Circuit analysis of electromagnetic radiation and field coupling effects for networks with embedded full-wave modules. IEEE Trans on EMC, Vol. 42, no 4, 2000, pp 449 – 460. DOI 10.1109/15.902314

  270. Gunupudi P.K., Nakhla M., Achar R.: Simulation of High-Speed Distributed Interconnects Using Krylov Space Techniques. IEEE Trans. on Comp Aided Design, 19(7), July 2000, pp 799 – 808. DOI 10.1109/43.851995

  271. Schuster C., Fichtner W.: Signal integrity analysis of interconnects using the FDTD method and a layer peeling technique. IEEE Trans on EMC, Vol. 42, no 2, 2000, pp 229 – 233. DOI 10.1109/15.852417

  272. Abhari R., Eleftheriades G.V., van Deventer T.E.: Equivalent circuit for multiple vias in parallel plate environment. Electronics Lett., Vol. 36, no 17, 17 Aug. 2000, pp 1446 – 1447. DOI 10.1049/el:20001036

  273. Coutant M., Chang K.: Broadband, electrically long vertical waveguide interconnect. Electronics Lett., Vol. 36, no 25, 2000, pp 2076 – 2078. DOI 10.1049/el:20001422

  274. Cappuccino G., Cocorullo G.: Time-domain macromodel for lossy VLSI interconnects. Electronics Lett., Vol. 36, no 14, 6 Jul 2000, pp 1207 – 1209. DOI 10.1049/el:20000883

  275. Woonghwan Ryu, Myung-Jin Yim, Seungyoung Ahn, Junho Lee, Woopoung Kim, Kyung-Wook Paik, Joungho Kim : High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm. IEEE Trans. on Components and Packaging Technologies, Vol. 23, no. 3, 2000, pp. 542 – 545. DOI 10.1109/6144.868855

  276. Gutmann R.J.: Advanced Silicon IC Interconnect Technology and Design: Present Trends and RF Wireless Implications. IEEE Trans on MTT, 47(6), June 1999, pp 667 – 674. DOI 10.1109/22.769333

  277. Sawdai D., Pavlidis D., Cui D.: Enhanced Transmission Line Model Structures for Accurate Resistance Evaluation of Small-Size Contacts and for More Reliable Fabrication. IEEE Trans on ED, Vol. 46, no 7, 1999, pp 1302 – 1311. DOI 10.1109/16.772468

  278. Friedman E. G.: On-Chip Interconnect Noise in Deep Submicrometer CMOS Integrated Circuits. CAS News J., no. 3, 1999, pp 16 – 30.

  279. Erdin I., Khazaka R., Nakhla M.S.: Simulation of High-Speed Interconnects in a Multi-layered Medium in the Presence of Incident Field. IEEE Trans on MTT, Vol. 46, no 12, 1998, pp 2251 – 2257. DOI 10.1109/22.739206

  280. Teal P. D., Scott N. L., Vaughan R.: Characterization of Balanced Transmission Line by Microwave Techniques. IEEE Trans on MTT, Vol. 46, no 12, 1998, pp 2148 – 2151. DOI 10.1109/22.739297

  281. Verghese N. K., Allstot D.: Computer-Aided Design Considerations for Mixed-Signal Coupling in RF Integrated Circuits. IEEE J of SSC, Vol. 33, no 3, March 1998, pp 314 – 323. DOI 10.1109/4.661197

  282. Deutsch A.: Electrical characteristics of interconnections for high- performance systems. Proc. IEEE, vol. 86, no 2, pp. 315 – 357. Feb.1998. DOI 10.1109/5.659489

  283. Neri B., Ciofi C., Datillo V.: Noise and Fluctuations in Submicrometric Al-Si Interconnect Lines. IEEE Trans. on ED, vol. 4, no. 9, Sept 1997, pp 1454 – 1459. DOI 10.1109/16.622601

  284. Ciofi C., De Marinis M., Neri B.: Ultralow-Noise PC-Based Measurement System for the Characterization of the Metallizations of Integrated Circuits. IEEE Trans. on Instr. & Meas., Vol. 46, 1997, pp 789 – 793. DOI 10.1109/19.650774

  285. Beyene W. T., J. Schutt-Aine: Accurate frequency-domain modelling and efficient simulation of high-speed packaging interconnects. IEEE Trans on MTT, vol. 45, no 10, 1997, pp. 1941 – 1947. DOI 10.1109/22.641798

  286. Zhang X.: Coupling Effects on Wire Delay. IEEE Circ.& Devices Mag., Nov 1996, pp 12 – 18. DOI 10.1109/101.544446

  287. Frankovic R., Bernstein G.H.: Electromigration Drift and Threshold in Cu Thin-Film Interconnects. IEEE Trans on ED, Vol. 43, no 12, 1996, pp 2233 – 2239. DOI 10.1109/16.544396

  288. Stan M.R., P. B. Wayne: Bus-Invert Coding for Low-power I/O. IEEE Trans. on VLSI Syst., Vol. 3, March 1995, pp. 49 – 58. DOI 10.1109/92.365453

  289. Büttiker M: Capacitance, admittance, and rectification properties of small conductors. J. Phys.Condens. Matter, Vol. 5, 1993, pp 9361 – 9378. DOI 10.1088/0953-8984/5/50/017

  290. Wang Z., Wu Q.: A Two-Dimensional Resistance Simulator Using the Boundary Element Method. IEEE Trans on CAD, Vol 11, no 4, 1992, pp 497 – 504. DOI 10.1109/43.125097

  291. Cooke B., Prince J., Cangellaris A.: S-Parameter Analysis of Multiconductor, Integrated Circuit Interconnect Systems. IEEE Trans on CAD, Vol 11, no 3, March 1992, pp 353 – 360. DOI 10.1109/43.124422

  292. Matthaei G., Chinn G., Plott C., Dagli N.: A Simplified Means for Computation of Interconnect Distributed Capacitances and Inductances. IEEE Trans on CAD, Vol 11, no 4, April 1992, pp 513 – 523. DOI 10.1109/43.125099

  293. Wang R., 0. Wing: Transient analysis of dispersive VLSI interconnects terminated in nonlinear loads. IEEE Trans. Computer-Aided Design Integr. Circuits Syst., Vol. 11, no 10, 1992, pp. 1258 – 1277. DOI 10.1109/43.170989

  294. Rainal A. J.: Computing Inductive Noise of Chip Packages. AT&T Bell Lab. Techn. Journal, Vol. 63, no. 1, Jan. 1984, pp 177 – 195. ISSN 00058580

  295. Paul C.R.: Effects of Pigtails on Crosstalk to Braided-Shield Cables. IEEE Trans on EMC, Vol. 22, no 3, 1980, pp 161 – 172. DOI 10.1109/TEMC.1980.303876

  296. Paul C.R., Mcknight, J.W: Prediction of Crosstalk Involving Twistes Pairs of Wires-Part I: A Transmission-Line Model for Twisted Wire Pairs. IEEE Trans on EMC, Vol. 21, no 2, 1979, pp 92 – 105. DOI 10.1109/TEMC.1979.303751

  297. Paul C.R.: Prediction of Crosstalk in Ribbon Cables: Comparison of Model Predictions and Experimental Results. IEEE Trans on EMC, EMC-20(3), Aug. 1978, pp 394 – 406. DOI 10.1109/TEMC.1978.303668

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